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Dr. Felix Grawert, CEO Dr. Christian Danninger, CFO October 29th, 2026 Q3/2026 Investor Presentation
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1 Forward-Looking Statements This document may contain forward-looking statements regarding the business, results of operations, financial condition and earnings outlook of AIXTRON. These statements may be identified by words such as “may”, “will”, “expect”, “anticipate”, “contemplate”, “intend”, “plan”, “believe”, “continue” and “estimate” and variations of such words or similar expressions. These forward-looking statements are based on the current assessments, expectations and assumptions of the executive board of AIXTRON, of which many are beyond control of AIXTRON, based on information available at the date hereof and subject to risks and uncertainties. You should not place undue reliance on these forward-looking statements. Should these risks or uncertainties materialize or should underlying expectations not occur or assumptions prove incorrect, actual results, performance or achievements of AIXTRON may materially vary from those described explicitly or implicitly in the relevant forward-looking statement. This could result from a variety of factors, such as those discussed by AIXTRON in public reports and statements, including but not limited to those reported in the chapter “Risk Report”. AIXTRON undertakes no obligation to revise or update any forward-looking statements as a result of new information, future events or otherwise, unless expressly required to do so by law. Due to rounding, numbers presented throughout this report may not add up precisely to the totals indicated and percentages may not precisely reflect the absolute figures for the same reason. Our registered trademarks: AIXACT®, AIX-Multi-Ject®, AIXTRON®, Close Coupled Showerhead®, EXP®, EPISON®, Gas Foil Rotation®, HXP®, HYPERION®, Multi-Ject®, Planetary Reactor®, PVPD®, STExS®, TriJet®
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2 Q3/2026 Key highlights Q3/2026 results: Strong AI-driven optoelectronics demand accelerating ahead of expectations ▪ Order Intake of EUR 275m, driven by exceptionally strong demand for AI-related photonics applications (Q3/2025: EUR 124m) ▪ Revenues of EUR 184m reflecting ramp of photonics business ▪ Gross Profit at EUR 87m; Gross Margin at 48% due to better product and regional mix ▪ EBIT at EUR 57m; EBIT Margin at 31% Strong cash generation ▪ Free cash flow of EUR 290m in 9M/26, up EUR 180m yoy, mainly driven by higher customer advance payments ▪ Net financial assets increased to EUR 591m, supported by strong free cash flow and the net effect of the convertible bond Production ramp fully on track ▪ Output increased significantly in every quarter of 2026 ▪ Further output increase targeted for Q4 ▪ Strong order backlog supports FY/2026 guidance FY/2026 guidance1 confirmed ▪ Revenues FY/26E: EUR 560m ± 30m ▪ Gross Margin FY/26E: around 42% incl. mid-single-digit EUR million expense ▪ EBIT Margin FY/26E: 17% – 20% for personnel reduction in operations area in Q1 Outlook 2027 ▪ Significant growth expected in 2027, led by optoelectronics and supported by increasing momentum in power electronics 1 FY/26 Based on $1.20/€ Budget Rate
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Optoelectronics ▪ 68% of Q3/2026 equipment order intake ▪ Global demand from US, Europe, China, Japan, Taiwan and Singapore ▪ AI networking drives investments in transceivers and InP manufacturing ▪ Demand exceeds original market expectations and backlog provides visibility well into 2027 GaN ▪ Low-voltage AI power applications progressing through development and qualification (800V HVDC power) ▪ Inquiries and orders from selected high-volume customers starting ▪ Broad market demand expected to kick in once low-voltage adoption becomes broader SiC ▪ Additional demand driven by AI / industrial applications, i.e., from higher voltage class devices ▪ Customer utilization and consumables consumption improving ▪ First new orders for 200 mm capacity expansions LED / Micro LED ▪ Demand remains soft ▪ AR and AI optical interconnect activity increasing ▪ Long-term opportunity remains attractive 3 Q3/2026 Market & business development
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Annual Revenues by Application 4 EUR million 429 463 630 633 557 Optoelectronics and Communication¹LED incl. Micro LED GaN-Power SiC-Power Other incl. R&D After Sales FY26 Guidance low end FY26 Guidance high end 2021 2022 2023 2024 2025 2026 1 Includes applications in Consumer Optoelectronics, Solar and Telecom/Datacom 560 ± 30e Q4/26e 9M/2026
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5 Q3/26 EUR 184m +54% YoY EUR 358m -3% YoY Gross Profit EBIT EUR 87m +88% YoY EUR 145m +6% YoY EUR 57m +268% YoY EUR 49m +16% YoY 48% 40% Margin 31% 14% Margin Revenues 9M/2026 – Highlights | Key P&L Indicators ▪ Q3 revenue increased by 54% yoy, reflecting the high demand especially in optoelectronics ▪ Gross margin increased to 48%, driven by higher revenue and a favorable product and regional mix ▪ EBIT margin increased to 31%, supported by the higher gross margin and operating leverage ▪ 9M operating expenses were slightly higher year-on-year, mainly due to a 17% increase in R&D expenses 9M/26
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9M/2026 – Highlights | Key Balance Sheet & Cash Flow Indicators 6 1 Working Capital = Inventories + Trade Receivables - Trade Payables - Contract Liabilities for Advance Payments; FX-effects excluded in illustrated Change in Working Capital 2 Including other current financial assets minus financial liability of convertible bond ▪ Strong operating cash flow primarily driven by higher customer advance payments ▪ Advance payments reflect the order backlog, order composition and individual payment terms ▪ Customer prepayments support the upcoming production ramp ▪ Increase in net financial assets driven by EUR 290m free cash flow and the net effect of the convertible bond, partly offset by the EUR 17m dividend payment Q3/26 FY/24 € 446.9 m € +93.9 vs. Q4/23 EUR +95m YoY € +73.5 m YoY EUR 128m EUR +89m YoY € -72.4 m € +37.2 m YoY € 64.6 m € -117.1 m vs. Q4/23 EUR 84m EUR -68m vs. Q2/26 EUR 591m EUR +124m vs. Q2/26 EUR 138m € 26.2 m Working Capital1 Operating Cash Flow Free Cash Flow Net Financial Assets2 9M/26 EUR 84m EUR -254m vs. Q4/25 EUR 311m EUR +183m YoY EUR 290m EUR +180m YoY EUR 591m EUR +366m vs. Q4/25
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We address a comprehensive set of growth applications with our G10 family of products 7 Optoelectronics / LEDs SiC Power ▪ EV main inverters and EV OBCs ▪ EV charging infrastructure ▪ Data centers: AC/DC ▪ Wind & PV ▪ Traction & large drives Micro LEDs / Specialty LEDs ▪ Industrial displays (in/outdoor) ▪ TVs ▪ Smart watches / AR glasses ▪ Automotive ▪ Horticulture GaN Power & RF ▪ Fast charging / mobile devices ▪ Data centers: AC/DC & DC/DC ▪ Motor drives, e.g. white goods ▪ AI power delivery ▪ EV OBCs ▪ Base stations Lasers ▪ Optical data communication ▪ 3D sensing ▪ LiDAR ▪ Industrial power lasers Power Electronics GaNSiC GaN AsP AsP
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Optoelectronics – momentum in laser market continues to be strong 8 ▪ G10 AsP recognized as tool of record by leading customers – further engagements progressing with additional prospects. ▪ Demand for InP-based edge-emitting lasers remained robust, driven by AI and datacenter applications ▪ PIC applications driving of orders: ▪ Multiple photonic components are integrated on a single chip, enabling faster, energy-efficient data transmission using light. ▪ Applications: AI, data center, 5G, LiDAR and quantum computing. ▪ G10-AsP tool of record for the photonics ramp: ▪ “In-situ clean“ is ideally suited to multi-step processes of these devices ▪ Flexible use for 75/ 100/ 150/ 200mm wafer size(s) G10-AsP Platform: Securing top-tier engagements G10-AsP: Tool of record
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9 AI data centers are accelerating the transition from copper to optical interconnects The current demand cycle remains at an early stage and is expected to extend until 2030 9 Hyperscaler AI CapEx 2023–2030E (USD Billions, estimated) AI infrastructure is the #1 demand driver for everything downstream: compute, networking, optics, lasers, and epitaxy equipment. Source: ODDO BHF Securities, AI Capex note, Oct 2026 Hyperscaler capex has quadrupled since GPT-4's release | Epoch AI Optical Interconnects replace Cu wiring in Datacenter • Modern AI GPU clusters (NVIDIA Blackwell GB200 NVL72 and beyond) demand high optical interconnect bandwidth. • Each rack needs thousands of high-speed optical links. Strong growth predicted beyond 2026
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Demand in the InP datacom market is growing rapidly across three areas Layer What It Means Copper → Optics Transition SCALE-UP Connecting GPUs/XPUs within and across racks at full native speed (e.g., NVLink 5/6/7) Today: 0% optics From 2027/2028: optics between GPUs/XPUs SCALE-OUT Connecting compute rack to other racks within the datacenters Already using optics today (800G/1.6T transceivers). Growing with compute build-out SCALE- ACROSS Connecting data centers to each other and to the internet (coherent long-haul) Upside scenario that can be accelerated with inference needs Every expansion in AI compute requires a proportional increase in data interconnects, while changes in network architecture can drive non-linear growth in connectivity requirements. 10
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Opto market is growing faster than expected 11 Why is the photonics market larger than previously expected? AI datacenter build-out continues to accelerate 800G remains strong volume platform 1.6T investments becoming visible Demand now coming from US, Europe and Asia Move to 6" InP wafers slower than expected Market exceeds earlier tool expectations
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S t r e n g t h e n i n g l o n g ‑ t e r m m a n u f a c t u r i n g f l e x i b i l i t y a n d resilience ▪ Expansion of global production and supply chain footprint through a new facility in Penang, Malaysia ▪ Leverages Southeast Asia’s strong semiconductor equipment ecosystem to support AIXTRON’s growth ▪ Approx. EUR 40 million investment in 2026–2027 ▪ P h a s e d p r o d u c t i o n r a m p ‑ u p , w i t h f i r s t s y s t e m d e l i v e r i e s expected by end of 2027 ▪ Adds approximately 25-30% manufacturing capacity by 2028 ▪ Expansion potential beyond initial build-out if required 12 New site in Malaysia – project fully on track Q2/2026 Q3/2027 2028 onwards Start of Operations Production, Engineering, Service Start of Construction AIXTRON Penang
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13 1: At $1.20/€ Budget Rate for 2026; please refer to the “Expected earnings and financial position” in the AIXTRON 2025 Annual Report Guidance1 Revenues Gross Margin (%) EBIT Margin (%) Revenue Guidance FY/2026 EUR million EUR million EUR 560m ± 30m around 42% 17% to 20% ~300 ~100 Guidance for FY/2026 ~370 ~80 9M/26 Revenues Q4/26e from After Sales Q4/26 from Equipment Order Backlog ~30 FY/20261 ~170 +/- 30 ~360
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Financial Calendar & Contact Data 14 For further information please contact: Christian Ludwig VP Investor Relations +49 (2407) 9030-444 c.ludwig@aixtron.com FY/26 Results, Conference Call Q1/27 Results, Conference Call AGM for FY/26 Our Financial Calendar: AIXTRON SE Investor Relations & Corporate Communications Dornkaulstr. 2 52134 Herzogenrath Germany E-Mail: invest@aixtron.com For Dial-in Data, please refer to our website: www.aixtron.com/en/investors/events/conference-calls Conferences & Roadshows: DZ Bank Equity Conf., FFM MorganStanley TMT Conf., Barcelona Eigenkapitalforum, FFM Berenberg European Conf., London UBS TMT Conf., Phoenix 17 Nov 18/19 Nov 23 – 25 Nov 30 Nov 2 Dec 04 Mar 2027 29 Apr 2027 13 May 2027 Ralf Penner Senior IR Manager +49 (2407) 9030-6153 r.penner@aixtron.com
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Backup
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289 308 285 287 258 359 457 549 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 227 113 137 120 187 59 115 184 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 2026 24 Months Business Development 16 Order Intake (incl. equipment & after sales)1 Revenues (incl. equipment & after sales)2 157 132 119 124 170 171 215 275 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Order Backlog (equipment only)1 1 USD order intake and backlog were recorded at the prevailing budget rate (FY/2024: $1.15/€; 2025: $1.10/€) 2 USD revenues were converted at the actual period average FX rate (2024: $1.09/€; 2025: $1.12/€; 2026: $1.17/€) @ $1.15 @ $1.20 2025 20262024 @ $1.09 @ $1.12 @ 1.17 2024 2025 @ $1.10 @ $1.20 @ $1.15 2026 2024 2025 EUR million @ $1.10
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9M/2026 Revenue Analysis1 17 Regional SplitEquipment & After Sales End Application (equipment only) 75% 25% Equipment After Sales 54% 18% 28% Asia Europe Americas 61%18% 14% 5%2% Optoelectronics & Communications² LED incl. Micro LED GaN-Power SiC-Power Other incl. R&D 1 Rounded figures; may not add up 2 includes applications in Consumer Optoelectronics, Solar and Telecom/Datacom
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Demand Drivers on Order Intake per Quarter (Equipment Only) 18 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 25 50 75 100 125 150 175 200 225 250 GaN Power, Lasers, ROY & Micro LEDs SiC Power 2025202420232022 2026 EUR million Equipment Demand 2021 SiC & GaN Power & Micro LED SiC & GaN Power Optoelectronics Optoelectronics Optoelectronics Optoelectronics
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19 What We Do – deposition equipment for compound semiconductors Wafer making Deposition Lithography Etch Planarization Assembly / Test Packaging Multiple steps Focused Business Model ▪ AIXTRON is the leading supplier of deposition equipment to the compound semiconductor industry ▪ (MO)CVD: The tools run a (Metal-Organic) Chemical Vapor Deposition process for deposition of compound semiconductors ▪ Competitive strength comes from strong focus and clear technology / market leadership in fast growing segments of the market
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20 Our growth is driven by megatrends that will continue through the cycle 20 Electrification of everything AI and data Digitization & communication IoT and intelligent devices G10-SiC G10-GaN G10-AsP 21 3 4 Energy efficiency
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GaN power – acceleration of growth due to additional demand from AI 21 ▪ AIXTRON maintains a leading position in GaN power segments ▪ 2026: ▪ Soft start into the year as GaN adoption in broad range of applications is slower than expected ▪ Co-existence of 200mm and 300mm wafer sizes expected, few customers moving to 300mm wafer size ▪ 2027: ▪ Increasing momentum from fast growing low & mid voltage applications in AI power delivery (800V HVDC) ▪ GaN penetrating more and more applications beyond AI, gradually replacing silicon (energy efficiency) G10-GaN tool Update
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SiC power – positioned to outgrow the market through market-share gains 22 Update ▪ AIXTRON maintains a strong (leading) position in SiC power segments ▪ 2026: ▪ Soft market for new tools but utilization increasing ▪ 2027-2028: ▪ New applications for SiC in "industrial" market: ▪ Highest voltage (2kV & 3kV) devices for grid-to- datacenter conversion ▪ Solid-state-transformers (SSTs) ▪ Growing EV demand for SiC devices as OEMs switch 400V to 800V battery systems ▪ Strong differentiation for AIXTRON G10-SiC tool in upcoming technology trends "superjunction" and "highest voltage" devices G10-SiC tool
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GaN power – growth is fueled by adding more and more applications 23 500-700 V ≥ 1200 V< 200 V Voltage Time of market adoption2020 – 2023 2024 – 2026 2027 – 2028 Smartphone fast chargers AC/DC for datacenters HV motor drives, home appliances LV motor drives Time of Flight / Lidar EV On-Board Charger (OBC) Wireless charging AI power delivery Solar Micro-Inverters DC/DC for datacenters Class-D audio Battery tools, battery consumer devices (e-bikes, …) Industrial PSU Low speed electric vehicles EV main Inverter AI power delivery
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GaN power – selected case examples 24 Design more efficient, compact motor systems with the DRV7308 GaN IPM | Video | TI.com Battery tools and consumer devices ▪ Longer battery life ▪ Smaller size and reduced weight b/c less cooling AI „On Board“ power delivery ▪ Replacement of silicon power chips around the GPUs ▪ Up to 50% lower power loss in a compact form factor HV motor drives, home appliances ▪ Up to 40% energy consumption reduction ▪ Ramp from 2025 onwards ▪ High unit volume, large dies --> high wafer consumption
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GaN power – selected case examples 25Source: AIXTRON, measurement RWTH Aachen 25 ▪ >= 1200V breakdown for GaN devices demonstrated, achieving key parameters required for HVM ▪ Multiple companies with 650V or 1200V prototypes in the roadmaps for traction inverters ▪ Potential for cost reduction in main inverter ▪ Test at several OEMs ongoing Status of GaN for EV main inverters GaN achieves > 1200V breakdown voltage 3-Phase traction inverter powered by GaN devices
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GaN power – AIXTRON leads the market in 200mm today and is ready for 300mm ramp 26 G10-GaN 200mm GaN multi-wafer tool ▪ Leading platform for 150mm / 200mm wafer size ▪ Based on 20+ years GaN experience ▪ Used by all key GaN-players worldwide today (tool of record) Hyperion 300mm GaN single-wafer tool ▪ Key ingredients from 200mm technology transferred to 300mm ▪ Builds on prior experience in GaN ▪ Experience gained from today’s installed base ▪ 300mm showerhead technology (30+ years) ▪ Technological outperformance vs. 200mm platform recently confirmed by a leading customer
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27 NVIDIA – HVDC Architecture combines SiC and GaN devices Source: NVIDIA Source: Navitas Source: Powerelectronicsnews + Infineon Navitas developing next generation 800V HVDC architecture with NVIDIA Key efficiency gains ▪ Up to 5% improvement in end-to-end power efficiency ▪ Maintenance costs reduced by up to 70% due to fewer PSU failures and lower labor costs for component upkeep ▪ Lower cooling expenses from eliminating AC/DC PSUs inside IT racks NVIDIA 800 V HVDC Architecture will power the next generation of AI Factories
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Micro LED / LED – development and pilot activities continue 28 ▪ Continued work in Asia on LED brightness and cost per display ▪ ROY LEDs: China dominates market; ▪ local consolidation drives vertical partnerships (e.g. with panel makers) ▪ Micro LED: Still early-stage; ▪ secured orders are targeting the exploration of the potential of the product, ▪ but cost-effective production still remains the biggest challenge for high volume manufacturing G10-AsP G5+ Update
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Renewed product portfolio – strong market adoption of G10 tool family 29 ▪ 9x150mm (6“) or 6x200mm (8“) ▪ Cost benefit of batch tool with uniformity on par with single wafer tool ▪ Highest productivity in the market ▪ End Markets/Products: Electric vehicles, charging infrastructure ▪ 8x150mm (6“) or 5x200mm (8“) ▪ Compact cluster for high volume GaN manufacturing ▪ Designed for replacement of Si power devices with GaN devices ▪ End Markets/Products: GaN Power Electronics & Wireless communication ▪ 12x100mm (4“) or 8x150mm (6“) ▪ Fully automated AsP MOCVD system ▪ 10x lower defect density than predecessor tool ▪ End Markets/Products: Micro LED, Optical Communications, 3D- sensing & LiDAR G10-SiC G10-GaN G10-AsP All G10 models now well established; G10-AsP gaining momentum in laser market
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AIXTRON Competitive Landscape – clear market leader 30 USA Europe China/Taiwan Japan Opto GaAs/InP Lasers ROY (Micro) LED GaN (Micro) LED Power GaN Power SiC Power Source: AIXTRON market research
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Consolidated Income Statement1 31 (EUR million) 9M/2026 9M/2025 +/- (%) Q3/2026 Q3/2025 +/- (%) Revenues 358.1 369.5 -3 183.6 119.6 54 Cost of sales 213.2 233.2 -9 96.3 73.2 32 Gross profit 144.9 136.2 6 87.3 46.4 88 Gross margin 40% 37% 3pp 48% 39% 9pp Selling expenses 13.9 13.0 7 4.4 3.9 13 General & admin expenses 26.4 24.2 9 9.7 7.7 26 R&D 69.8 59.7 17 22.8 23.7 -4 Net other operating expenses (income) (14.3) (3.0) >300 (6.3) (4.3) 47 EBIT 49.1 42.3 16 56.7 15.4 268 EBIT margin 14% 11% 3pp 31% 13% 18pp Net profit 32.6 37.3 -13 35.4 13.0 172 1 Rounded figures; may not add up ▪ 9M/2026 Gross Profit & EBIT impacted by one-off expenses in the mid-single-digit EUR million range related to the personnel reduction implemented in the operations area
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(EUR million) 30.09.26 30.06.26 31.12.25 Property, plant & equipment and leased assets 242.4 238.8 241.9 Goodwill 72.2 72.0 71.6 Other intangible assets 8.1 5.8 6.1 Others 28.2 41.5 36.3 Non-current assets 350.8 358.2 355.8 Inventories 323.3 317.9 283.6 Trade receivables 110.2 81.0 130.7 Others 60.8 63.4 45.1 Cash & cash deposits & investments 944.8 816.2 224.6 Current assets 1,439.1 1,278.4 684.0 Equity 1,030.8 992.7 910.4 Non-current liabilities 360.9 355.5 7.4 Trade payables 40.8 49.2 33.6 Contract liabilities for advance payment 309.0 197.5 44.5 Others 48.4 41.6 43.9 Current liabilities 398.3 288.3 121.9 Balance sheet total 1,790.0 1,636.6 1,039.8 Consolidated Balance Sheet1 32 1 Rounded figures; may not add up
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Consolidated Statement of Cash Flows1 1 Rounded figures; may not add up 2 Working Capital = Inventories + Trade Receivables - Trade Payables - Contract Liabilities for Advance Payments; excl. FX-effects; updated definition applied to all periods 33 (EUR million) 9M/2026 9M/2025 Q3/2026 Q3/2025 Net result 32.6 37.3 35.4 13.0 Adjust for: Non-cash items & others 24.9 -8.3 35.5 -4.1 Changes in Working Capital2 253.6 99.5 67.6 34.5 Cash flow from operating activities 311.1 128.5 138.4 43.4 Capital expenditures/disposals -21.2 -18.2 -10.6 -4.2 Free cash flow 289.9 110.3 127.8 39.2 FX effects/other 3.0 -4.0 1.8 -0.5 Cash & cash deposits & investments 944.8 153.4 944.8 153.4
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Four Year View on Consolidated Income Statement1 34 (EUR million) FY/25 FY/24 FY/23 FY/22 Revenues 556.6 633.2 629.9 463.2 Cost of sales 334.2 370.7 350.8 267.9 Gross profit 222.4 262.5 279.0 195.3 Gross margin 40% 41% 44% 42% Selling expenses 16.3 14.2 14.1 11.2 General & admin expenses 32.1 31.9 32.6 29.2 R&D 81.1 91.4 87.7 57.7 Net other operating expenses (income) (7.5) (6.2) (12.1) (7.6) EBIT 100.3 131.2 156.8 104.7 EBIT margin 18% 21% 25% 23% Net result 85.3 106.2 145.2 100.5 1 Rounded figures; may not add up
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Four Year View on Consolidated Balance Sheet1 35 (EUR million) 31.12.2025 31.12.2024 31.12.2023 31.12.2022 Property, plant & equipment and leased assets 241.9 226.9 147.8 99.0 Goodwill 71.6 73.5 72.3 72.5 Other intangible assets 6.1 7.4 4.4 3.3 Others 36.3 39.2 41.8 34.9 Non-current assets 355.8 347.1 266.3 209.7 Inventories 283.6 369.1 394.5 223.6 Trade receivables 130.7 193.4 157.6 119.7 Others 45.1 44.2 30.0 24.5 Cash & cash deposits & investments 224.6 64.6 181.7 325.2 Current Assets 684.0 671.3 763.7 692.9 Equity 910.4 848.0 777.6 663.3 Non-current liabilities 7.4 7.5 7.7 10.0 Trade payables 33.6 33.9 57.8 46.1 Contract liabilities for advance payment 44.5 81.7 141.3 141.2 Others 43.9 47.3 45.6 41.9 Current liabilities 121.9 162.9 244.6 229.3 Balance Sheet total 1,039.8 1,018.4 1,029.9 902.6 1 Rounded figures; may not add up
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Four Year View on Consolidated Statement of Cash Flows1 36 1 Rounded figures; may not add up 2 Working Capital = Inventories + Trade Receivables - Trade Payables - Contract Liabilities for Advance Payments; excl. FX-effects; updated definition applied to all periods (EUR million) FY/25 FY/24 FY/23 FY/22 Net Result 85.3 106.2 145.2 100.5 Adjust for: Non-Cash Items & others 14.4 9.1 4.3 -11.9 Changes in Working Capital2 108.7 -89.1 -196.8 -51.5 Cash Flow from Operating Activities² 208.4 26.2 -47.3 37.1 Capital Expenditures/Disposals -26.4 -98.6 -62.4 -29.5 Free Cash Flow 181.9 -72.4 -109.7 7.7 FX Effects/Other -4.8 1.3 -1.7 -0.4 Cash & cash deposits & investments 224.6 64.6 181.7 325.2
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EU Taxonomy Alignment & ESG-Ratings 37 1 In line with EU Taxonomy Regulation Taxonomy Aligned Taxonomy Non-Aligned FY/2025: Revenues1 Taxonomy Aligned Taxonomy Non-Aligned FY/2025: CapEx1 Taxonomy Aligned Taxonomy Non-Aligned FY/2025: OpEx1 EU Taxonomy Aligned Technologies ▪ Wide Band Gap (WBG) Power Semiconductors based on: ▪ Gallium Nitride (GaN) and ▪ Silicon Carbide (SiC) ▪ Micro LEDs: ▪ Laser Diodes for Data Communication: ▪ Photovoltaics based on Compound Semiconductors: ▪ Quantum Technologies: ESG-Ratings ▪ CDP (Europe): ▪ 2025: C ▪ 2024: C ▪ MSCI: ▪ 2025: AA ▪ 2024: AA ▪ Sustainalytics: ▪ 2025: 18.1 - Low risk ▪ 2024: 20.8 - Medium risk ▪ ISS Oekom: ▪ 2025: C ▪ 2024: C Key technologies for energy-efficient Power Electronics For the next generation of displays Key technology for the digitalization of our world For high-tech applications (e.g.,space applications) For neuromorphic computing and quantum sensing 63% 37% 62% 38% 81% 19%
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Phone +49 (2407) 9030-0 Fax +49 (2407) 9030-40 E-Mail info@aixtron.com AIXTRON SE Dornkaulstr. 2 52134 Herzogenrath, Germany