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Fami Rigaku FY26 2Q / 1H Earnings Presentation Rigaku Holdings Corporation August 7 , 2026
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Disclaimer 2 This material has been prepared solely for the purpose of providing relevant information regarding Rigaku Holdings Corporation (“Rigaku” or the “Company”) and does not constitute an offer to sell or the solicitation of an offer to buy any security in the United States, Japan or any other jurisdiction . The information contained in this material is based on the economic, regulatory, market and other conditions available to the Company on the date hereof, and the Company does not make any representations, warranties or guarantees with respect to the truthfulness, accuracy or integrity of such information . The information contained in this material may be changed without prior notice . This material contains statements that constitute forward - looking statements, including estimates, prospects, plans and targets . Such forward - looking statements do not represent any guarantee by management of future performance . In many cases, but not all, the Company uses such words as “expectation,” “forecast,” “anticipation,” “intention,” “plan,” “possibility” and similar expressions to identify forward - looking statements . You can also identify forward - looking statements by discussions of strategy, plans or intentions . Any forward - looking statements in this material are based on certain assumptions, beliefs and forecasts of the Company on basis of information available to the Company at the time such statements were made, and involve known and unknown uncertainties, risks and other factors, including, but not limited to, adverse changes in demand for X - ray analytical instruments, global economic conditions, the reputation of the Company’s brand, products and services, intense competition in the markets in which the Company operates, risks associated with international business operations, risks related to inflation, fluctuations in currency exchange rates, fluctuations in labor cost, changes in or the introduction of new laws and regulations, the Company’s ability to execute its strategies to grow its business, the protection of personal and confidential information, legal proceedings, the occurrence of large - scale disasters and other factors . Such risks, uncertainties and other factors may cause the Company’s actual results, performance, achievements or financial position to be materially different from any future results, performance, achievements or financial position expressed or implied by such forward - looking statements . The Company’s fiscal year ends on December 31 . The Company adopted International Financial Reporting Standards (“IFRS”) from the year ended December 31 , 2022 , using a transition date of January 1 , 2022 . This material contains non - IFRS financial measures of the Company, including R&D Ratio, CAPEX ratio and Free Cash Flow . These non - IFRS financial measures should not be considered in isolation or as a substitute for the most directly comparable financial measures presented in accordance with IFRS or accounting principles generally accepted in other jurisdictions, including J - GAAP and U . S . GAAP . The Company’s use, definition and calculation of its non - IFRS measures may differ significantly from, and therefore may not be directly comparable to, similarly titled measures of other companies . Please refer to the calculation tables in the Appendix for details . This material also contains financial and operating data prepared on a management accounting basis, such as revenue and operating profit by product categories and revenue by end markets . This information is not prepared in accordance with J - GAAP or IFRS and is unaudited . This material contains statements as of the date stated on this material (or any other date separately specified herein), and the Company neither adopts a policy of, nor assumes any responsibility for, keeping such information updated . Therefore, future prospects will not necessarily coincide with actual results . Information regarding companies other than the Company contained in this material is extracted from publicly available information, and the Company has not verified and cannot guarantee the accuracy or adequacy of such Information . Amounts in this document are rounded down to the nearest hundred million yen, and percentage figures are rounded to one decimal place .
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Agenda 3 1 ． FY26 2Q/1H Consolidated Financial Results 2 ． Semiconductor Process Control Instruments Business Update 3 ． FY26 Earnings Forecast
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries FY26 2Q/1H Consolidated Financial Results
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Highlights of FY26 2Q/1H Consolidated Financial Results 5 ◼ 2Q: Revenue grew 7% YoY, while orders increased by more than 50% YoY. Current order forecasts remain strong, clearly demonstrating that the company is on a sustained growth trajectory. ◼ 1H: Both revenue and orders progressed largely in line with plan. Orders grew by more than 25% YoY, while the sales pipeline expanded by over 35% YoY compared with the same month last year. ◼ Improvements in the gross profit/operating margin remain a work in progress. We expect those to recover through higher volumes, price increases and contributions from new products in 2H. Overall Semiconduct or Process Control Instruments ◼ 2Q: Revenue grew 60% YoY, while orders increased by more than 3x YoY. Near - term order forecasts also remain exceptionally strong. ◼ 1H: Revenue increased 18% YoY, while orders grew 86% YoY. Both revenue and orders are progressing ahead of plan. ◼ In addition to demand driven by memory capacity expansion and the recovery in North American IDM customer, development of new products such as JEP is also progressing steadily. Multipurpose Analytical Instruments ◼ 2Q: Revenue improved to a level close to the previous year, while its recovery took longer than initially expected. ◼ 1H: Orders grew 5% YoY. In 2Q, YoY order growth was particularly strong, with more than 20% in Japan and 50% in the Americas. Near - term order forecasts also remain robust. ◼ The shift in demand from academia to industry is beginning to be reflected in orders, supporting expectations for a significant acceleration in revenue growth from the second half onward.
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries 10.2 10.7 6.9 13.3 9.2 8.9 8.3 13.9 6.6 8.4 2.8 6.4 6.7 7.3 6.1 4.6 4.2 12.7 5.3 7.4 6.3 6.0 6.1 7.3 5.1 6.5 6.1 8.0 5.8 5.8 19.5 23.2 19.8 28.0 20.6 20.1 18.7 34.6 17.9 21.6 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q FY24 FY25 FY26 Quarterly Revenue Trend 6 ◼ 2Q rebounded strongly from the transitional 1Q as planned, returning the business to its growth trajectory. First - half performan ce was in line with plan. ◼ Strong demand for memory and logic applications in the Semiconductor Process Control Instruments business, together with soli d order momentum in the Multipurpose Analytical Instruments business, supports significant revenue growth in 2H. ( JPY Bn ) Components and Services Semiconductor Process Control Instruments Multipurpose Analytical Instruments Actual Image +20 ％
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries FY26 2Q Consolidated Financial Results Summary（YoY） 7 2025 2Q 2026 2Q YoY Change Revenue 20.1 21.6 7.4% Gross Profit 11.1 11.9 7.0% Operating Profit 2.8 1.9 - 32.4% Operating Profit Margin (%) 14.3% 9.0% - 5.3% Profit Before Tax 2.7 1.6 - 39.6% Quarterly Profit 1.8 1.2 - 30.2% ( JPY Bn ) EBITDA 4.1 3.3 - 18.4% EBITDA Margin (%) 20.4% 15.5% - 4.9pt Basic EPS (Yen) 8.23 5.74 - ◼ Consolidated revenue increased, supported by higher sales in the Semiconductor Process Control Instruments . ◼ Gross profit margin remained broadly unchanged YoY . ◼ Gross profit slightly increased YoY, however continued strategic investments in line with plan resulted in operating profit declining YoY. ◼ Strategic investment is on track. Assuming revenue reaches the planned full - year level, their impact on the profit margin should be broadly neutral, as initially expected. The key is how much the gross profit margin can be improved.
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries 3.9 3.2 1.0 1.0 0.7 0.7 3.1 3.3 8.9 8.4 FY25 2Q FY26 2Q Life Science Other Industries FY25 2Q FY26 2Q YoY Revenue 8.9 8.4 - 6.1% Operating Profit 1.3 0.3 - 77.3% Margin (%) 15.0% 3.6% - 11.3pt FY26 2Q Performance Summary by Category 8 1.2 1.9 0.4 3.5 0.9 0.2 0.4 0.2 0.8 0. 5 0. 8 1.1 4.6 7.4 FY25 2Q FY26 2Q Components and Services Others Power Device WFE Advanced Logic/Foundry Multipurpose Analytical Instruments Semiconductor Process Control Instruments 4.0 3.0 2.5 2.7 6.5 5.8 FY25 2Q FY26 2Q Services （ JPY Bn ） • Academia - sector weakness due to Trump administration policies has persisted longer than expected. • Gross margin was maintained through a better sales mix, but decrease in volume and higher SG&A expenses reduced operating profit. • Orders rebounded in 2Q, supporting the ongoing shift from academia to industry. • Strong revenue growth driven by memory and logic demand. • Higher revenue lifted operating profit and improved margins. • Revenue is expected to be 2H - weighted, led by new products, with margins improving from 1H. • Service revenue increased by 11%, driven by price increases and sales expansion initiatives. • Overall revenue declined due to the shift of revenue in Other Analytical Instruments to 2H (EUV mirrors, handheld Raman analyzers, and PCI). • Operating profit declined due to the shift of revenue to 2H. Components and Services FY25 2Q FY26 2Q YoY 4.6 7.4 +60.0% 0.8 1.4 +69.4% 17.9% 18.9% +1.0pt FY25 2Q FY26 2Q YoY 6.5 5.8 - 11.3% 1.5 0.6 - 60.1% 23.3% 10.5% - 12.8pt Academia/ Government Semiconductor/Electronic Components Memory Components & Other Analytical Instruments
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries FY26 2Q Analysis of Consolidated Operating Profit（YoY） 9 ◼ Operating Profit Margin 9.0 % (down by 5.3pt YoY) • Gross margin remained broadly flat, as price increases and an improved customer/product mix offset higher costs • Lower sales and continued strategic investments increased R&D and SG&A ratios ( mainly due to personnel cost for semiconductor expansion and overseas growth investments) 14.3% -0.2% 3.3% -1.1% -7.6% -0.3% 9.0% FY25 2Q GM remained flat Lower SG&A exp. ratio due to higher revenue R&D expenses Other SG&A Expenses FX losses FY26 2Q GM% - 0.2pt SG&A and Others - 5.1 pt Personnel Expenses - 3.5pt (Overseas - 2.8pt) (Domestic - 0.7pt) Distributor Commissions - 1.3pt
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Recent Order Intake ＆ Sales Trend 10 FY26 JEP 14 projects FY26 Completion 8 Continued in Following Year 6 Note : 1. LabLinc Studio - related products include MiniFlex , MiniFlex XpC , SmartLab , CT Lab HX, STAvesta and ZSX Primus IV. 2. JEP stands for Joint Evaluation Program, under which equipment is installed at a customer site for joint performance evaluati on before purchase. Upon purchase, it is reclassified from fixed assets to cost of sales. 0 FY26 1H FY26 2H Outlook Approx. 4 Approx. 10 （ JPY Bn ） FY25 JEP 14 projects FY25 Completed 5 Continued in Following Year 9 Semiconductor Process Control Instruments ： JEP ( 2 ) is progressing steadily New product sales to grow in 2H alongside JEP (2) progress FY26 1Q FY26 2Q FY26 3Q Outlook Over +50% YoY Japan +22 ％ Americas +50 ％ YoY +5 ％ YoY +6 ％ Multipurpose Analytical Instruments ： Americas orders bottomed in 2Q, with a Q3 recovery expected ◼ Order Intake Trends Cem ent , Metals, Petroleum etc Semiconductor/ Electronic Devices AI - driven materials development Automation needs Primus Series NEX Series XRTmicron Industrial CT Products Lablinc Studio Related (1) FY26 5 New Projects Launched Key Products Key Applications and Industries ◼ Key Products, Applications and Industries
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries FY26 1H Consolidated Financial Results Summary（YoY） Note: Read as Profit attributable to owners of the parent entity, for interim or quarterly profit, as applicable 11 ◼ Revenue declined 2.9% YoY, as lower sales in Multipurpose Analytical Instruments were largely offset by growth in Semiconductor Process Control Instruments. ◼ The decline in gross profit margin was primarily attributable to higher COGS , including one - off factors in 1Q, foreign exchange effects and upfront investments ◼ Operating profit declined YoY due to the lower gross profit margin, as well as continued strategic investments made in line with the business plan resulting in R&D spending and increased personnel expenses. FY25 1H FY26 1H YoY Revenue 40.7 39.5 - 2.9% Gross Profit 22.7 21.6 - 4.6% Operating Profit 5.7 2.5 - 54.9% Operating Profit Margin (%) 14.0% 6.5% - 7.5pt Profit Before Tax 5.4 2.0 - 62.6% Interim Profit (1) 3.7 1.6 - 56.9% Basic EPS(Yen) 16.71 7.20 - Interim Dividend (Yen) 9.40 9.50 - EBITDA 8.1 5.3 - 33.9% EBITDA Margin (%) 20.0% 13.6% - 6.7pt (JPY Bn) ◼ An interim dividend of 9.50 Yen per share was resolved as planned.
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Semiconductor Process Control Instruments Business Update
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries 13 Update on Rigaku’s Share of Thin-Film Metrology Market Source ： Yole Wafer Fab Equipment Market Monitor 2026/Q2 ◼ Rigaku expanded its market share, maintaining No. 1 position 532 498 ◼ Rigaku gained share and became No. 1 in the broader thin - film thickness and composition measurement market Company A Rigaku Company B Company C Company D Others Company E Rigaku Company A BrukerCompany B Company C Company D Others X - ray Metrology Market Share Film and Materials Metrology Market Share
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Strategic Product Roadmap for Next-Gen Semiconductors 14 Logic Advanced Packaging Hybrid Metrology Advanced Metrology Needs ▪ GAA/CFET 3D Structure Metrology (GI-SAXS) ▪ Defect Detection in Advanced HBM / CoWoS Packages (Bumps/TSVs) ▪ Shape Measurement of 3D Logic and Memory Structures Memory Estimated SAM (Target Share)@2030 $100M(>70%) $300M(>30%) New Market $100M(>50%) New Market $100M(>50%) ▪ Si/SiGe Superlattice Analysis ▪ High-k/Metal Gate Ultrathin Film Measurement ▪ Ultrathin Film Analysis for Light Elements Logic/Mem ory ▪ DRAM/NAND HAR(Deep Trench) Metrology (T-SAXS) R&D and Commercialization Roadmap 2025 2026 2027 XTRAIA XD (HR-XRD) XTRAIA CD-3200T AXI(Advanced X-ray Inspection) Alpha System in Demo (Beta System Under Development) Beta System Under Customer Review Hybrid Engine Step1 Validation XTRAIA MF- 3400(XRF/XRD Multifunction GEN4) ONYX 3200 Light-element Capability XTRAIA CD-3200G (Low Energy GI-SAXS) – Under Development Next Generation Logic Next Gen Memory Common to Next Generation Logic and Memory Mass Production Mass Production Mass Production Mass Production Mass Production XTRAIA CD-3300T(T-SAXS) Under Development Mass Production Mass Production $200M(>70%) New Market $100M(>50%) $100M(>50%) Mass Production Market and Objectives ◼ Timely launch of new products targeting Next - Generation Semiconductor development and mass production ◼ Targeting over 50% share of an estimated ~US$1.0 billion SAM for new products ◼ 2030 revenue target of approx. JPY 100 billion including existing products, supported by the capital and business alliance wi th Onto Key Updates ▪ Orders secured for Logic (plan to ship in FY27 1Q) ▪ POC started at Nano Terasu soft X-ray beamline ▪ Started shipping the 3200T equipped with Onto's model-based software; development of the new 3300T is underway. ▪ Developing TSV and void inspection as a killer application; β-version under development (evaluation units scheduled for shipment in 4Q26). ▪ Joint development of the CD-SAXS-OCD Hybrid Engine commenced. ▪ A total of 12 units have already been installed, with JEP completed at 4 major logic and memory customers; adoption for mass production commenced ▪ Shipments of the next-generation system (GEN4) started; adopted by major logic and memory customers ▪ AI ultrathin-film measurement positioned as a killer application; evaluation started with three logic companies and two memory companies. ▪ Metrology for Defects in 3D DRAM Multilayer Films XRT-Micron (Lab/Near Fab) XTRAIA XT-3000 Mass Production $50M(>50%) 3DDRAM/300mmSiC ▪ Developed in-line 300 mm Fab versions; sales launched through semiconductor sales channels. H.E. Step2 Co-optimization OCD-Based Software to Be Integrated into T-SAXS Mass Production
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Strengthening Customer Support Through Global RTCs 15 RTC – Silicon Valley RTC - Taiwan ( Hsinchu ) RTC - China （ Shanghai ） ◼ Rigaku is expanding its global RTC (Rigaku Technology Center) network to support customers locally from advanced process development through mass production. Following Silicon Valley and Taiwan, RTC - China (Shanghai) is planned to open in FY2026. ⚫ Accelerate sales support and customer evaluations through sample demonstrations ⚫ Establish an advanced applications support organization, including the recruitment and training of application scientists ⚫ Enhance service capabilities through training programs and local spare - parts inventory
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Toward 2030 and Beyond 2030 1616 Semiconductor Future Roadmap Rigaku Strength ◼ Rigaku is well positioned to capture demand from high - end semiconductor technology challenges both toward 2030 and beyond 2030, potentially leading to strong continued and sustainable growth Illustrative Revenue of Rigaku’s Semiconductor PC Business (1) Toward 2030 Beyond 2030 Mid - to - Long Term Target (Image) High Aspect Ratio Deep Hole Non-Destructive Measurement New Material, Bumps and TSV Defect Non-Destructive Measurement Metrology Ultra High Precision/Non- Destructive 3D Structure Measurement (JPY Bn) ▪ GAA ▪ Backside Power Delivery ( BSPDN) ▪ High NA EUV ▪ New Material ▪ CFET ▪ 2D Transistor ▪ CNTFET ▪ Hyper NA EUV ▪ 500+ 3D NAND ▪ HBM 4/5 ▪ Highly Stacked DRAM ▪ 3D DRAM ▪ MRAM / FeRAM ▪ IMC (In - memory computing) ▪ CoWoS ▪ Chiplet ▪ Si Interposer ▪ CPO ▪ Optical Interconnect ▪ Glass Substrate ▪ Advanced Thermal Solutions Logic Advanced Packaging Memory Adv. Logic Advanced Packaging Memory Others WFE 10 Note: 1. The chart is for illustrative purposes only and conceptually presents future growth opportunities 18.6 23.3 27.8 FY23 FY24 FY25 Semiconductor Market Growth ｘ Market Creation and Share Expansion Through Breakthrough Products ＝ Growth of Rigaku’s Semiconductor Process Control Instruments Business
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries FY26 Earnings Forecast
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries FY26 Consolidated Earnings Forecast – Unchanged at this point in time Notes: 1. Profit shall be read as profit attributable to owners of parent 2. Dollar sensitivity: Approximately JPY 0.2 billion for revenue and JPY 0.04 billion for operating profit.EUR sensitivity: Approximately JPY 0.07 billion for revenue and JPY 0.03 billion for operating profit. 3. Comparison is based on exchange rates equivalent to the previous fiscal year. 18 FY25 FY26 (2) YoY Revenue 94.1 101.0 +7.2 ％ Operating Profit 16.7 19.4 +16.1 ％ Operating Profit Margin (%) 17.7 ％ 19.3 ％ +1.6pt Profit Before Tax 15.9 18.4 +15.2 ％ Profit(1) 11.4 12.5 +9.6 ％ (JPY Bn) EBITDA 218 253 +15.9% EBITDA Margin (%) 23.2% 25.1% +1.9pt Basic EPS (Yen) 50.19 55.27 - Initial Guidance ◼ Overall r evenue expected to grow by +9% (3) , in line with the mid - term management plan ◼ The strategy is to offset higher R&D and SG&A expenses, through gross margin expansion, thereby improving profit margins ◼ Multipurpose Analytical Instruments: 4% (3) growth ◼ Semiconductor Process Control Instruments: 21% (3) growth Key Changes as of 1H ◼ Multipurpose Analytical Instruments: Revenue recovery slower than planned ◼ Semiconductor Process Control Instruments: Momentum stronger than initially expected ◼ Components & Services: On track for the full year ◼ Gross margin improvement remains a key 2H priority ◼ Limited impact from Middle East tensions; monitoring closely. Current Full - Year Outlook ◼ Revenue: Expect upside potential ◼ Profitability: Margin visibility needs to be improved towards 2H
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Conclusion 19 ◼ Clear FY26 Growth Trajectory ⚫ Order intake in Multipurpose Analytical Instruments returned to growth in 2Q, expecting to contribute a meaningful revenue growth mainly in the industrial sector from 2H. ⚫ Semiconductor Process Control Instruments continues to outperform expectations, with solid progress on new products including JEP instruments. ◼ Positioned for Mid-Term Growth ⚫ Despite current assessments of the AI market remain volatile, innovation remains intact beyond 2030, supporting Rigaku’s growth story unchanged. ⚫ The Onto Innovation alliance remains on track to close in 2H FY26, accelerating the rollout of hybrid metrology solutions.
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Appendix
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries FY26 2Q Performance Summary by Category（by Region) 21 2.0 1.8 2.5 1.8 0.9 0.6 0.5 0.5 0.4 0.8 6.5 5.8 FY25 2Q FY26 2Q 1.5 2.2 1.8 1.5 2.5 1.9 1.1 1.0 1.8 1.6 8.9 8.4 FY25 2Q FY26 2Q 0.5 0.7 1.5 2.10.3 0.21.3 3.5 0.8 0.6 4.6 7.4 FY25 2Q FY26 2Q Japan Americas Europe Asia (excl. China) China FY25 2Q FY26 2Q YoY Revenue 8.9 8.4 - 6.1% Operating Profit 1.3 0.3 - 77.3% Margin (%) 15.0% 3.6% - 11.3pt Multipurpose Analytical Instruments Semiconductor Process Control Instruments （ JPY Bn ） Components and Services FY25 2Q FY26 2Q YoY 4.6 7.4 +60.0% 0.8 1.4 +69.4% 17.9% 18.9% +1.0pt FY25 2Q FY26 2Q YoY 6.5 5.8 - 11.3% 1.5 0.6 - 60.1% 23.3% 10.5% - 12.8pt • Japan: Industry shift progressing well • Americas: Revenue decline moderating • China: Delay in tax incentive approval shifts revenue into 2H. • Europe: Weak market conditions in both academia and industry • Strong DRAM demand drove robust growth in Asia. • Clear recovery in North American IDMs. • A significant revenue decline in the Americas due to the shift in other analytical instrument sales into 2H.
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries FY25 1H FY26 1H YoY Revenue 18.1 15.0 - 17.1% Operating Profit 2.5 0 - 98.6% Margin (%) 14.3% 0.2% - 14.0pt FY26 1H Performance Summary by Category 22 3.4 4.0 1.6 5.4 1.3 2.0 1.0 2.0 1.6 0.6 1.6 2.1 10.8 12.7 FY25 1H FY26 1H Components and Services Others Power Device WFE Advanced Logic/Foundry 8.0 5.8 2.4 1.6 1.5 1.4 6.0 6.0 18.1 15.0 FY25 1H FY26 1H Life Science Other Industries Academia/ Government Semiconductor/ Electronic Components Multipurpose Analytical Instruments Semiconductor Process Control Instruments 6.5 5.8 5.2 5.8 11.7 11.6 FY25 1H FY26 1H Services （ JPY Bn ） • Academia - sector weakness due to Trump administration policies has persisted longer than expected. • Improved sales mix maintained gross margin, while continued SG&A investment reduced profits • The shift from academia to industry gained traction, with orders rebounding in 2Q. • Strong revenue growth in memory and logic. • Gross margin impacted by higher 1Q costs and product/customer mix. • New product revenue weighted toward 2H, with margins expected to improve from 1H. • Services: Revenue grew 13% YoY driven by pricing and sales expansion initiatives. • Overall revenue was flat YoY, while operating profit declined due to the 2H shift in other analytical instrument revenue. Components and Services FY25 1H FY26 1H YoY 10.8 12.7 +18.2% 2.4 1.9 - 19.0% 22.7% 15.6% - 7.1pt FY25 1H FY26 1H YoY 11.7 11.6 - 0.5% 2.1 1.6 - 22.7% 18.0% 14.0% - 4.0pt Components and Other Analytical Instruments Memory
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries FY26 2Q Performance Summary by Category（by Region) 23 4.3 4.3 3.8 3.4 1.6 1.3 0.8 1.0 0.9 1.5 11.7 11.6 FY25 1H FY26 1H 5.1 5.0 3.8 2.8 3.8 2.8 2.4 1.8 2.8 2.5 18.1 15.0 FY25 1H FY26 1H 2.2 2.3 2.7 4.0 1.0 0.4 2.9 4.4 1.7 1.610.8 12.7 FY25 1H FY26 1H Japan Americas Europe Asia (excl. China) China Multipurpose Analytical Instruments Semiconductor Process Control Instruments Components and Services FY25 1H FY26 1H YoY Revenue 18.1 15.0 - 17.1% Operating Profit 2.5 0 - 98.6% Margin (%) 14.3% 0.2% - 14.0pt FY25 1H FY26 1H YoY 10.8 12.7 +18.2% 2.4 1.9 - 19.0% 22.7% 15.6% - 7.1pt FY25 1H FY26 1H YoY 11.7 11.6 - 0.5% 2.1 1.6 - 22.7% 18.0% 14.0% - 4.0pt （ JPY Bn ）
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries FY26 1H Analysis of Consolidated Operating Profit（YoY） 24 14.0% 6.5% -1.0% ‐1.4% -0.9% -4.2% +0.0% ◼ Operating Profit Margin: 6 .5% (down 7.5pt YoY) • Gross margin declined primarily due to higher COGS associated with semiconductor process control instruments, including one - off factors in 1Q, foreign exchange effects and upfront investments • In addition to lower revenue, continued strategic investments increased the ratios of R&D and SG&A expenses to sales SG&A and Others - 6.5pt FY25 1H GM decline due to higher 1Q costs and changes in product/customer mix Higher SG&A Ratio due to Lower Revenue R&D Expenses Other SG&A Expenses FX Losses FY26 1H GM - 1.0pt Personnel Expenses - 3.1pt (Overseas - 2.7pt) (Domestic - 0.4pt)
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Operating Profit Analysis: FY25 Actual vs. FY26 Forecast 25 17.7% 19.3% +0.6% ‐0.6% +2.3% -1.4% +0.7% Note : 1. Includes a reclassification of service technical support costs equivalent to +0.3% from cost of sales to SG&A expenses (1) GM％ +2.2pt SG&A and Others -0.7pt Key Drivers of Operating Profit Improvement Continued increase in revenue share of Semiconductor Process Control Instruments Volume growth and tight control of other manufacturing costs offsetting impact of higher fixed costs in COGS Onetime FX valuation loss (The forecast assumes no valuation gains or losses) Tight control of SG&A excluding R&D Improved overall profitability driven by better product mix and pricing actions, alongside a higher share of high - GM new semiconductor products FY25 Actual Increased Semiconductor Revenue Increased COGS Pricing/Product Mix SG&A (incl. R&D) FX Losses FY26 Forecast
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Profit & Loss by Product (Management Accounting Basis)(1) 26 Note: 1. This information has been prepared as reference material to aid investors’ understanding. As corporate expenses are not included, consolidated operating profit does not reconcile with the sum of each category. 予想/Fct (10億円)/(JPY Bn) 1Q 2Q 3Q 4Q Full-year 1Q 2Q 3Q 4Q Full-year 多目的分析機器/Multipurpose Analytical Instruments 売上収益/Revenue 9.2 8.9 8.3 13.9 40.4 6.6 8.4 - - 41.5 営業利益/Operating Profit 1.2 1.3 0.4 3.1 6.2 -0.2 0.3 - - 6.2 営業利益率/Operating Margin 13.6% 15.0% 5.4% 22.7% 15.4% -4.0% 3.6% - - 14.9% 半導体プロセス・コントロール機器/Semiconductor Process Control Instruments 売上収益/Revenue 6.1 4.6 4.2 12.7 27.8 5.3 7.4 - - 33.3 営業利益/Operating Profit 1.6 0.8 -0.0 5.6 8.0 0.5 1.4 - - 10.4 営業利益率/Operating Margin 26.3% 17.9% -1.9% 44.7% 29.0% 10.9% 18.9% - - 31.4% 部品・サービス/Components and Services 売上収益/Revenue 5.1 6.5 6.1 8.0 25.9 5.8 5.8 - - 26.0 営業利益/Operating Profit 0.5 1.5 1.1 1.8 5.1 1.0 0.6 - - 4.7 営業利益率/Operating Margin 11.2% 23.3% 19.0% 23.2% 19.8% 17.4% 10.5% - - 18.3% 連結合計/Consolidated Total 売上収益/Revenue 20.6 20.1 18.7 34.6 94.1 17.9 21.6 - - 101.0 営業利益/Operating Profit 2.8 2.8 0.8 10.1 16.7 0.6 1.9 - - 19.4 営業利益率/Operating Margin 13.8% 14.3% 4.5% 29.2% 17.7% 3.5% 9.0% - - 19.3% FY25 FY26
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Revenue Breakdown by Region and End-Market 27 Revenue by End-Market Revenue by Region FY25 FY26 (10 億円 )/(JPY Bn) 1Q 2Q 3Q 4Q Full - year 1Q 2Q 3Q 4Q Full - year 日本 /Japan 7.7 4.1 4.8 10.7 27.4 6.9 4.8 - - - 米州 /Americas 4.5 5.9 4.0 8.9 23.4 4.6 5.5 - - - 欧州 /EMEA 2.7 3.8 2.6 4.6 13.8 1.7 2.8 - - - アジア ( 中国以外 )/Asia (ex. China) 3.1 3.0 3.7 6.9 16.8 2.0 5.2 - - - 中国 /China 2.3 3.2 3.4 3.5 12.5 2.5 3.1 - - - 売上収益合計 /Total Revenue 20.6 20.1 18.7 34.6 94.1 17.9 21.6 - - - FY25 FY26 (10 億円 )/(JPY Bn) 1Q 2Q 3Q 4Q Full - year 1Q 2Q 3Q 4Q Full - year 半導体・電子部品 / Semiconductor/Electronic Components 7.7 6.1 4.9 14.3 33.3 6.0 8.7 - - - ライフサイエンス /Life Science 0.9 0.8 1.3 1.9 5.0 0.8 0.9 - - - その他産業 /Other Industries 3.4 3.5 3.5 5.1 15.7 3.4 4.1 - - - アカデミア & ガバメン ト / Academia/Governments 4.6 5.9 5.1 9.1 24.8 3.1 3.6 - - - サービス /Services 3.7 3.6 3.7 4.1 15.1 4.4 4.1 - - - 売上収益合計 /Total Revenue 20.6 20.1 18.7 34.6 94.1 17.9 21.6 - - -
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Consolidated Quarterly Financial Results Note: 1. Gross profit for FY25 Q1 has been restated by reclassifying certain expenses to align with the FY26 cost structure. As a r esu lt, the figures differ from those originally disclosed. From FY25 Q2 onward, the same classification as FY26 is applied. 28 予想/Fct (10億円)/(JPY Bn) 1Q 2Q 3Q 4Q Full-year 1Q 2Q 3Q 4Q Full-year 売上収益/Revenue 20.6 20.1 18.7 34.6 94.1 17.9 21.6 - - 101.0 売上総利益 (1) /Gross Profit (1) 11.5 11.1 9.7 20.4 52.8 9.7 11.9 - - 58.9 営業利益/Operating Profit 2.8 2.8 0.8 10.1 16.7 0.6 1.9 - - 19.4 税引前利益/Profit Before Taxes 2.7 2.7 0.6 9.8 15.9 0.4 1.6 - - 18.4 当期利益/Net Profit 1.9 1.8 0.4 7.1 11.4 0.3 1.2 - - 12.5 基本的EPS（円）/Basic EPS (JPY) 8.52 8.23 2.18 31.38 50.19 1.46 5.74 - - 55.27 Non-IFRS Indicator 調整後営業利益/Adjusted Operating Profit 3.3 3.3 1.3 10.6 18.6 1.1 2.4 - - 21.5 調整後当期利益/Adjusted Net Profit 2.2 2.1 0.8 7.4 12.7 0.6 1.6 - - 13.9 調整後EPS（円）/Adjusted EPS (JPY) - - - - 55.19 - - - - 61.40 EBITDA 4.0 4.1 2.1 11.5 21.8 2.0 3.3 - - 25.3 調整後EBITDA/Adjusted EBITDA 4.0 4.0 2.1 11.4 21.7 2.0 3.3 - - 25.3 対売上収益比率/Adjusted EBITDA Margin 19.6% 20.0% 11.7% 33.0% 23.0% 11.3% 15.5% - - 25.1% ROE - - - - 13.4% - - - - 13.5% 調整後ROE/Adjusted ROE - - - - 14.9% - - - - 15.0% 研究開発費/R&D Expenses 1.6 1.8 1.8 1.9 7.3 1.7 2.0 - - 8.5 設備投資額/CAPEX 0.6 3.4 1.0 1.5 6.6 1.0 1.9 - - 7.7 減価償却費/Depreciation 1.2 1.2 1.3 1.3 5.1 1.4 1.4 - - 5.8 JPY/USD 151.2 147.5 147.8 149.8 149.8 156.5 158.6 - - 145.0 JPY/EURO 159.4 162.2 165.6 169.5 169.5 183.5 184.8 - - 165.0 FY25 FY26
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries FY26 1H Consolidated B/S & Cash Flow Note : 1. Figures as of the end of FY25 (December 2025) are calculated using LTM total adjusted EBITDA 29 B/S Cash Flow Key Indicators (10億円)/(JPY Bn) FY25 Year-end FY26 2Q Changes 流動資産/Current Assets 76.2 77.7 1.4 現預金/Cash and Cash Equivalents 24.2 27.2 2.9 棚卸資産/Inventories 20.8 25.8 4.9 非流動資産/Non-Current Assets 108.9 109.8 0.9 有形固定資産/Property, Plant & Equipment 22.6 24.2 1.6 のれん、無形資産など/Goodwill, Intangible Assets, etc. 86.3 85.6 -0.6 資産合計/Total Assets 185.2 187.6 2.4 (10億円)/(JPY Bn) FY25 Year-end FY26 2Q Changes 負債/Liabilities 96.8 98.4 1.6 有利子負債/Interest-Bearing Debt 62.1 66.9 4.7 その他負債/Other Liabilities 34.6 31.5 -3.1 資本合計/Total Equity 88.3 89.1 0.7 負債・資本合計/Total Liabilities and Equity 185.2 187.6 2.4 31.1 24.7 -6.4 営業債権、その他流動資産など/ Trade Receivables, Other Current Assets, etc. (10億円)/(JPY Bn) FY25 1H FY26 1H Changes 営業キャッシュ・フロー/Operating Cash-Flow 6.9 2.9 -3.9 投資キャッシュ・フロー/Investing Cash-Flow -4.0 -3.0 1.0 フリーキャッシュ・フロー/Free Cash-Flow 2.8 -0.1 -2.9 財務キャッシュ・フロー/Financing Cash-Flow -0.4 2.4 2.9 為替換算差異/Impact on Exchange Rate -1.4 0.6 2.0 ネットキャッシュ・フロー/Net Cash-Flow 0.9 2.9 2.0 FY25 Year-end FY26 2Q Changes 自己資本比率/Equity Ratio 47.7% 47.5% - ネットデット÷調整後EBITDA (1) / Net Debt / Adjusted EBITDA (1) 1.7x 2.1x -
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Reconciliation of Adjusted Items (1/2) 30 予想/Fct 1Q 2Q 3Q 4Q Full-year 1Q 2Q 3Q 4Q Full-year 2.7 2.7 0.6 9.8 15.9 0.4 1.6 - - 18.4 減価償却費及び償却費/Depreciation and Amortization 1.2 1.2 1.3 1.3 5.1 1.4 1.4 - - 5.8 支払利息/Interest Expenses 0.2 0.2 0.2 0.3 1.1 0.2 0.3 - - 1.5 受取利息及び配当金/Interest and Dividend Income -0.1 -0.1 -0.1 -0.0 -0.4 -0.0 -0.0 - - -0.4 減損損失/Impairment Losses - - - 0.0 0.0 - - - - 0.0 4.0 4.1 2.1 11.5 21.8 2.0 3.3 - - 25.3 利益率/Margin 19.6% 20.4% 11.7% 33.2% 23.2% 11.3% 15.5% - - 25.1% 1Q 2Q 3Q 4Q Full-year 1Q 2Q 3Q 4Q Full-year 4.0 4.1 2.1 11.5 21.8 2.0 3.3 - - 25.3 コンサルティング・フィー/Business Consulting Fee - - - - - - - - - 0.0 中国免除申請関連費用/China-related exemption application costs - -0.0 - -0.0 -0.1 - - - - 0.0 調整項目計/Total Adjustments - -0.0 - -0.0 -0.1 - - - - 0.0 4.0 4.0 2.1 11.4 21.7 2.0 3.3 - - 25.3 利益率/Margin 19.6% 20.0% 11.7% 33.0% 23.0% 11.3% 15.5% - - 25.1% EBITDA 税引前利益/Profit Before Taxes EBITDA 調整後EBITDA FY26 EBITDA 調整後EBITDA/Adjusted EBITDA (10億円)/(JPY Bn) FY25
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Reconciliation of Adjusted Items (2/2) 31 予想/Fct 1Q 2Q 3Q 4Q Full-year 1Q 2Q 3Q 4Q Full-year 2.8 2.8 0.8 10.1 16.7 0.6 1.9 - - 19.4 PPA償却費/PPA Amortization 0.5 0.5 0.5 0.5 2.0 0.5 0.5 - - 2.1 コンサルティング・フィー/Business Consulting Fee - - - - - - - - - 0 中国免除申請関連費用/China-related exemption application costs - -0.0 - -0.0 -0.1 - - - - 0 減損損失/Impairment Losses - - - 0.0 0.0 - - - - 0 調整項目計/Total Adjustments 0.5 0.4 0.5 0.4 1.9 0.5 0.5 - - 2.1 3.3 3.3 1.3 10.6 18.6 1.1 2.4 - - 21.5 利益率/Margin 16.3% 16.5% 7.2% 30.6% 19.8% 6.4% 11.4% - - 21.3% 1Q 2Q 3Q 4Q Full-year 1Q 2Q 3Q 4Q Full-year 1.9 1.8 0.4 7.1 11.4 0.3 1.2 - - 12.5 PPA償却費/PPA Amortization 0.5 0.5 0.5 0.5 2.0 0.5 0.5 - - 2.1 コンサルティング・フィー/Business Consulting Fee - - - - - - - - - 0 中国免除申請関連費用/China-related exemption application costs - -0.0 - -0.0 -0.1 - - - - 0 減損損失/Impairment Losses - - - 0 0 - - - - 0 調整項目計/Total Adjustments 0.5 0.4 0.5 0.4 1.9 0.5 0.5 - - 2.1 調整項目に対する税金等調整/Tax Adjustments to Total Adjusted Items -0.1 -0.1 -0.1 -0.1 -0.6 -0.1 -0.1 - - -0.7 2.2 2.1 0.8 7.4 12.7 0.6 1.6 - - 13.9 利益率/Margin 11.0% 10.7% 4.5% 21.5% 13.5% 3.8% 7.6% - - 13.8% 調整後当期利益/Adjusted Profit 調整後営業利益/Adjusted Operating Profit 調整後当期利益/Adjusted Profit 営業利益/Operating Profit (10億円)/(JPY Bn) 調整後営業利益/Adjusted Operating Profit 当期利益/Profit FY25 FY26
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Rigaku at a Glance
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Company Highlights 21% JPY 94.1Bn Revenue Global No.1 Semiconductor FEOL X-Ray Metrology Market Share(6) Global No.2 Domestic No.1 X-ray Diffraction（XRD） Market Share(4)(5) 71% Overseas Revenue Ratio(3) Financial Profiles with Best-in-Class Growth and Margin (2025/12) Company at a Glance ◼ A global leader in advanced X - ray technology with 75 years of innovation history ◼ Achieving industry leading profitability through strong R&D capabilities ◼ Delivering high EBITDA margins and sustained growth, driven by 20 % + growth in semiconductor process control JPY 21.7Bn （Margin: 23.0%） EBITDA(2) Note: 1. CAGR for the 3-year period from FY2022 to FY2025 2. EBITDA=Profit before income taxes + depreciation & amortization + impairment losses − interest income & dividends received + interest expenses 3. Calculated based on revenue from overseas customers and distributors 4. Strategic Directions International, Inc.「SDi Global Assessment Report 2025) 43% 30% 27% 32% 42% 26% Revenue (Outer) and Operating Profit (Inner) by Business Multipurpose Analytical Instruments Components and Services Semiconductor Process Control Instruments Semiconductor Process Control Instruments Revenue CAGR(1) 5. R&D Co., Ltd. “Scientific Instrument Yearbook 2025” 6. Yole Intelligence 「2026 Yole Group Japan Visits - The Semiconductor Industry Trends」 7. Excludes revenue from the Parts & Services business, as well as parts and services revenue within the Semiconductor Process Control Equipment business 27% 7% 20%8% 38% Revenue by End-Markets (excl. components & services(7)) Semiconductor/ Electronic Components （Multipurpose） Industrial Use：73% Other Industry （Metals、Batteries、Petrochemicals、 Ceramics、Security） Life Science Semiconductor Process Control Instruments Academia/ Government Operating Platform for Diversified End Markets (2025/12) 33
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Rigaku’s Competitive Edge 34 Technology Resources ◼ Rigaku’s core competitive edge lies in its integrated business model, under which the company manufactures its core components in-house — enabling to create high value-added products, strong customer trust leading to a high retention rate among top-tier industry players ◼ Highly skilled X-ray technicians ＃ of Researchers & Developers Approx. 300 # of X-ray related patents granted by USPTO(2) 212 High-performance Equipment High-speed measurement, high resolution & energy saving Shortened Development Cycle Scale Advantage X-ray Generators Pioneer rotating target technology to achieve strong X-ray brightness Optical Components Advanced multilayer optics for X-ray and EUV Analytical Software AI analysis which visualizes complex structures for metrology X-ray Detectors In-house production of semiconductor for X-ray detectors Rigaku’s Ability to Maximize Performance Through Best Combination In-house Developed Core Components Advantages of In-house Manufacturing Notes: 1. Approximate # of research and development personnel engaged in basic research & product development as of the end of October 2025 2. # of X-ray related patents granted by The United States Patent and Trademark Office as of December 2025. 3. TechInsights, Inc.「Capital Expenditure Forecast June 2024」 Strong Track Record with Industry Leaders / Stickiness with Customers SEMI Pharma-ceutical Chemicals 95%> Serving All 10 Players Out of Global Top 10 Players(3) Repeat Order Acceptance Rate from Existing Customers of XRD and/or XRF(10) (Average Over Last 10 Years) Serving All 10 Players Out of Domestic Top 10 Players(4) Out of Domestic Top 10 Players(5) Serving All 10 Players 4. Based on 2023 TOPIX Pharmaceuticals revenue rankings. 5. Based on 2023 TOPIX Chemicals revenue rankings.
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Seeing the Unseen: Rigaku’s X-Ray Solutions 35 35 X-ray Diffraction X-Ray Imaging / X-Ray CT X-ray Fluorescence X-ray Fluorescence / X-ray Diffraction / X-ray Reflectometry 1mm 700nm 400nm 10nm 1Å X-ray Metrology Micro / nano Measurements: Sub-nanoscale resolution 3D Capability: Non-destructive analysis with X-ray transmission Element Identification: Composition analysis with X-ray fluorescence Fiber / Polymer Battery Structure Atom X-ray Diffraction X-ray Reflectometry Small Angle X-ray Scattering X-ray FluorescenceX-Ray Imaging X-Ray CT Crystal Molecule Protein Semi ◼ Rigaku Established Metrology Solutions for Diverse Analytical Needs Amid the Increasing Inspection / Metrology Needs in Miniature Space SmartLab WaferX 310ZSX Primus Ⅳ QualanaMiniFlex CT Lab HVXRTmicron CT Lab HR160
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Key Products by End Market（Multipurpose Analytical Instruments） 〈 Batteries 〉 Crystal structure and nanostructure analysis ✓ X - ray diffraction (XRD) ✓ X - ray fluorescence (XRF) ✓ Small - angle X - ray scattering (SAXS) ◼ Semiconductor/Electronic Components 〈 Semiconductor 〉 Composition analysis & reliability evaluation ✓ Thermal analysis / X - ray fluorescence (XRF) ◼ Life Science Pharmaceuticals & biomolecular structure analysis ✓ X - Ray Diffraction （ XRD ） ✓ Electron density topography ◼ Academia/Government Basic Research & Materials Analysis ✓ X - Ray Diffraction （ XRD ） ◼ Other Industry Raw material composition & quality control ✓ X - ray fluorescence (XRF) ✓ X - ray diffraction (XRD) SmartLab MiniFlex ZSX Primus Ⅳ MiniFlex ZSX Primus Ⅳ CT Lab HV Universities and Research Institutions Ceramics BatterySemiconductor/ Thin films Metals SmartLab ZSX Primus Ⅳ Oil and Natural Gas 36 XtaLAB Synergy - ED MoleQlyze Pharmaceuticals
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Key Products Across the Semiconductor Manufacturing Process 37 ▪ Inspection for contamination, foreign material, and defects ▪ Thickness and composition measurement of bumps, wiring, and electrodes, that increases with chiplet integration ▪ TSV(2) defect inspection ▪ Compatible with advanced solutions like CoWoS and HBM Bump Composition and Shape Measurement for Advanced Packaging ONYX 3200 SnAg Bump Composition and Shape Wafer Manufact- uring Pattern Transfer Cleaning Deposition Cleaning Exposure Development Resist Coating Resist Stripping Implantation of Impurities Etching New Developing New Product Molding Microbump Composition CoW・WoW(1) Bonding Final Inspection Dicing Packaging Note: 1. CoW = Chip on Wafer, WoW = Wafer on Wafer 2. TSV = Through Silicon Via ▪ Includes composition and crystallinity measurement ▪ Expanding needs for sub-nano measurements due to thinner films and multilayering Thin Film / Resist Thickness Measurement XTRAIA XD-3300 Film thickness/ Density / Crystallinity WaferX 310 Thickness / Composition XTRAIA MF-3400 Film thickness / Density / Composition / Crystallinity ▪ Inspects surface contamination in every phases of the front-end process Surface Contamination Inspection TXRF310 Fab TXRF-V310 Multipurpose Analytical Instruments ▪ Enables non-destructive evaluation of GAA structures and deep hole shape measurement for advanced memory Film Thickness and Resist / Hard Mask Shape Analysis XTRAIA CD-3200T Nano Shape XTRAIA CD-3010G Nano Shape WaferX 310 Thin Film Thickness and Composition ◼ Rigaku’s Products Offer Advanced Inspection / Metrology Solutions Essential for Manufacturing Cutting-edge Semiconductors ONYX 3200 Film thickness / Composition
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Rigaku’s Long-Term Strategy: Three Pillars of Growth 38 ▪ Leverage Rigaku’s Exceptional X-ray Core Technology and Strong Customer Base to Address Diversifying and Advancing R&D Needs of Customers ▪ Expanding Global Market Share through Active Investment in Overseas Commercial Infrastructure ▪ Drive the “Lab to Fab” Strategy and Solidify Rigaku’s Firm Position as the Global Leader in the Semiconductor X -ray Metrology Field ▪ Expand Business Domains by Providing new Solutions that Address the Miniaturization and Multi -layering Trends in the Semiconductor Industry ▪ Expand the “Lab to Fab” Strategy into Innovation-driven Industrial Sectors and Accelerate the Transformation of Multipurpose Analytical Instruments for Fabrication Use Leveraging Fundamental Strengths Increasing Demand for Leading-edge X-ray Solutions in Multi-purpose Analytical Instruments Driving the “Lab to Fab” Business Model in Semiconductors X-ray Technology Essential for Advancement of Semiconductor Industry Expanding Deployment of the “Lab to Fab” Strategy Creating New Markets by Developing Novel Applications Pillar1 Pillar3Pillar2 Multipurpose Analytical Instruments Semiconductor Process Control Instruments Multipurpose Analytical Instruments ◼ Establish Solutions to Meet the Cutting-edge Inspection / Metrology Demands for Each Application, and Aim for Medium to Long-term Growth Through the Promotion of the "Lab to Fab" Strategy ▪ Enhancement of Global Supply Chain ▪ Expansion of the Service Business ▪ Providing Solutions Aligned with Semiconductor Advanced Technology Trends ▪ Expanding Business Areas through Complementing Optical and CD Measurements (Hybrid Metrology) ▪ Enter the Advanced Packaging Inspection Market ▪ Power Device (Next-generation Compound Semiconductors) ▪ Battery (All / Semi-solid-state Batteries) ▪ Life Science (Biopharmaceuticals) Base Strategy Focus Area
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Inspection / Metrology Needs from the Advanced Semiconductor Manufacturing Logic Memory Advanced Packaging Multilayering / Multistacking / Film ScalingMultilayeringNAND <200 Layers 200-500 Layers >500 Layers Miniaturization Three-dimensional MiniaturizationDRAM CoWoS(4) S CoWoS L CoWoS R Bump Scaling / Chiplets / Number of Chips Increases Note: 1. GAA = Gate All Around 2. CFET = Complementary FET 3. HBM = High Bandwidth Memory MiniaturizationLogic HBM3(3) Bump Size 15µm HBM4 Bump Size<12µm Bump Scaling and Becoming Denser / Bump→Hybrid Bonding HBM3E Bump Size 13µm … Miniaturization / Multi-layered Materials Three-dimensional / Shape Complexity HBM HBMLogic Substrate Substrate Logic HBMHBM Substrate LogicHBM HBM PassiveLSI LSI Planar FET FinFET GAA(1) CFET(2) Advanced 2D DRAM 3D DRAM Semiconductor Technology Roadmap by Applications 1-3 years 3-5+ yearsPast ◼ The Semiconductor Manufacturing Process is Reaching a Turning Point due to Miniaturization and Multi -layered Materials, Making High-precision Inspection / Metrology Technologies Increasingly Irreplaceable 3. HBM 4. CoWoS 3. HBM = High Bandwidth Memory 39
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Mid-Term Value Creation Plan 40 40 Plan Base Year (2023/12) 2025/12 （Actual） 2026/12 （Forecast） Medium-term Goals (2027/12) Revenue (YoY) JPY 79.8 Bn 27.4 % JPY 94.1 Bn 3.9% JPY 101.0 Bn 7.2% JPY 115~120 B n (1) (CAGR Approx. 10%) Adj. EBITDA (2) (Adj. EBITDA Margin) JPY 20.2 Bn 25.3% JPY 21.7 Bn 23.0% JPY 25.3 Bn 25.1% JPY 31.5~32.5 B n Approx. 27% Adj. Operating Profit (3) (Adj. OP Margin) JPY 18.3 B n 22.9% JPY 18.6 Bn 19.8% JPY 21.5 Bn 21.3% JPY 26.5~27.5 B n Approx. 23% Shareholder Return ‐ JPY 18.8 /share JPY 19.0 /share Dividend Payout Ratio Approx. 30% R&D Ratio (4) 6.5 % 7.8% 8.5% Approx. 9 % CAPEX Ratio (5) 3.5 % 7.1% 7.7% Approx. 5 % (6) Headcount (7) 1,994 2,226 2,351 2,500~2,600 Note: 1. The Revenue range for the Medium-term Goal in FY2027 is set within 5% of the amount of Revenue goal in FY2027 (the Adj. EBITDA, Adj. Operating Profit and Headcount ranges for the Medium-term Goals in FY2027 are also set in a similar manner). The YoY Growth Rate of Revenue for the Medium-term Goal in FY2027 means CAGR of Revenue in the four-year period through FY2027 in comparison to FY2023, with the revenue forecast for each fiscal year from FY2025 to FY2027 calculated, applying the assumed exchange rates of 145 yen per dollar and 156 yen per euro 2. EBITDA=Profit before income taxes + depreciation & amortization + impairment losses − interest income & dividends received + interest expenses EBITDA Margin = EBITDA / Revenue 3. Operating Profit = Operating Profit + PPA Amortization + Impairment Losses + One Time Costs Operating Profit Margin = Operating Profit / Revenue 4. R&D Ratio = R&D Expenses / Revenue 5. Capex Ratio = Capex / Revenue Capex is calculated as the amount of capex excluding right -of-use assets 6. The Capex Ratio for the Medium-term Goal in FY2027 does not include in its numerator the portion of capex for any investmen t in large-scale plant upgrading and expansion after Yamanashi Plant, which is not planned as of the date of this Medium -term Business Plan. 7. Headcount is presented as the sum of total employees at the fiscal year -end plus the average number of temporary employees throughout the fiscal year Overall Medium-term Goals (Company-wide) Revenue Growth Target by Product Category (JPY Bn) 35.8 46.5～48.5 2023/12 2027/12 Multipurpose Analytical Instruments Semiconductor Process Control Instruments Components and Services 18.6 35.0~36.5 2023/12 2027/12 25.3 33.5~35.0 2023/12 2027/12 CAGR (2023~2027) 8% 18% 7% ◼ Target Revenue CAGR of Approx. 10% Driven by a Strong Growth in Semiconductor Process Control Instruments
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Glossary
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Glossary (1/3) 42 Terms Description AXI • Advanced X - Ray Inspections is a non - destructive and automated method that uses X - rays to inspect internal defects (such as voids, cracks, and misalignments) in electronic components, semiconductors, and industrial products CFET • Complementary FET (CFET) is a next generation semiconductor technology which vertically integrates N - and P - type FETs. It enable s continued scaling beyond the current mainstream technologies such as FinFET and GAA CoWoS • Chip - on - Wafer - on - Substrate is a 2.5D packaging technology developed by TSMC for high - performance computing. It integrates multiple chips on a silicon interposer mounted on a substrate, enabling high - speed, high - bandwidth data processing in a compact package. DicifferX WAXS Edition • An advanced X - ray analysis device that precisely and rapidly measures atomic and molecular structures, crystal phases, and molec ular orientations in materials such as polymer films, fibers, and thin films within just a few seconds Electron Density Topography • A technique for visualizing the electron density distribution within a crystal or molecule EUV • Abbreviation for “Extreme Ultraviolet”, which refers to an exposure technology that uses extreme ultraviolet light of ~13.5nm , u sed as a light source in advanced semiconductor lithography GAA • Abbreviation for “gate - all - around” transistor technology, which refers to a modified transistor structure where the gate contact s the channel from all sides and enables continued scaling GaN • Gallium Nitride is a semiconductor material used in power electronics and RF applications
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Glossary (2/3) Terms Description Qualana • An advanced X - ray analysis device offering high - precision micro and wide - area mapping without positional deviation. It sensitive ly detects even light elements and, with Rigaku’s proprietary FP program, supports flexible quantitative thin - film analysis SiC • A compound semiconductor material consisting of silicon (Si) and carbon (C) SiGe • An alloy semiconductor material composed of silicon (Si) and germanium (Ge) TFXRD • An X - ray diffraction (XRD) system designed for high - precision evaluation of thin film properties in the semiconductor industry. It supports the measurement of thin films on large - diameter wafers, specifically 200 mm and 300 mm T - SAXS • Transmission Small - Angle X - ray Scattering – used for structural analysis of nanomaterials in transmission mode WFE • Abbreviation for “Wafer Fab Equipment”. Semiconductor manufacturing equipment used in the processes of creating electronic ci rcu itry and inspecting the conditions on wafers X - ray CT • X - ray CT enables non - destructive 3D imaging of internal structures by scanning density distributions XRD (Diffraction ) • X - Ray Diffraction (XRD) - a technique for obtaining information on the crystal structure of a sample from the diffraction patter n that occurs when a crystal sample is irradiated with X - rays. It is used to analyze powder samples and processed material samples 43
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries Glossary (3/3) Terms Description XRF (Fluorescence ) • X - Ray Fluorescence (XRF) - a technique for qualitative and quantitative analysis of elements using fluorescent X - rays, which are generated when a substance is irradiated with X - rays. It is broadly classified into wavelength dispersive (WDX) type and energy dispersive (EDX) type XRTmicron • High - resolution, high - speed X - ray topography system with a high - brightness source and dedicated optics. Non - destructive, fully automated detection of crystal defects in Si, SiC , GaN , and other single - crystal materials which enhances production efficiency XtaLAB Synergy ED • It is an electron diffraction system combining Rigaku’s single - crystal X - ray structure analysis and JEOL’s transmission electron microscope technologies. It enables structural analysis of submicron crystals which includes materials previously difficult to measure ZSX Primus III NEXT • A wavelength - dispersive X - ray fluorescence spectrometer by Rigaku ZSX Primus IV • An advanced model in the same WDXRF series developed by Rigaku 44
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Copyright 2026 Rigaku Holdings Corporation & its Global Subsidiaries This presentation contains forward-looking statements, plans, and strategies based on information available and judgments made by the Company at the time of preparation. These statements involve risks and uncertainties, and actual results may differ materially due to various factors such as economic conditions and market trends. This material is not intended as a solicitation to buy or sell shares of the Company. Any investment decision should be made at your own discretion and risk. The content of this presentation is subject to change or deletion without notice. The Company assumes no responsibility for any damages arising from or related to the use of this material. Disclaimer 45