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Copyright 2026 IBIDEN CO.,LTD, All rights reserved Page#1/17 Financial Results of the 1st Half of FY2026 IBIDEN CO., LTD.(4062) October 30th, 2026 Page#1/17
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Copyright 2026 IBIDEN CO.,LTD, All rights reserved Page#2/17 Forecasts in this statement have been made based on the premise, prospect and plan of IBIDEN as of October 29 th , 2026. Actual results may widely differ from this statement due to any uncertain factor such as international economy, market competition and exchange fluctuation.
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Copyright 2026 IBIDEN CO.,LTD, All rights reserved Page#3/17 [Consolidated] Results of the 1st Half of FY2026
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Copyright 2026 IBIDEN CO.,LTD, All rights reserved Page#4/17
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Copyright 2026 IBIDEN CO.,LTD, All rights reserved Page#5/17 [Consolidated] Forecasts of the 2nd Half of FY2026
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Copyright 2026 IBIDEN CO.,LTD, All rights reserved Page#6/17
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Copyright 2026 IBIDEN CO.,LTD, All rights reserved Page#7/17
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Copyright 2026 IBIDEN CO.,LTD, All rights reserved Page#8/17
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Copyright 2026 IBIDEN CO.,LTD, All rights reserved Page#9/17
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Copyright 2026 IBIDEN CO.,LTD, All rights reserved Page#10/17 Market Forecasts and Business Prospects
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Copyright 2026 IBIDEN CO.,LTD, All rights reserved Page#11/17 □ Demand for AI GPUs and ASICs specialized in AI inference is forecast to continue growing steadily. □ With the expansion of AI applications (inference and agents), the demand forecast for high-end server CPUs has been revised upward. □ To enable high-speed data transmission between servers and data centers, switching ICs are expected to become even more high-performance. CY24 CY25 CY26 CY27 CY28 CY29 CY30 AI GPU ASIC 0 CY24 CY25 CY26 CY27 CY28 CY29 CY30 0 15 15 30 30 AI Applications Existing Applications CPU for server High-end CPU for server Highend Forecast (26.05.12) Trends and Changes in Electronics Market According to the information by the external research firm CPU for server Others Switching IC for data centers CPU and Other MarketsAI GPU/ASIC Markets (Unit: million units) (Unit: million units)
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Copyright 2026 IBIDEN CO.,LTD, All rights reserved Page#12/17 100 135 170 210 350 Demand Forecast and Capacity Expansion Plan of IC Package Substrates □ As IC package substrates become larger and more multi-layered, total SAP demand is expected to significantly exceed the industry's supply capacity. □ We will maintain our top share in the high-end market through capacity expansion focused on cutting-edge semiconductors. 0 50 100 150 200 250 CY26 CY28 CY30Forecast Forecast Forecast Forecast Forecast CY26 CY27 CY28 CY29 CY30 ASIC ※Japan only Market Production Load SAP Demand AI GPU AI ASIC x 1.8 x 3.0 x 5.4 General- Purpose Server CPU x 1.3 x 1.9 x 2.5 ■ Changes from CY26 to CY30 Capacity Expansion Plan(Index)*SAP : Semi Additive Process *Indexed by CY26=100SAP*Demand (Size) (based on customer information) PC General- Purpose Server AI Server
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Copyright 2026 IBIDEN CO.,LTD, All rights reserved Page#13/17 Capital Expenditure for the growth of the electronics business □ Make additional expenditure to maximize the use of building space at Cell6(Gama Plant) and expand SAP capacity. □ For additional expenditure, including Cell7 and Cell9, we aim to finalize detailed terms with customers and make decisions and disclosures within FY2026. Item Details Investment (Cell6) Previously Announced： JPY 220 billion Newly Added： JPY 150 billion Operation Start Sequentially commence operations from FY2029 Products High-Performance IC Package Substrate for AI ASIC Item Details Investment (Cell8) Previously Announced： JPY 280 billion ※Considering maximum utilization of building space Operation Start Sequentially commence operations from FY2027 Products High-Performance IC Package Substrate for AI GPU Prospective site (Cell9) Cell6 Cell8 Prospective site (Cell7) Gama Plant(Cell6) Ono Plant(Cell8)
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Copyright 2026 IBIDEN CO.,LTD, All rights reserved Page#14/17 CY25 CY26 CY28 CY30～ Die Size (Reticle) 3.5 5.0 7.5 9 < Substrate Size 80 x 80 90 x 90 110 x 110 130 x 130 < SAP 9-X-9 10-X-10 12-X-12 14-X-14 Structure (2.5D) (Interposer) (Silicon Bridge) Optical-Electrical Conversion (Board-to-Board Connection) (Package-to-Package Connection) (Die-to-Die Connection) High Speed + Low Power Consumption Power Enhancement Power Enhancement Power Enhancement Power Enhancement Technological Advancement and Development of IC Package Substrates □ In addition to becoming larger and more multi-layered, increasingly complex core structures and embedded components are expected to increase added value. □ Continue to maintain the position as the top supplier by proactively developing essential elemental-technologies across all areas.
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Copyright 2026 IBIDEN CO.,LTD, All rights reserved Page#15/17 0 2 4 6 8 10 12 14 16 Plan / Forecast Current Capacity Additional Capacity Required CY50CY26 CY30 CY40 Trends and Changes in Ceramics Market CY22 Diesel・ Gasoline HV PHEV EV CY25 CY35CY30CY27 □ No change in the forecast for internal combustion engine products. Continue to capture demand for commercial vehicles and construction/agricultural machinery in emerging markets. □ For EV products, aim for business expansion by maintaining our top market share among existing customers and acquiring new customers. □ For graphite products, aim for business expansion in the nuclear power sector (North America) by steadily securing business opportunities from multiple customers. Nuclear Power Generation (Unit: million units) (According to the information by the external research firm) Powertrain Market (According to the information by the external research firm) (100GWe)
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Copyright 2026 IBIDEN CO.,LTD, All rights reserved Page#16/17 LiB Safety Material , High-temperature Insulation Material and High-temperature Dielectric Material Customer adoption of a new product for battery safety applications has been secured, with mass production starting in 1Q FY2027. EV Battery Products for Power Module and Robotics Field Develop an ultra-compact actuator and start customer evaluation. Plant Activator and CO2 Fixation Technology ・Promote the expansion of LEAFENERGY into overseas agricultural markets. ・Signed a location agreement with Gifu City for the establishment of a new research facility. ※Scheduled to open in October 2028 □ Aim to expand business fields and create new businesses through in-house development and open innovation, leveraging external knowledge. R&D Activities for Next Growth R&D FieldR&D Expenses Trends New Field NEV Field Specialized Substrate Field
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Copyright 2026 IBIDEN CO.,LTD, All rights reserved Page#17/17 □ Implemented a 1:2 stock split on October 1, 2026, to expand the investor base and improve market liquidity. □ The interim dividend for FY2026 was approved at JPY 10.0 per share, a JPY 2.5 increase from the year-end dividend for FY2025. □ The policy for returns to shareholders is to continue a progressive dividend (until FY2030), with a guideline of a 20% payout ratio, while maintaining a strong financial position through allocation of funds to growth investments, R&D and human capital, and reduction in interest-bearing debt. 5.0 5.0 5.0 5.0 10.0 2.5 2.5 5.0 5.0 5.0 7.5 10.0 12.5 10.0 10.0 15.0 20.0 ※ Prior year dividends per share adjusted for the October 1, 2026 stock split Return to Shareholders Dividend per Share Year-End Dividend Interim Dividend (Unit: JPY) the 110th anniversary dividend commemorative dividend for the start of mass production at the Ono Plant FY22 FY23 FY24 FY25 FY26 Result (Forecast)
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Copyright 2026 IBIDEN CO.,LTD, All rights reserved Page#18/17 Copyright 2026 IBIDEN Co.,LTD, All rights reserved