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Dr. Felix Grawert, CEO Dr. Christian Danninger, CFO July 30th, 2026 H1/2026 Investor Presentation
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1 Forward-Looking Statements This document may contain forward-looking statements regarding the business, results of operations, financial condition and earnings outlook of AIXTRON. These statements may be identified by words such as “may”, “will”, “expect”, “anticipate”, “contemplate”, “intend”, “plan”, “believe”, “continue” and “estimate” and variations of such words or similar expressions. These forward-looking statements are based on the current assessments, expectations and assumptions of the executive board of AIXTRON, of which many are beyond control of AIXTRON, based on information available at the date hereof and subject to risks and uncertainties. You should not place undue reliance on these forward-looking statements. Should these risks or uncertainties materialize or should underlying expectations not occur or assumptions prove incorrect, actual results, performance or achievements of AIXTRON may materially vary from those described explicitly or implicitly in the relevant forward-looking statement. This could result from a variety of factors, such as those discussed by AIXTRON in public reports and statements, including but not limited those reported in the chapter “Risk Report”. AIXTRON undertakes no obligation to revise or update any forward-looking statements as a result of new information, future events or otherwise, unless expressly required to do so by law. Due to rounding, numbers presented throughout this report may not add up precisely to the totals indicated and percentages may not precisely reflect the absolute figures for the same reason. Our registered trademarks: AIXACT®, AIX-Multi-Ject®, AIXTRON®, Close Coupled Showerhead®, EXP®, EPISON®, Gas Foil Rotation®, HXP®, HYPERION®, Multi-Ject®, Planetary Reactor®, PVPD®, STExS®, TriJet®
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2 H1/2026 Key highlights Q2/2026 results: order intake up 81% yoy, driven by optoelectronics ▪ Order Intake of EUR 215m, reflecting exceptionally strong optoelectronics demand and high multi-tool order activity, extending visibility well beyond FY/2026 (Q2/2025: EUR 119m) ▪ Revenues of EUR 115m reflecting ramp of photonics business ▪ Gross Profit at EUR 47m; Gross Margin at 41%; impacted by ▪ EBIT at EUR 15m; EBIT Margin at 13% low volume Strong cash generation ▪ Free cash flow of EUR 162m in H1, up EUR 91m yoy, mainly driven by higher customer advance payments ▪ Net financial assets increased to EUR 467m, supported by strong free cash flow and the net effect of the convertible bond Operation: output growth every quarter of the year ▪ Production ramp of optoelectronics business since late Q1 ▪ Further increase of shipments in Q3 and additional growth in Q4/2026 ▪ Construction of new production facility in Malaysia started Raised FY/2026 guidance1 confirmed ▪ Revenues FY/26E: EUR 560m ± 30m ▪ Gross Margin FY/26E: around 42% incl. mid-single-digit EUR million expense ▪ EBIT Margin FY/26E: 17% – 20% for personnel reduction in operations area in Q1 Q3/2026 guidance1 ▪ Revenues Q3/26E: EUR 180m ± 20m 1 FY/26 Based on $1.20/€ Budget Rate
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Market & Business Development ▪ Optoelectronics ▪ Overall continued strong momentum beyond 2026 ▪ Opto accounting fo r about 75% of Q2/2026 equipment order intake , underlining the continued strong market momentum ▪ Major shipments are scheduled from H2/2026 onward ▪ LED / Micro LED tool demand remained soft ▪ SiC & GaN power electronics soft in H1/2026 ▪ Utilization rates at customers gradually increasing ▪ Inflection point toward a market recovery not yet visible 3 H1/2026 Market & business development
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Annual Revenues by Application 4 EUR million 429 463 630 633 557 Optoelectronics and Communication¹LED incl. Micro LED GaN-Power SiC-Power Other incl. R&D After Sales FY26 Guidance low end FY26 Guidance high end 2021 2022 2023 2024 2025 2026 1 Includes applications in Consumer Optoelectronics, Solar and Telecom/Datacom 560 ± 30e Q3/26- Q4/26e H1/2026
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5 Q2/26 EUR 115m -16% YoY EUR 174m -30% YoY Gross Profit EBIT EUR 47m -16% YoY EUR 58m -36% YoY EUR 15m -38% YoY EUR -8m n.m.* YoY 41% 33% Margin 13% -4% Margin Revenues H1/2026 – Highlights | Key P&L Indicators ▪ H1 gross profit and EBIT were impacted by the low revenue volume and one-off expenses in the mid-single-digit EUR million range related to the personnel reduction implemented in the operations area ▪ H1 Opex slightly up yoy, mainly reflecting a ~30% increase in R&D expenses * not meaningful H1/26
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H1/2026 – Highlights | Key Balance Sheet & Cash Flow Indicators 6 1 Working Capital = Inventories + Trade Receivables - Trade Payables - Contract Liabilities for Advance Payments; FX-effects excluded in illustrated Change in Working Capital 2 Including other current financial assets minus financial liability of convertible bond ▪ Operating cash flow mainly due to higher customer advance payments, due to strong orders and backlog, a favorable order composition and individually agreed payment terms ▪ Advance payments support the upcoming production ramp ▪ Increase in net financial assets driven by EUR 162m free cash flow and the net effect of the convertible bond, partly offset by the EUR 17m dividend payment Q2/26 FY/24 € 446.9 m € +93.9 vs. Q4/23 EUR +69m YoY € +73.5 m YoY EUR 114m EUR +72m YoY € -72.4 m € +37.2 m YoY € 64.6 m € -117.1 m vs. Q4/23 EUR 152m EUR -110m vs. Q1/26 EUR 467m EUR +194m vs. Q1/26 EUR 119m € 26.2 m Working Capital1 Operating Cash Flow Free Cash Flow Net Financial Assets2 H1/26 EUR 152m EUR -186m vs. Q4/25 EUR 173m EUR +88m YoY EUR 162m EUR +91m YoY EUR 467m EUR +242m vs. Q4/25
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We address a comprehensive set of growth applications with our G10 family of products 7 Optoelectronics / LEDs SiC Power ▪ EV main inverters and EV OBCs ▪ EV charging infrastructure ▪ Data centers: AC/DC ▪ Wind & PV ▪ Traction & large drives Micro LEDs / Specialty LEDs ▪ Industrial displays (in/outdoor) ▪ TVs ▪ Smart watches / AR glasses ▪ Automotive ▪ Horticulture GaN Power & RF ▪ Fast charging / mobile devices ▪ Data centers: AC/DC & DC/DC ▪ Motor drives, e.g. white goods ▪ AI power delivery ▪ EV OBCs ▪ Base stations Lasers ▪ Optical data communication ▪ 3D sensing ▪ LiDAR ▪ Industrial power lasers Power Electronics GaNSiC GaN AsP AsP
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Optoelectronics – momentum in laser market continues to be strong 8 ▪ G10 AsP recognized as tool of record by leading customers – further engagements progressing with additional prospects. ▪ Demand for InP-based edge-emitting lasers remained robust, driven by AI and datacenter applications ▪ PICs applications driving the number of orders: ▪ Multiple photonic components are integrated on a single chip, enabling faster, energy-efficient data transmission using light. ▪ Transition from 75/100mm to 150mm wafer size is needed to leverage advanced processing of epiwafers ▪ G10-AsP “in-situ clean“ is ideally suited to multi-step processes of PIC devices ▪ Applications: AI, data center, 5G, LiDAR and quantum computing. G10-AsP Platform: Securing top-tier engagements G10-AsP: Tool of record
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9 AI data centers are accelerating the transition from copper to optical interconnects The current demand cycle remains at an early stage and is expected to extend beyond 2026 9 Hyperscaler AI CapEx 2024–2026 (USD Billions, estimated) AI infrastructure is the #1 demand driver for everything downstream: compute, networking, optics, lasers, and epitaxy equipment. Sources: CNBC, Introl Blog, MarketWise – Feb/Mar 2026 Hyperscaler capex has quadrupled since GPT-4's release | Epoch AI Optical Interconnects replace Cu wiring in Datacenter • Modern AI GPU clusters (NVIDIA Blackwell GB200 NVL72 and beyond) demand high optical interconnect bandwidth. • Each rack needs thousands of high-speed optical links. The trend is expected to continue until 2030 and beyond
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Demand in the InP datacom market is growing rapidly across three areas Layer What It Means Copper → Optics Transition SCALE-UP Connecting GPUs/XPUs within and across racks at full native speed (e.g., NVLink 5/6/7) Today: 0% optics From 2027/2028: optics between GPUs/XPUs SCALE-OUT Connecting compute rack to other racks within the datacenters Already using optics today (800G/1.6T transceivers). Growing with compute build-out SCALE- ACROSS Connecting data centers to each other and to the internet (coherent long-haul) Upside scenario that can be accelerated with inference needs Every expansion in AI compute requires a proportional increase in data interconnects, while changes in network architecture can drive non-linear growth in connectivity requirements.
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S t r e n g t h e n i n g l o n g - t e r m m a n u f a c t u r i n g f l e x i b i l i t y a n d resilience ▪ Expansion of global production and supply chain footprint through a new facility in Penang, Malaysia ▪ Leverages Southeast Asia’s strong semiconductor equipment ecosystem to support AIXTRON’s growth ▪ Approx. EUR 40 million investment in 2026–2027 ▪ P h a s e d p r o d u c t i o n r a m p - u p , w i t h f i r s t s y s t e m deliveries expected by end of 2027 11 New site in Malaysia – project fully on track Q2/2026 Q3/2027 2028 onwards Start of Operations Production, Engineering, ServiceStart of Construction AIXTRON Penang
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12 1: At $1.20/€ Budget Rate for 2026; please refer to the “Expected earnings and financial position” in the AIXTRON 2025 Annual Report Guidance1 Revenues Gross Margin (%) EBIT Margin (%) Revenue Guidance FY/2026 EUR million EUR million EUR 560m ± 30m around 42% 17% to 20% ~300 ~100 Guidance for Q3/2026 and FY/2026 ~370 ~80 H1/26 Revenues Q3-Q4/26e from After Sales Q3-Q4/26e from Equipment Order Backlog Q3-Q4/26e from New Orders ~55 ~95 +/- 30 FY/20261Q3/20261 EUR 180m ± 20m ~235 ~175
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Financial Calendar & Contact Data 13 For further information please contact: Christian Ludwig VP Investor Relations +49 (2407) 9030-444 c.ludwig@aixtron.com Q2/26 Results, Conference Call Q3/26 Results, Conference Call Our Financial Calendar: AIXTRON SE Investor Relations & Corporate Communications Dornkaulstr. 2 52134 Herzogenrath Germany E-Mail: invest@aixtron.com For Dial-in Data, please refer to our website: www.aixtron.com/en/investors/events/conference-calls Conferences & Roadshows: Jefferies 2026 Semi Conf., Chicago BNP Roadshow New York Oddo/Commerzbank Conf., FFM dbAccess TMT Conf., London BNP Roadshow Paris Berenberg and Goldman Sachs Conf, Munich Baader Investment Conf., Munich DZ Bank Equity Conf., FFM Eigenkapitalforum, FFM 24 – 26 Aug 27 Aug 02 Sep 03 Sep 08 Sep 21 – 22 Sep 23 Sep 17 Nov 23 – 25 Nov 30 Jul. 2026 29 Oct. 2026 Ralf Penner Senior IR Manager +49 (2407) 9030-6153 r.penner@aixtron.com
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Backup
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384 289 308 285 287 258 359 457 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 156 227 113 137 120 187 59 115 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 2026 24 Months Business Development 15 Order Intake (incl. equipment & after sales)1 Revenues (incl. equipment & after sales)2 143 157 132 119 124 170 171 215 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Order Backlog (equipment only)1 1 USD order intake and backlog were recorded at the prevailing budget rate (FY/2024: $1.15/€; 2025: $1.10/€) 2 USD revenues were converted at the actual period average FX rate (2024: $1.09/€; 2025: $1.12/€; 2026: $1.18/€) @ $1.15 @ $1.20 2025 20262024 @ $1.09 @ $1.12 @ 1.18 2024 2025 @ $1.10 @ $1.20 @ $1.15 2026 2024 2025 EUR million @ $1.10
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H1/2026 Revenue Analysis1 16 Regional SplitEquipment & After Sales End Application (equipment only) 70% 30% Equipment After Sales 58% 22% 20% Asia Europe Americas 54% 23% 16% 6%2% Optoelectronics & Communications² LED incl. Micro LED GaN-Power SiC-Power Other incl. R&D 1 Rounded figures; may not add up 2 includes applications in Consumer Optoelectronics, Solar and Telecom/Datacom
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Demand Drivers on Order Intake per Quarter (Equipment Only) 17 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200 GaN Power, Lasers, ROY & Micro LEDs SiC Power 2025202420232022 2026 EUR million Equipment Demand 2021 SiC & GaN Power & Micro LED SiC & GaN Power Optoelectronics Optoelectronics Optoelectronics
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18 What We Do – deposition equipment for compound semiconductors Wafer making Deposition Lithography Etch Planarization Assembly / Test Packaging Multiple steps Focused Business Model ▪ AIXTRON is the leading supplier of deposition equipment to the compound semiconductor industry ▪ (MO)CVD: The tools run a (Metal-Organic) Chemical Vapor Deposition process for deposition of compound semiconductors ▪ Competitive strength comes from strong focus and clear technology / market leadership in fast growing segments of the market
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19 Our growth is driven by megatrends that will continue through the cycle 19 Electrification of everything AI and data Digitization & communication IoT and intelligent devices G10-SiC G10-GaN G10-AsP 21 3 4 Energy efficiency
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SiC power – positioned to outgrow the market through market-share gains 20 Update ▪ AIXTRON maintains a strong (leading) position in SiC power segments ▪ 2026: Continued Market slowdown and underutilization ▪ Mid-term (2027-2029): ▪ OEMs switching from 400V to 800V battery systems using SiC will increase demand ▪ B e n e f i t s f r o m t h e s h i f t t o w a r d A I - p o w e r e d architectures (800V HVDC) ▪ Qualification efforts at further customers are ongoing, expect to benefit over-proportionally when the market picks up again ▪ ~doubling of annual tool demand by 2029 due to ▪ Continued EV ramps ▪ Market share gains of SiC vs. silicon due to rapidly declining prices of SiC wafers G10-SiC tool
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GaN power – acceleration of growth due to additional demand from AI 21 ▪ AIXTRON maintains a leading position in GaN power segments ▪ 2026: Slight decline in 2026 as GaN adoption across a broader range of applications is slower than expected ▪ Launch of 300mm technology in 2026 ▪ Co-existence of 200mm and 300mm wafer sizes expected ▪ Mid-term (2028-2030): accelerated (~3x) growth of annual tool demand due to ▪ GaN penetrating more and more applications ▪ GaN replacing silicon (energy efficiency) ▪ AI power delivery G10-GaN tool Update
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GaN power – growth is fueled by adding more and more applications 22 500-700 V ≥ 1200 V< 200 V Voltage Time of market adoption2020 – 2023 2024 – 2026 2027 – 2028 Smartphone fast chargers AC/DC for datacenters HV motor drives, home appliances LV motor drives Time of Flight / Lidar EV On-Board Charger (OBC) Wireless charging AI power delivery Solar Micro-Inverters DC/DC for datacenters Class-D audio Battery tools, battery consumer devices (e-bikes, …) Industrial PSU Low speed electric vehicles EV main Inverter AI power delivery
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GaN power – selected case examples 23 Design more efficient, compact motor systems with the DRV7308 GaN IPM | Video | TI.com Battery tools and consumer devices ▪ Longer battery life ▪ Smaller size and reduced weight b/c less cooling AI „On Board“ power delivery ▪ Replacement of silicon power chips around the GPUs ▪ Up to 50% lower power loss in a compact form factor HV motor drives, home appliances ▪ Up to 40% energy consumption reduction ▪ Ramp from 2025 onwards ▪ High unit volume, large dies --> high wafer consumption
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GaN power – selected case examples 24Source: AIXTRON, measurement RWTH Aachen 24 ▪ >= 1200V breakdown for GaN devices demonstrated, achieving key parameters required for HVM ▪ Multiple companies with 650V or 1200V prototypes in the roadmaps for traction inverters ▪ Potential for cost reduction in main inverter ▪ Test at several OEMs ongoing Status of GaN for EV main inverters GaN achieves > 1200V breakdown voltage 3-Phase traction inverter powered by GaN devices
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GaN power – AIXTRON leads the market in 200mm today and is ready for 300mm ramp 25 G10-GaN 200mm GaN multi-wafer tool ▪ Leading platform for 150mm / 200mm wafer size ▪ Based on 20+ years GaN experience ▪ Used by all key GaN-players worldwide today (tool of record) Hyperion 300mm GaN single-wafer tool ▪ Key ingredients from 200mm technology transferred to 300mm ▪ Builds on prior experience in GaN ▪ Experience gained from today’s installed base ▪ 300mm showerhead technology (30+ years) ▪ Technological outperformance vs. 200mm platform recently confirmed by a leading customer
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26 NVIDIA – HVDC Architecture combines SiC and GaN devices Source: NVIDIA Source: Navitas Source: Powerelectronicsnews + Infineon Navitas developing next generation 800V HVDC architecture with NVIDIA Key efficiency gains ▪ Up to 5% improvement in end-to-end power efficiency ▪ Maintenance costs reduced by up to 70% due to fewer PSU failures and lower labor costs for component upkeep ▪ Lower cooling expenses from eliminating AC/DC PSUs inside IT racks NVIDIA 800 V HVDC Architecture will power the next generation of AI Factories
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Micro LED / LED – work continues until ramp in 2027+ 27 ▪ Continued work in Asia on LED brightness and cost per display ▪ ROY LEDs: China dominates market; ▪ local consolidation drives vertical partnerships (e.g. with panel makers) ▪ Micro LED: Still early-stage; ▪ secured orders are targeting the exploration of the potential of the product, ▪ but cost-effective production still remains the biggest challenge for high volume manufacturing G10-AsP G5+ Update
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Renewed product portfolio – strong market adoption of G10 tool family 28 ▪ 9x150mm (6“) or 6x200mm (8“) ▪ Cost benefit of batch tool with uniformity on par with single wafer tool ▪ Highest productivity in the market ▪ End Markets/Products: Electric vehicles, charging infrastructure ▪ 8x150mm (6“) or 5x200mm (8“) ▪ Compact cluster for high volume GaN manufacturing ▪ Designed for replacement of Si power devices with GaN devices ▪ End Markets/Products: GaN Power Electronics & Wireless communication ▪ 12x100mm (4“) or 8x150mm (6“) ▪ Fully automated AsP MOCVD system ▪ 10x lower defect density than predecessor tool ▪ End Markets/Products: Micro LED, Optical Communications, 3D- sensing & LiDAR G10-SiC G10-GaN G10-AsP All G10 models now well established; G10-AsP gaining momentum in laser market
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AIXTRON Competitive Landscape – clear market leader 29 USA Europe China/Taiwan Japan Opto GaAs/InP Lasers ROY (Micro) LED GaN (Micro) LED Power GaN Power SiC Power Source: AIXTRON market research
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Consolidated Income Statement1 30 (EUR million) H1/2026 H1/2025 +/- (%) Q2/2026 Q2/2025 +/- (%) Revenues 174.5 249.9 -30 115.1 137.4 -16 Cost of sales 116.9 160.0 -27 68.3 81.7 -16 Gross profit 57.5 89.9 -36 46.8 55.7 -16 Gross margin 33% 36% -3pp 41% 41% 0pp Selling expenses 9.5 9.1 4 5.1 4.3 19 General & admin expenses 16.8 16.6 1 8.7 7.5 16 R&D 47.0 36.0 31 22.2 18.4 21 Net other operating expenses (income) (8.1) 1.3 n.m.* (3.9) 2.0 n.m.* EBIT -7.6 26.9 n.m.* 14.7 23.6 -38 EBIT margin -4% 11% -15pp 13% 17% -4pp Net profit -2.8 24.3 n.m.* 19.1 19.2 -1 1 Rounded figures; may not add up * not meaningful ▪ H1/2026 Gross Profit & EBIT impacted by one-off expenses in the mid-single-digit EUR million range related to the personnel reduction implemented in the operations area
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(EUR million) 30.06.26 31.03.26 31.12.25 Property, plant & equipment and leased assets 238.8 230.9 241.9 Goodwill 72.0 71.8 71.6 Other intangible assets 5.8 5.9 6.1 Others 41.5 35.0 36.3 Non-current assets 358.2 343.6 355.8 Inventories 317.9 295.0 283.6 Trade receivables 81.0 83.7 130.7 Others 63.3 57.7 45.1 Cash & cash deposits & investments 816.2 272.7 224.6 Current assets 1,278.4 709.1 684.0 Equity 992.7 890.0 910.4 Non-current liabilities 355.5 7.1 7.4 Trade payables 49.2 35.9 33.6 Contract liabilities for advance payment 197.5 79.2 44.5 Others 41.6 40.6 43.9 Current liabilities 288.3 155.7 121.9 Balance sheet total 1,636.6 1,052.8 1,039.8 Consolidated Balance Sheet1 31 1 Rounded figures; may not add up
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Consolidated Statement of Cash Flows1 1 Rounded figures; may not add up 2 Working Capital = Inventories + Trade Receivables - Trade Payables - Contract Liabilities for Advance Payments; excl. FX-effects; updated definition applied to all periods 32 (EUR million) H1/2026 H1/2025 Q2/2026 Q2/2025 Net result -2.8 24.3 19.1 19.2 Adjust for: Non-cash items & others -10.6 -4.4 -9.9 -2.8 Changes in Working Capital2 186.0 65.0 109.7 33.5 Cash flow from operating activities 172.7 85.1 119.0 50.0 Capital expenditures/disposals -10.6 -14.0 -5.5 -8.7 Free cash flow 162.1 71.1 113.6 41.3 FX effects/other 1.2 -3.5 0.8 -2.7 Cash & cash deposits & investments 816.2 114.8 816.2 114.8
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Four Year View on Consolidated Income Statement1 33 (EUR million) FY/25 FY/24 FY/23 FY/22 Revenues 556.6 633.2 629.9 463.2 Cost of sales 334.2 370.7 350.8 267.9 Gross profit 222.4 262.5 279.0 195.3 Gross margin 40% 41% 44% 42% Selling expenses 16.3 14.2 14.1 11.2 General & admin expenses 32.1 31.9 32.6 29.2 R&D 81.1 91.4 87.7 57.7 Net other operating expenses (income) (7.5) (6.2) (12.1) (7.6) EBIT 100.3 131.2 156.8 104.7 EBIT margin 18% 21% 25% 23% Net result 85.3 106.2 145.2 100.5 1 Rounded figures; may not add up
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Four Year View on Consolidated Balance Sheet1 34 (EUR million) 31.12.2025 31.12.2024 31.12.2023 31.12.2022 Property, plant & equipment and leased assets 241.9 226.9 147.8 99.0 Goodwill 71.6 73.5 72.3 72.5 Other intangible assets 6.1 7.4 4.4 3.3 Others 36.3 39.2 41.8 34.9 Non-current assets 355.8 347.1 266.3 209.7 Inventories 283.6 369.1 394.5 223.6 Trade receivables 130.7 193.4 157.6 119.7 Others 45.1 44.2 30.0 24.5 Cash & cash deposits & investments 224.6 64.6 181.7 325.2 Current Assets 684.0 671.3 763.7 692.9 Equity 910.4 848.0 777.6 663.3 Non-current liabilities 7.4 7.5 7.7 10.0 Trade payables 33.6 33.9 57.8 46.1 Contract liabilities for advance payment 44.5 81.7 141.3 141.2 Others 43.9 47.3 45.6 41.9 Current liabilities 121.9 162.9 244.6 229.3 Balance Sheet total 1,039.8 1,018.4 1,029.9 902.6 1 Rounded figures; may not add up
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Four Year View on Consolidated Statement of Cash Flows1 35 1 Rounded figures; may not add up 2 Working Capital = Inventories + Trade Receivables - Trade Payables - Contract Liabilities for Advance Payments; excl. FX-effects; updated definition applied to all periods (EUR million) FY/25 FY/24 FY/23 FY/22 Net Result 85.3 106.2 145.2 100.5 Adjust for: Non-Cash Items & others 14.4 9.1 4.3 -11.9 Changes in Working Capital2 108.7 -89.1 -196.8 -51.5 Cash Flow from Operating Activities² 208.4 26.2 -47.3 37.1 Capital Expenditures/Disposals -26.4 -98.6 -62.4 -29.5 Free Cash Flow 181.9 -72.4 -109.7 7.7 FX Effects/Other -4.8 1.3 -1.7 -0.4 Cash & cash deposits & investments 224.6 64.6 181.7 325.2
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EU Taxonomy Alignment & ESG-Ratings 36 1 In line with EU Taxonomy Regulation Taxonomy Aligned Taxonomy Non-Aligned FY/2025: Revenues1 Taxonomy Aligned Taxonomy Non-Aligned FY/2025: CapEx1 Taxonomy Aligned Taxonomy Non-Aligned FY/2025: OpEx1 EU Taxonomy Aligned Technologies ▪ Wide Band Gap (WBG) Power Semiconductors based on: ▪ Gallium Nitride (GaN) and ▪ Silicon Carbide (SiC) ▪ Micro LEDs: ▪ Laser Diodes for Data Communication: ▪ Photovoltaics based on Compound Semiconductors: ▪ Quantum Technologies: ESG-Ratings ▪ CDP (Europe): ▪ 2025: C ▪ 2024: C ▪ MSCI: ▪ 2025: AA ▪ 2024: AA ▪ Sustainalytics: ▪ 2025: 18.1 - Low risk ▪ 2024: 20.8 - Medium risk ▪ ISS Oekom: ▪ 2025: C ▪ 2024: C Key technologies for energy-efficient Power Electronics For the next generation of displays Key technology for the digitalization of our world For high-tech applications (e.g.,space applications) For neuromorphic computing and quantum sensing 63% 37% 62% 38% 81% 19%
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Phone +49 (2407) 9030-0 Fax +49 (2407) 9030-40 E-Mail info@aixtron.com AIXTRON SE Dornkaulstr. 2 52134 Herzogenrath, Germany