IFX Q3 2026 07:30 UTC Earnings Presentation

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Third Quarter FY 2026 Quarterly Update Infineon Technologies AG Investor Relations public Infineon

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2 Copyright © Infineon Technologies AG 2026. All rights reserved.public2026-08-05 50% 11% 29% 10% Infineon at a glance FY25 revenue by segment FY25 revenue by product category Automotive (ATV) Green Industrial Power (GIP) Power & Sensor Systems (PSS) Connected Secure Systems (CSS) ~35% control & connectivity ~30% analog1 & sensors ~35% power (discretes, modules) ATV GIP PSS CSSof total revenue Addressing long-term high-growth trends Energy green and efficient Mobility clean and safe IoT smart and secure Financials [EUR m] FY19 FY20 FY21 FY22 FY23 FY24 FY25 14,955 16,309 14,218 11,060 8,5678,029 Segment result Revenue Segment result margin 14,662 18%21% 27%24% 19%14%16% 2,5603,1054,3993,3782,0721,1701,319 1 including <5% of differentiating memory technologies

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3 Copyright © Infineon Technologies AG 2026. All rights reserved.public2026-08-05 Well-balanced portfolio among segments and key applications, highest growth coming from Decarbonization and Digitalization 50% 11% 29% 10% FY25 revenue of €14,662m by segment and key application CSS ATV GIP PSS Main growth contributors (addressed by multiple segments) Further major applications 13% 11% 8% 6% 3% 14% 9% 8% 4% 4% 20% E-mobility Power infrastructure Software- defined vehicle AI/Data center IoT Auto Body Power Classic Powertrain Chassis & Classic Safety Automation & Drives Smart Cards Other

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4 Copyright © Infineon Technologies AG 2026. All rights reserved.restricted2026-01-01 1 Based on or includes research from Omdia: Power Semiconductor Market Share Database – 1H26 (2025 Base Year). May 2026. | 2 TechInsights: Automotive Semiconductor Vendor 2025 Market Shares. April 2026 | 3 Based on or includes research from Omdia: Annual 2001-2025 Semiconductor Market Share Competitive Landscaping Tool – 4Q25. March 2026. Results are not an endorsement of Infineon Technologies AG. Any reliance on these results is at the third party’s own risk. Infineon is a global player, clear #1 in power semiconductors, automotive semiconductors and microcontroller market 2.6% 2.7% 2.8% 3.2% 4.0% 4.2% 4.3% 4.7% 7.2% 17.3% Toshiba ROHM Vishay BYD Fuji Hangzhou Silan Mitsubishi STMicro onsemi Infineon Power discretes and modules 2025 total global market: $32.5bn1 Infineon NXP STMicro Texas Instr. Micron 12.8% 9.6% 7.8% 6.2% 6.1% Renesas Infineon NXP STMicro Microchip 23.2% 19.4% 15.6% 13.0% 7.5% Automotive semiconductors 2025 total market: $74.4bn2 Microcontroller 2025 total market: $22.2bn3

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44 Copyright © Infineon Technologies AG 2026. All rights reserved.public2026-08-05 Fossil, nuclear, hydro Wind Solar Grid-scale battery storage3 Electrolysis4 2,000 1,500 2,500 500 3,500 5,000 3,500 2,000 0 1000 2000 3000 4000 5000 EV Charging 5,000 100 Heat pump4 40 60 Fuel Cell 600 1,000 6000 0 0 Green energy generation provides large business opportunities Additions in 20241 CAGR 2024-35 115 GW 538 GW 62 GW <1 GW ~6m inst. 22m inst. 13% 17% 30% 92%2 31% 16% 5k inst. 42% Mainly IGBT Mainly SiC › PV: › 2021:925 › 2022:1145 › 2023: 1422 › 2030: 6044 kumuliert › CAGR: 23% › https://www.iea.org/rep orts/solar-pv › Wind: › 2021:827 › 2022: 902 › 2023: 1026 › 2030: 2891 kumuliert › CAGR: 16% › https://www.iea.org/rep orts/wind-electricity › Storage: › 2021:16 › 2022: 28 › 2023: › 2030: 967 kumuliert › CAGR: 56% › https://www.iea.org/en ergy- system/electricity/grid- scale-storage › EV Charging › 2021: 1,8m public chargers › 2022: 2,7m public chargers, 17,5m private chargers (light duty), 25 total light duty, ~1m heavy duty › 2023: › 2030: 145m private chargers (APS), 210m total chargers (Light duty) + 6 m heavy duty › https://www.iea.org/reports/globa l-ev-outlook-2023 › Heat Pump › 2021: › 2022: 1000GW › 2023: › 2030: 3000GWth › CAGR: 15% › https://www.iea.org/rep orts/installation-of- about-600-million-heat- pumps-covering-20-of- buildings-heating- needs-required-by- 2030 › Electrolysis: › 2021:0,56 › 2022:0,69 › 2023: 2,8 › 2030: 560GW (NZE), 170-365GW Pipeline › CAGR: 92% › https://www.iea.org/report s/electrolysers › Fuel Cell › 2021: › 2022: › 2023: › 2030: 430k › CAGR: 42% › Internal Analysis [EUR per MW] [EUR per installation] Power semiconductor content by application 1 IEA: World Energy Outlook, November 2025; Sector Tracking reports October 2023; internal Analysis 2 Based on 270 GW pipeline (midpoint), >100% based on NZE requirements of 560GW 3 Based on assumption 80% of total battery storage equals Grid-scale battery storage 4 Additions in 2022, CAGR 2022-2030

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72 Copyright © Infineon Technologies AG 2026. All rights reserved.public2026-08-05 Adjusted gross margin Therein Non-Segment Result charges [EUR m] Therein Non-Segment Result charges [EUR m] 77 52 7250 674418 17 35 29 Therein Non-Segment Result charges [EUR m] [EUR m] [EUR m] Gross profit R&D SG&A Gross margin and Opex 43.0% 41.0% 42.8%43.0% 40.7% 113 85 8476 99 Q3 FY25 Q4 FY25 Q1 FY26 Q2 FY26 Q3 FY26 1,515 1,504 1,462 1,477 38.7%39.9%38.1%40.9% Gross profit as reported Gross margin as reported 1,703 40.8% Q3 FY25 Q4 FY25 Q1 FY26 Q2 FY26 Q3 FY26 560 565 626 612 17.1%14.3%15.1% R&D expenses R&D expenses as % of revenue 16.1% 674 16.2% Q3 FY25 Q4 FY25 Q1 FY26 Q2 FY26 Q3 FY26 410 401 409 379 9.9%11.2%10.2%11.1% SG&A expenses SG&A expenses as % of revenue 433 10.4% [EUR m]

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74 Copyright © Infineon Technologies AG 2026. All rights reserved.public2026-08-05 Working capital, in particular trade working capital components Working capital1 Inventories Trade receivables Trade payables [EUR m] [EUR m][days2] [days] 1 See notes for definition 2 The calculation of DSO was adjusted effective 1 October 2025. The adjustment increases the transparency and informative value of the key figure and improves its comparability. The figures for the comparative periods have been adjusted accordingly. Q3 FY25 Q4 FY25 Q1 FY26 Q2 FY26 Q3 FY26 3,716 2,955 3,275 3,568 3,486 Q3 FY25 Q4 FY25 Q1 FY26 Q2 FY26 Q3 FY26 2,052 2,249 1,981 2,285 34293234 2,527 35 Q3 FY25 Q4 FY25 Q1 FY26 Q2 FY26 Q3 FY26 1,898 2,011 2,081 2,068 67706467 66 2,127 Q3 FY25 Q4 FY25 Q1 FY26 Q2 FY26 Q3 FY26 4,280 4,141 4,485 4,540 153 183 175176 4,531 165 [EUR m][EUR m] [days]

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81 Copyright © Infineon Technologies AG 2026. All rights reserved.public2026-08-05 Disclaimer Disclaimer This presentation contains forward-looking statements and/or assessments about the business, financial condition performance and strategy of the Infineon Group. These statements and/or assessments are based on assumptions and management expectation resting upon currently available information and present estimates. They are subject to a multitude of uncertainties and risks, many of which are partially or entirely beyond Infineon’s control. Infineon’s actual business development, financial condition, performance and strategy may therefore differ materially from what is discussed in this presentation. Beyond disclosure requirements stipulated by law, Infineon does not undertake any obligation to update forward-looking statements. Specific disclaimer for Omdia – part of Informa Tech – reports, data and information referenced in this document: Information is not an endorsement of Infineon Technologies AG. Any reliance on these results is at the third party’s own risk. Specific disclaimer for S&P Global reports, data and information referenced in this document: The S&P Global Mobility reports, data and information referenced herein (the "S&P Global Materials") are the copyrighted property of S&P Global Inc. and its subsidiaries (“S&P Global”) and represent data, research, opinions or viewpoints published by the relevant divisions within S&P Global, and are not representations of fact. The S&P Global Materials speak as of the original publication date thereof and not as of the date of this document. The information and opinions expressed in the S&P Global Materials are subject to change without notice and neither S&P Global nor, as a consequence, Infineon have any duty or responsibility to update the S&P Global Materials or this publication. Moreover, while the S&P Global Materials reproduced herein are from sources considered reliable, the accuracy and completeness thereof are not warranted, nor are the opinions and analyses which are based upon it. S&P Global and the trademarks used in the Data, if any, are trademarks of S&P Global. Other trademarks appearing in the S&P Global Materials are the property of S&P Global or their respective owners.

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82 Copyright © Infineon Technologies AG 2026. All rights reserved.public2026-08-05 Glossary AC alternating current AD automated driving ADAS advanced driver assistance system AI artificial intelligence BBU battery back-up unit BEV battery electric vehicle BLE Bluetooth low energy BMS battery management system BoM bill of materials BVM backside vertical module DC direct current DSC/SSC double/single sided cooling E/E electrical/electronic architecture ECPD electronic circuit protection device ECU electronic control unit EMS electronics manufacturing service ESS energy storage system EV electric vehicle FCEV fuel cell electric vehicle FHEV/MHEV full/mild hybrid electric vehicle GaN gallium nitride GPU graphic processing unit HEMT high-electron-mobility transistor HFT high-frequency transformation HV high voltage HVAC heating, ventilation, air conditioning HVDC high-voltage direct current IBC intermediate bus converter IC integrated circuit ICE internal combustion engine IGBT insulated gate bipolar transistor IoT internet of things LED light-emitting diode LLC resonant tank converter MCU microcontroller unit LV low voltage MEMS micro electro-mechanical system MOSFET metal-oxide silicon field-effect transistor MPU micro processing unit MV medium voltage NFC near-field communication OBC on-board charger OEM original equipment manufacturer P2S Infineon's strategic product-to-system approach PCS power capacitor system PFC power factor correction PDN power delivery network PHEV plug-in hybrid electric vehicle PHY physical layer transceiver PMIC power management integrated circuits PSU power supply unit RAM random access memory RF radio frequency SAE Society of Automotive Engineers SAM serviceable available market SDK software development kit Si silicon SiC silicon carbide SiVR substrate integrated voltage regulator SoC system-on-chip / state of charge SSCB solid-state circuit breaker SST solid-state transformer ToF time-of-flight UPS-ESS uninterruptable power supply energy storage solution UWB ultra-wideband VRM voltage regulator module xSC different switched capacitor topologies

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83 Copyright © Infineon Technologies AG 2026. All rights reserved.public2026-08-05 Notes and ESG footnotes Investments = 'Investments in property, plant and equipment' + 'Investments in other intangible assets and capitalized developments costs' Adjusted Free Cash Flow Margin = Adjusted for large investments in frontend buildings and major M&A transactions, for full definition see chapter "Internal management system" in the annual report Capital Employed = 'Total assets' – 'Cash and cash equivalents' – 'Financial investments' – 'Assets classified as held for sale' – ('Total Current liabilities' – 'Short-term financial debt and current maturities of long-term financial debt' – 'Liabilities classified as held for sale') RoCE = 'Operating profit from continuing operations'/'Capital Employed' = ‘Profit (loss) from continuing operations adjusted for interest result'/'Capital Employed' Working Capital = ('Total current assets' – 'Cash and cash equivalents' – 'Financial investments' – 'Assets classified as held for sale') – ('Total current liabilities’ – 'Short term financial debt and current portion of long-term financial debt' – 'Liabilities classified as held for sale') DIO (days inventory outstanding; quarter-to-date) = ('Net Inventories'/'Cost of goods sold') x 90 DPO (days payables outstanding; quarter-to-date) = ('Trade payables'/['Cost of goods sold' + 'Purchase of property, plant and equipment']) x 90 DSO (days sales outstanding; quarter-to-date) = ('Trade receivables' - 'reimbursement obligation’ + 'contract assets') / 'revenue’ x 90 Order backlog = The total amount of orders received regardless of their current status ESG footnotes: 1) This figure takes into account manufacturing, transportation, own vehicles, travel, raw materials and consumables, chemicals, water/waste water, direct emissions, energy consumption, waste, etc. as well as direct and indirect energy-related emissions by manufacturing service providers. It is based on data collected internally and publicly available conversion factors and relates to the 2021 fiscal year. 2) This figure is based on internally established criteria, which are described in the explanatory notes. The figure relates to the 2020 calendar year and takes into account the following application areas: automotive, LED, induction cookers, servers, renewable energy (wind, photovoltaic) and cell phone chargers as well as drives. CO2 savings are calculated based on the potential savings generated by technologies in which semiconductors are used. The CO2 savings are allocated based on Infineon's market share, semiconductor share, and the lifetime of the technologies concerned, based on internal and external experts' estimations. Despite the fact that carbon footprint calculations are subject to imprecision due to the complex issues involved, the results are nevertheless clear. 3) Carbon neutrality is defined in terms of Scope 1 and Scope 2 emissions.

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