This meeting is being recorded. For those that don't know me, my name is Ronn Bechler. I'm with Atomic Markets. A bit of housekeeping before we start. If you have a question, we'll be having a Q&A session at the end of the presentation that Coby will be giving. Please put your question in the Q&A box down the bottom, and I'll moderate the questions at the end of the presentation. I might hand the microphone across to Coby to take us through the Q1 FY 2023 update on Weebit. It's been a very busy quarter and a lot been going on. Look forward to hearing the presentation, and then we'll move on to Q&A off the back of that. Thanks, Coby. Okay. Thanks, Ronn. Yes, it has been a very busy quarter and, you know, really a lot of activity and ramping up to even more activity in the upcoming quarter. You know, last quarter, we had several key milestones. Of course, the most important one was announced recently with the qualification of our ReRAM, showing that we meet the industry standard requirements for production quality, and that's gotten very good response throughout. You know, The Selector, again, another announcement that was done recently. This is something that's happening in the background, but nevertheless, we're continuing to develop The Selector. This time, we even managed to show that we can use it in embedded applications, which is going to be another very important game changer even, I can say. We're expecting the wafers back from SkyWater now. You know, it was tape-out, and it should be back soon. We'll be doing the qualification there immediately after that. There's really good cooperation now with SkyWater. In general, there's really more and more activity going on now with partners, Tier 1 fabs, and really even more advanced than I expected in the past. You know, if you look back a year and I actually look back five years since I joined five years ago. It's really amazing to see all the stuff that we managed to do. In the last year, we announced that we reached 28 nm, and then we already are working on the 22 nm. As you know, we're planning to tape out also on 22 nm. Then, you know, the module, we showed that it was fully functional, and we did the tape out to SkyWater. Now with the two recent releases, I'm extremely proud of the progress made over this past year. Talking about qualification, it's really important to explain what qualification is and why it's so important. Qualification is a process that's defined by industry standards. You know, we took the definition of JEDEC, which is the common one for non-volatile memories. It defines, you know, a really, you know, detailed testing procedure that you need to go through now. It's, you know, you need to do three separate manufacturing lots. 3x go through manufacturing. From each one of those lots, you take different wafers. From each one of the wafers, you take random dies. Overall, it's been many hundreds of dies that we tested, and it's very rigorous testing for each one of those, going through all kinds of stress measurements. You know, the highlight is, of course, that when you put them in ovens that go up to very high temperatures and check that the chips are still working. It's really a very rigorous procedure that takes many months to complete, because of that. Once you do complete it, you have a certification. You can show the results to customers, to other fabs, to you know, partners and you can show them that, "Yeah, we passed it. All of these hundreds of chips, all of them passed it. All of them are acting the same." You know, when we do mass production, all of them will act the same. You won't have different chips doing different things or all kinds of things like that. So that's really a very important milestone. Leti, you know, some people tell me, "Oh, Leti is an R&D fab," but Leti's facilities are state-of-the-art. They are top-notch, like the most advanced fabs in the world. Not many fabs in the world, not many foundries in the world have the ability to work at 28 nm or 22 nm. I mean, I think the number is maybe a dozen at best, and Leti is one of them. So it's really an advanced facility, and these tests do impress many people. They actually enabled us to engage with much more advanced fabs. We're talking now to Tier 1 fabs, making good progress with some of them and showing the results to customers that are also impressed by the results. Really a very exciting milestone that we achieved. Now this is a milestone that you know we're immediately continuing to do qualification on even more rigorous and more extreme results. The way that you do the qualification is you start at a certain level, and then you keep pushing the limits, and you keep going to higher temperatures and more endurance. You know you just keep showing that the technology can withstand mass production at even more extreme results. We're continuing to do that work and additional qualification even as more rigorous requirements. I mentioned the selector. You know, the people that have been following Weebit know that we are working on this technology in the background. This is a technology which originally we focused on for discrete or standalone chips. You know, in the standalone world, small memory dots we call them, small memory cells are really a key requirement. You need to shrink the size of the array as much as you can. It's real estate, just like any other real estate. You want to have as much memory as you can on as small piece of silicon as you can. The selector is an enabler to that. I'm very happy that the team found a way to make this work even in embedded. We are looking at, in the future, not now, because it still isn't ready, but we will be looking at how we can use it also in embedded applications and get another advantage over competition, over other kinds of memory by shrinking the memory arrays, even in embedded applications. You know, this is looking very good, especially for applications that will need very large memories even in embedded like AI and automotive. It's really important because we also are managing to make the selector use standard materials, which is really not trivial. I'm looking forward to see additional progress on this front. SkyWater, of course, is a key activity for us. You know, we went through a long process of transferring the technology to them, doing the tape-out, and then, you know, having to wait for the wafers. The wafers are now, you know, moving very fast. I believe we'll be getting them in the near future. We should be getting them, you know, clearly before the end of the year. As soon as we get them, we'll go immediately into qualification. Qualification will move forward well, so by the beginning of next year and the first half of next year, we'll be expecting to finalize it. We're already talking to SkyWater customers. We're working with them. If some of you guys look at their website, you will see that there's a page for Weebit there, and really good cooperation going on now. In terms of the market engagement, I mentioned we have really nice results with the qualification. We've already shown intermediate results to other fabs. I think that what's really happening right now is the market is realizing that this is the time for ReRAM. You know, a year ago, two years ago, when I would talk to people, they would always say, "Oh, yeah, that future technology, that emerging technology that will be available sometime." You know, today, I think the market realizes ReRAM is here. Everyone needs it. They're asking for it. We've had more than one case where a Tier 1 fab told us they've lost a major deal with a major customer because they didn't have advanced enough non-volatile memory. They showed us the specifications and, you know, we put them next to our ReRAM and you can see the match. We've seen, especially since TSMC, which is the largest fab, announced that they have a ReRAM technology, it's really sent a shockwave, I think, through the industry. Everyone now needs to have a ReRAM technology to compete with TSMC. You know, when they look around, you know, Weebit is basically, you know, the key one that they see. We have these engagements now, and it's really exciting to talk to all of these guys and move forward. Some of them are already in different stages of evaluating the technology. I try to be cautious in my words, but it really is looking nice. That's, you know, the activity there. We're also talking to potential customers, of course, and pushing them forward in parallel. You know, there's this situation, as you guys know, this triangle between us, the customer that will want to embed our technology in their chip, and then the fab. Different customers use different fabs, and they want us to work with specific fabs and things like that. You know, we need to get these triangles formed, and there's you know, a lot of work to be done here to do that, to push that forward. There's constant progress. Of course, we've been attending a lot of conferences, both technical conferences, and you know, I've been involved in some investor conferences, and our name is really out there now. Even when you look, you know, I said the world is realizing that now is the time for ReRAM. I think nothing exemplifies it more than the report from Yole. I consider Yole the number one analyst for our market. These guys in the past were more cautious, but now you know, they basically have the embedded ReRAM market, you can see here, going from practically zero, which is today, to about $1 billion in just a few years. I think that you know, I can sense that this is what the market wants. This is the direction to the market. I clearly see the demand here and you know, over the next few years, as we roll the technology out to more fabs and engage with more customers. There's the famous book about the tipping point, and you get to that point where you have several new customers, they're having good results, and then suddenly, you know, that whole thing tips over and you know, you have the flood coming. I'm looking forward to that. Basically, you know, looking forward and you know, I'm looking at what are our goals. You know, we need to look forward further than just another month or two, and so we're looking at the targets until the middle of next year. Of course, you know, I mentioned we need to conclude the qualification of the embedded ReRAM at SkyWater. That's going to be a key activity. We'll get the wafers, and we'll start the qualification. You know, we're having. We're making good progress with Tier 1 fabs. I really set the goal for the team that we need to have, you know, a big advanced fab already licensing our technology by the middle of next year. Of course, with customers, we're continuing the work. You know, we said we'll close customer agreements, and we are working on it very strongly to push that forward. I want to see more of this activity and seeing actual customers signing licensing agreements. I was talking about continuing the qualification, and we do plan to continue qualification, take it to more and more extreme levels to show, you know, real superiority. By the way, today our qualification already shows that we are better than Flash, and you know, moving forward, we want to show real superiority in this domain and you know, very strong results. You know, scaling to 22 nm, and we're actually already working on even below 22 nm. You know, I mentioned people don't understand these numbers. 22 nm, there's you know, a dozen at most, I think, fabs that are capable of working at 22 nm. You go down below that, and it's even, you know, it even becomes more extreme. You know, we're pushing it. We're pushing the limits there. We want to get to the places where the most advanced designs are and you know, including AI and automotive and all the really advanced things. There's really a lot of work going on there. Continued R&D. You know, that's the heart of it all, pushing the technology further, making the ReRAM cell smaller, making the ReRAM cell more advanced. A lot of work. We have an amazing team, and I'm really excited about all this. I think that's. You know, we can stop here and open the floor to questions. Thanks, Coby. A lot going on over the last quarter, and obviously a busy run into the end of FY 2023. Got a bunch of questions that have come in, and we'll try and cover as many as we can in the time allotted. Just to remind everybody, if you'd like to ask a question, please type it in the Q&A box. We've got too many participants on the line to try and open up people's windows to ask questions. Maybe if we turn to, first of all, that slide that you like referencing, slide 8, which is the Yole market share slide. Can you just talk through, y ou said ReRAM is expected market share of 33% of that $957 million annual market size. We got a question asking what's the corresponding 67%. By the way, it wasn't Weebit market share. Yole was looking at the total market for emerging non-volatile memories. The two leading technologies are MRAM and ReRAM, MRAM being Magnetic RAM. MRAM has been in the market already for some time. It's actually out in the market first. There are companies now that are commercially selling MRAM. Yole has looked at it and estimates that MRAM will have 2/3 of the market and ReRAM will have 1/3. What you saw on that slide is the ReRAM part of it. I personally can tell you that as we talk more and more to fabs and to customers that are already using MRAM, we're getting, you know, a very clear message I can say, that people are not happy with MRAM. MRAM is way too complex to manufacture. It is non-standard in its extremity. You cannot manufacture MRAM inside the fab. You need to have a separate facility for it. The magnetic material is a terrible contaminant in the fab. You know, we're getting the indications. By the way, you have so many layers there and everything. MRAM adds about 30%-40% to the wafer cost. We add about 5%-7% to the wafer cost. You can understand, just commercially, when people will get to it, we don't require new tools and new materials like MRAM requires. We're much simpler and easier, cost-effective. I believe that 2/3 MRAM, 1/3 ReRAM will actually change to the ReRAM side, and we'll see a much stronger ReRAM side once Weebit is really in mass production. I think the point to make also is the market opportunity is so large that there won't be one specific winner, that it doesn't really matter. The opportunity is so large that, you know, even just, you know, a 10% or 20% share of the market is still massive. You don't need to have 50% share to be, you know, happy with the outcome for the company. As Yole wrote there, 33% is $1 billion, which is a pretty nice growth rate already. It's very hard to grow faster than that. Anyway, it doesn't stop there. It keeps growing. The market is huge. We're talking about both MRAM and ReRAM growing rapidly. We've got a few questions around nodes, sizes and qualifications and so on, but maybe just a question for those that are slightly newer on this webinar. Can you just outline what exactly is qualification and why is it so important to a company like Weebit? Okay. So first of all, we use the terms, and I apologize, you know, in the industry, there are a few terms which are used interchangeably quite a bit. You know, nodes, geometries, nanometers, they all refer to the same thing. When I say a small geometry, I'm talking about something that is smaller than 22 nm. You know, similarly, when I say small nodes, I try not to use the term node, just to confuse people less. As I mentioned, the market has been going down steadily. There's Moore's Law, for those who know it. Everything has been shrinking. A month ago, I saw an announcement that Samsung is planning by 2027 to be manufacturing at 1.4 nm. That's just like I. It's not understandable at all. I mean, I just can't understand how they can do that, but you know, the market keeps shrinking. The number of companies that can really work in these small geometries, as I mentioned, is very, very small. It's really a challenge. We're, you know, we're pushing forward. You asked about qualification, and as I explained, it really is the best indication the market can get that we're ready for mass production. By the way, I had people say, "Wait a minute, what do you mean that Weebit is the only one out there now?" You know, I may be talking a little bit about the competitive landscape. You know, just a few years ago, there were really four smaller companies that were focused on ReRAM. You know, Crossbar was maybe the leading one. They were already working with production fabs, et cetera, but the problem was that they were using non-standard materials. They raised, you know, close to $150 million, but at the end of the day, they didn't manage to get it working and some Chinese firm took over and, you know, we don't see them in the market anymore. There was another company called Adesto that was acquired by Dialog. Adesto had several products, Dialog acquired them, and then Dialog was acquired by a big Japanese company called Renesas. Renesas doesn't have any focus on memory or anything, so the ReRAM technology there has kind of been put aside. Weebit now is really the leading player in the market. We're very happy that, you know, the spotlight is on us. The qualification results show that we've passed where the others were, and now we're in a good position, ready to go and doing this move to the commercialization. Thanks, Coby. Just to confirm, the qualification that was recently announced, what node was that done at? That was on the 130 nm technology from CEA-Leti. Those are the wafers that we did. If you remember, a year ago we manufactured wafers for 130 nm, the modules, and that's what we tested. The 130 nm is what SkyWater is starting with as well? The SkyWater manufacturing is also at 130 nm, so we'll be qualifying there. We are taping out soon at 22 nm and we'll, you know, of course, we'll have to wait until those wafers will get out of the fab, but once they'll get out of the fab, we'll be starting to qualify those and that's already going to be a much more advanced one. Yeah. That was done, you mentioned, in CEA-Leti's fab. No, qualification is done in special labs. Actually, most of the qualification was done in our lab. We set up a lab in our office. A lot of it was done in our lab, and then we worked with specialized labs that have the specialized ovens and everything to do that work. Qualification was actually done by Weebit's team in Israel mostly. You mentioned the plans to tape out at 22 nm. Will that be done within CEA-Leti's fab, or will some other fab be involved? No, that's with one of the Tier 1 fabs. That's going to be done at a fab with one of the big fabs. Okay. You mentioned Tier 1 and Tier 2 fabs that the company's talking to. Are the Tier 1 and the Tier 2 looking at different node sizes in terms of what they're wanting from Weebit o r it's just they're not so worried about 130 nm or 22 nm? Like, how are they thinking about it in terms of their engagement with you? Normally, when we talk about Tier 1, we're talking about the ones that are going below 28 nm. You know, going to 28 nm and below, that requires huge investments, you know, tens of billions of dollars, and even more. That requires, you know, really mass production to justify all those costs. Some of the Tier 1 fabs also work at large geometries. Some of them work at 180 nm and even beyond 180 nm, 130 nm, etc. Some of them also really have a big focus on just the smaller geometries. It's kind of across the board. The key element here is when you go below 28 nm, you need to have very, very deep pockets and you know really mass production. We've got some questions that came in from people that weren't able to be on this, but they've emailed it through. Looking at embedded and discrete, there's a question around what prospects are there for moving discrete, as in standalone technology, forward now that the selector has been tested, and what do you need to do in development for it? The selector technology, I mentioned it when we started working on it. It's a very, very complex technology. We're going through different stages of development, and there still is more work to be done there. I don't want to confuse people. You know, we went through a certain important milestone, but there still is. In order to get the selector technology to the point where it can be qualified, we still have a lot of work to do. When you think about sales avenues outside of embedded, that's further down the track as well. Yeah. I think I always said the near- term low-hanging fruit is embedded. That is my big focus. That is where the initial revenue will come from, and we're focused on that. The discrete is a big market, but it requires the selector, and that's going to be the midterm. You know, I always said the longer- term will be neuromorphic. That's kind of that hasn't changed. We're very focused right now on getting revenues from the embedded and the selector technology in the discrete is continuing in the background. We've had a couple of questions around some of the previous conversations on partnerships and letters of intent and so on that we talked about in terms of the Indian Institute of Technology Delhi on the neuromorphic project, XTX, SiEn. Can you give us an update on how those various collaborations are progressing? I think I'll break that question into two questions. You know, the IIT Delhi and also Politecnico di Milano and other research institutes and the Technion in Israel, those are institutes, those are research institutes that we're working with them on the neuromorphic technology and processing-in-memory and other advanced technologies. That's going very well. Every once in a while, we announce a paper. Actually, with IIT Delhi, I think there was a paper in a conference just a month or two months ago. That's progressing very nicely. China is a very good question, and I think it's a question that should be answered on its own. I think everyone here is aware of what's happening in China with the geopolitical tensions between the U.S. and China. I will add that, you know, during the corona period, it was very, very difficult to work with China. You couldn't travel to China. Communication was more difficult. You know, both of those things have pushed us. I mean, we managed to get an agreement with SkyWater, and that was a key step forward. Y ou know, we're now in discussions with many, I guess I can call it Western, foundries, Western customers. You know, that market is huge. And right now we're focused on that. I'm looking for ways to lower the risk for Weebit, and I'm sensing that it is lower risk and higher potential for us to focus on U.S., Europe, Western world. You know, it's not like we totally cut off our ties in China. We're clearly not pushing strongly there. By the way, you still can't travel to China, so I guess I'm very happy with where we are today. It gave us a huge push with the big fabs in the Western world. Cyber threats and cyber risks have become quite topical here in Australia off the back of some recent news flow. Can you outline to us how Weebit's memory technology helps improve cybersecurity? There are actually several ways. The ReRAM technology, first of all, many of the cyber applications are such that, you know, require AI and so on, and they want to go down to the small geometries. They go down to 22 nm, 16 nm, 12 nm, and even smaller than that. As I mentioned many times, Flash does not scale to those geometries. It gets stuck at 40 nm, you know, 28 nm if you really push it, and it's not economical already. What they need to do is they have to have a separate chip for non-volatile memory that's kind of, you know, glued on to the main chip and so on. The mere fact that you have separate chips opens, you know, a communication line between those chips to eavesdropping. That's one area of concern of people. In embedded ReRAM, you don't have that. We are embedded in the chip. We're an integral part of the chip. That's one of the advantages that we have. Weebit is also. I mean, our technology is immune to interferences. You know, I mentioned MRAM before, and one of the concerns about MRAM is that because it's magnetic, if you go near a strong magnetic field, you know, things can be erased or things can be altered. You know, if people are smart enough, they'll find ways to do it even in other ways. ReRAM is inherently immune to radiation, which is another point. We have several advantages in the security space and some security companies are actually looking at that. Keeping it sort of the high level, and we've talked about cyber risk, what about quantum computing? Do our chips have a role in quantum computing? Our memory technology, sorry, not our chips. Our memory. Yeah. Because there's also the embedded. Quantum computing is very exciting, but at this point, at least, it's a different kind of technology, and we don't really have a role to play there in quantum computing. We're looking at it out of personal curiosity, but that's not where Weebit is heading now. If we think about, you had that slide at the end about, you know, key milestones to deliver over the remainder of FY 2023. Got a question that's come in that's asked, "What other technology developments are we expecting? For example, qualifications at higher standards, smaller nodes." Can you give a bit of a sense of how you're thinking about where you want to take the technology over the remainder of this financial year? We're constantly pushing the envelope, and also. There are two directions. First of all, just pushing the envelope, and second, taking what we have and making it robust so that it can go to mass production. Those are two parallel activities that we're working on. I talked about qualification. You know, at this point, the qualification was done at what's called industrial grade. We're now starting qualification for automotive grade. For more advanced, you know, the requirements in terms of temperatures, endurance, et cetera, are more extreme. We'll be pushing that. You know, there are multiple grades of qualification that you can get to. We're confident that we can go, you know, several grades forward already. We have very high confidence that we can achieve those. You know, the question is how far, and that's where the other activity comes in of making the technology more robust. You know, without going into the technical details. The memory at the end is chemistry, and you know, you have atoms and all of that in there. When you write a one or you write a zero into the memory, it's not digital, it's analog. You want to make sure that the differentiation between a zero and a one is strong enough and wide enough so that it's very obvious, and then you can do a lot more things. We're constantly pushing to make, you know, the zero and the one more distinct, you know, a wider gap between them, which will enable us to move forward to more extreme qualification levels and so on. There's really a lot of work on all of that, just making the technology more robust and, you know, that's something that's never ending, by the way. That's something that it won't end in five years or in, I don't know what. You have to keep constantly pushing the technology to give better and better and better results because that's what the market wants. In addition, as I said, we're working now. There's a big focus on the 22 nm. We're already analyzing geometries which are lower than that and working with some of the Tier 1 fabs on looking at how we can go down to smaller geometries, and we'll be pushing in that direction. The whole market is pushing in that direction. A lot of very interesting work. You mentioned some of the low-hanging fruit and the focus on embedded. Got a question that's come in on the embedded selector. Can you explain what types of markets it will excel in, and if the embedded selector can actually create whole new markets and products? An embedded selector has several really important advantages. The most important one, of course, is just size. The selector enables you to build a much larger array on a much smaller piece of silicon. In other words, on the same piece of silicon, you can put a lot more memory, which is actually what most people are looking for. AI is the type of application that no matter how much memory you give them, they always want more. If we, on the same piece of silicon that they have reserved for memory, can give them more memory, this is huge for them. That is a very big advantage. We're looking at that. Another thing which is, you know, really further out, but something that we are looking at, once you start using the selector, you can actually start thinking of three-dimensional. You know, people here have heard in the past that there's 3D NAND, and the way that Flash is dealing with the fact that it can't shrink is it's going up now. They're building skyscrapers of memory, and on the same piece of silicon, they have more and more memory just because they pack it in piles. We actually, with a selector, we will potentially be able to do the same thing and start going three-dimensional. Those are further away milestones. It's not something that will happen tomorrow. I don't want anyone to misunderstand me. Getting the selector to work embedded. Once it works and it's ready for mass production, and then getting it into the embedded will make us much more competitive because we'll be able to have much more memory on the same piece of silicon and potentially even go three-dimensional at a certain point. We have a question that's come in, and I'll state the question, but I'll then rephrase it because it's a bit hard to actually answer. The question is, if everything goes according to plan, when do you estimate mass production will occur? Because ultimately you don't know what's going to plan because we gave an indication of, you know, timeframes and what you want to do by the end of FY 2023 in terms of signing up a new fab or a new customer. Let's just say Weebit announces that a new fab or a new customer has been signed up, sort of roughly, what's the sort of timeframe between that and actually having mass production start? First of all, you know, the first answer is, with SkyWater, we are moving forward and we're expecting the wafers, and then we'll do qualification. You know, we still need to see how much time exactly that qualification will take. It's you know order of magnitude of a few months that we'll do it. We already did qualification once. By the way, that's another advantage of the fact that we did qualification on the Leti wafers. We kind of now have that experience and we know what we need to do with SkyWater. We're hoping to have that qualification done even a little bit faster. Once we're qualified, we can go into mass production. The other side of the story, I always talk about this triangle, you know, you have the fab, and the fab needs to be ready, but then you need the customers and the customers to come on board. The customers today, especially, you know, the atmosphere in the semiconductor space is, you know, it's a little reserved, I would say. You know, whoever's been following the semiconductor market, the big players have had challenges in share prices and everything. There is even more hesitancy than normal. You know, we are moving forward with them. We are making progress. We're now working with SkyWater, talking to several of their customers about adopting our technology. Those customers, once they embed the technology into their design. Now they need to design their product with our memory in it and get it ready for tape-out, and that takes several months. That can take a year, depending on the design. They go to mass production. That's kind of the order of magnitude to give you the feeling with SkyWater. You can follow the process we did with SkyWater since we signed the agreement and so on. With the larger fabs, I expect things to go faster, transferring the technology, getting things done, not orders of magnitude faster, but clearly both we have more experience and the larger fabs have more resources to put on it and push things faster. The answer is, it's a ramp-up to get to mass production. You need to close an agreement with the fab, transfer the technology, which you know, as you guys know, can take a few months. You do the tape-out, you wait for the wafers, and you get it back, you do the qualification. In parallel, you work with customers. As we move forward, we'll be able to bring more and more customers on board in parallel to the technology transfer, and get things moving faster. In terms of the FY 2023 goals that you've set out today, what are the biggest challenges in the company's ability to achieve those aspirations or those goals for FY 2023? Time. Which if everything takes long and I'm a very impatient person, so this drives me nuts. It's, you know, I don't know what I'm doing in semiconductors, but that's the way it works. In semiconductors, you know, you send wafers for manufacturing. You just have to sit there for many months. If, you know, if they rush them through, the fab and everything, you know, you can get it in, you know, maybe a little bit faster. No matter how you look at it's, you know, it takes a lot of time. I think one of the key things is things just take time. We're also in a period where the customers, because of what's happening in the marketplace, you know, and we're hearing about companies, you know, that their results, as semiconductor companies are looking at their results and everything. You know, if normally they're very cautious now. There's a little more of that obstacle to overcome. We're pushing it. I know we'll make it. I don't have doubts that we'll get those customers on board, and we will get those fabs. You know, it's maybe a little bit more of a challenge, but we're making good progress with them. We have very exciting talks with some of them. It's going to be, you know, for me it's really a very exciting period right now. Maybe on that note, because we've hit 45 minutes and we're running out of time, we might wrap up this Meet the CEO interview. There's obviously going to be a lot of opportunities for people to meet with you, ask you questions face- to- face in a couple of weeks time when you come out to Australia. Just for those online- Looking forward to it. We're looking forward to it too. It's been almost three years, Coby. We've got you in Sydney on Monday, Tuesday, Wednesday, which is the 14th to the 16th of November. I'm just checking the dates now [to the November 16th]. Melbourne on the 17th and 18th of November, and then Perth on the 21st of November. There's a series of events both in Melbourne, Sydney and Perth for a group briefing for investors. I think, Coby, you're obviously presenting at Tech Ops this week and potentially another conference while you're out here. We're just waiting on confirmation. There's a lot of activities going on in the AGM. We'd certainly encourage shareholders or potential shareholders to take advantage of Coby and David Perlmutter, the Chairman, will be out at the same time in a couple of weeks to meet with them face to face, come to the briefings and hear more about Weebit, the technology and the growth opportunities that lie ahead. Coby, maybe just on that note, if you'd like to just wrap up and leave us with a thought before we finish up today. Great. Yeah. As I said, it's very exciting times for Weebit. You guys have seen. We have several key milestones ahead of us with, you know, waiting for the SkyWater wafers, with tape-out to 22 nm, you know, there's more activity, of course, the customer activity and everything. Really exciting times. For me, it's very exciting to come back to Australia after, you know, it's almost three years now. It's getting close to three years. You know, I really miss it. I really look forward to meeting people face to face. I would love to have all of you guys come to these briefings and meet you in person. Dadi will be with me, which is also, I think, an important point. Together, we'll be able to answer your questions. Looking forward to it. Coby, thank you very much. To everyone online, thank you for joining us this afternoon. Have a great rest of day, and hopefully we'll see you all when Coby and Dadi are out here in a couple of weeks time. Thank you. Great. Thank you. Bye.