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Financial Results Briefing for 1H FYE 12/2026 August 10 , 2026 MMEC COMPANY LTD . Securities code : 4971 https://www.mec-co.com/en/ Note This document has been translated from the Japanese original for reference purposes only . In the event of any discrepancy between this translated document and the Japanese original , the original shall prevail .
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Financial Results Briefing for 1H FYE12/2026 1 1H FYE12/2026 Key Factors 1H FYE12/2026 Key Factors Sales: 12,594 million yen (YOY change: Up 34.2%) Operating income: 4,135 million yen (YOY change: Up 69.4%) 1 4 Major products sales (YOY change) EXE: Up 44.8% CZ: Up 37.1% V-Bond: Up 16.3% SF: Down 6.4% 3 Chemicals Sales: 12,402 million yen (YOY change: Up 37.4%) Shipments: 26,798 ton (YOY change: Up 21.9%) Exchange rate impact (YOY change) Sales: Up 777 million yen, Operating income: Up 472 million yen. 2
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Financial Results Briefing for 1H FYE12/2026 Exchange Rates Exchange Rates Q1 FYE12/2026 1H FYE12/2025 1H FYE12/2026 Initial forecast 4.96 4.68 5.01 4.95 N T D 22.58 20.53 23.02 21.24 R M B 4.93 4.44 4.91 4.67 T H B 183.65 162.60 184.70 175.76 E U R 156.45 148.98 158.28 151.02 U S D • Overseas subsidiaries are basically transactions denominated in local currency, and are affected by the yen / local currency rate when converting to yen in consolidated accounting. • Our major foreign currencies are the Taiwan dollar (NTD) and the Chinese yuan (RMB). Both use the average rate during the period. Exchange sensitivity （1H FY2026） NTD: RMB: (Sale) (Operating income) (Sale) (Operating income) 17 million yen 11 million yen 46 million yen 35 million yen 2 Unit : yen
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Financial Results Briefing for 1H FYE12/2026 1H FYE12/2026 Results 1H FYE12/2026 Results Unit : million yen 3 FYE12.2025 Results Progress ratio (%) Results Progress ratio (%) Results (Forcast) YOY (%) Net sales 9,387 44.8% 12,594 48.8% 3,207 34.2% 20,947 25,800 23.2% Chemical sales 9,025 - 12,402 - 3,376 37.4% 20,211 - - Gross profit 5,804 - 8,004 - 2,200 37.9% 12,977 - - Gross profit margin 61.8% - 63.6% - - - 62.0% - - SGA 3,363 - 3,868 - 505 15.0% 7,229 - - Sales ratio 35.8% - 30.7% - - - 34.5% - - Operating income 2,440 42.5% 4,135 49.8% 1,695 69.4% 5,748 8,300 44.4% Operating profit margin 26.0% - 32.8% - - - 27.4% 32.2% - Ordinary income 2,493 41.2% 4,305 50.7% 1,811 72.6% 6,051 8,500 40.5% Ordinary profit margin 26.6% - 34.2% - - - 28.9% 32,9% - Profit before tax 2,892 - 4,300 - 1,407 48.7% 6,473 - - Net income 1,893 37.7% 3,039 50.7% 1,145 60.5% 5,028 6,000 19.3% EBITDA 3,287 - 4,731 - 1,444 43.9% 7,302 - - EPS 101.47 - 166.43 - - - 272.14 328.58 - 7.0% - 9.1% - - - 17.5% 17.5% -ROE Full-year FYE12.2025 1H FYE12.2026 FYE12.2026 YOY (%)
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Financial Results Briefing for 1H FYE12/2026 276 67 41 -223 777 2,265 1 0 2,000 4,000 6,000 8,000 10,000 12,000 14,000 Net Sales YOY Net Sales YOY Adhesion improves Etching solution Other solution Machine sales Material sales Other sales 1H FYE12/2025 1H FYE12/2026 3,207 million yen, Up 34.2% Foreign exchange 4 １２，５９４ ９，３８７ (Million yen)
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Financial Results Briefing for 1H FYE12/2026 1,237 432 9 -10 -94 -31 656 -320 -185 0 500 1,000 1,500 2,000 2,500 3,000 3,500 4,000 4,500 5,000 Operating Income YOY Operating Income YOY 1,695million yen, Up 69.4% Chemical Chemical gross profit Machine sales Machine sales gross profit Material and Other sales Material and Other sales Gross profit Selling, general and administrative expenses Foreign exchange （Gross profit） Foreign exchange （Selling、general and administrative expenses） 5 1H FYE12/2025 1H FYE12/2026 ４，１３５ ２，４４０ Sales volume (Million yen)
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Financial Results Briefing for 1H FYE12/2026 4,354 4,527 4,799 4,552 4,423 4,963 5,600 5,959 6,128 6,465 1,053 1,309 1,286 913 1,093 1,347 1,806 1,500 2,079 2,055 24.2 28.9 26.8.0 20.1 24.7 27.1 32.3 25.2 33.9 31.8 0 5 10 15 20 25 30 35 40 0 1,000 2,000 3,000 4,000 5,000 6,000 7,000 1-3 4-6 7-9 10-12 1-3 4-6 7-9 10-12 1-3 4-6 2024 2025 2026 Net sales Operating income Operating margin Quarterly Performance: Sales, Operating Income, Operating Margin (Consolidated) Quarterly Performance: Sales, Operating Income, Operating Margin (Consolidated) (Million yen) （％） 6
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Financial Results Briefing for 1H FYE12/2026 1,805 1,693 1,785 1,847 1,675 1,907 2,055 2,332 2,147 2,442 1,496 1,524 1,727 1,791 1,655 1,708 1,738 2,127 1,900 1,967 1,053 1,309 1,286 913 1,093 1,347 1,806 1,500 2,079 2,055 0 1,000 2,000 3,000 4,000 5,000 6,000 7,000 1-3 4-6 7-9 10-12 1-3 4-6 7-9 10-12 1-3 4-6 2024 2025 2026 COGS SGA Operating income Quarterly Composition: Operating Income, SG&A, CODS (Consolidated) Quarterly Composition: Operating Income, SG&A, CODS (Consolidated) 7 (Million yen)
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Financial Results Briefing for 1H FYE12/2026 1-3 4-6 7-9 10-12 1-3 4-6 7-9 10-12 1-3 4-6 2024 2025 2026 Other 1 3 1 1 8 7 2 1 10 6 Materials for PCBs 37 44 22 64 128 160 33 80 38 38 Equipments for PCBs 391 19 118 49 49 7 30 225 81 16 Chemicals for PCBs 3,924 4,460 4,657 4,436 4,237 4,787 5,534 5,652 5,997 6,404 0 1,000 2,000 3,000 4,000 5,000 6,000 7,000 Chemicals for PCBs Equipments for PCBs Materials for PCBs Other Quarterly Performance : Product-Specific Sales (Consolidated) Quarterly Performance : Product-Specific Sales (Consolidated) 8 (Million yen)
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Financial Results Briefing for 1H FYE12/2026 2,877 3,135 3,370 3,317 3,177 3,601 4,163 4,372 4,687 4,946 871 1,115 1,079 935 857 974 1,133 1,056 1,073 1,184 175 209 206 182 202 211 237 223 235 273 0 1,000 2,000 3,000 4,000 5,000 6,000 7,000 1-3 4-6 7-9 10-12 1-3 4-6 7-9 10-12 1-3 4-6 2024 2025 2026 Adhesion improves Etching solution Other surface processing solution Quarterly Performance : Chemical Sales (Consolidated) Quarterly Performance : Chemical Sales (Consolidated) 9 (Million yen) （CZ、V-Bond AP etc.） （EXE、SF etc.）
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Financial Results Briefing for 1H FYE12/2026 Other CZ contain 8201, 8401 and pre- and post-processing of CZ Quarterly Performance : CZ Series Sales Quarterly Performance : CZ Series Sales 10 308 340 337 322 324 334 358 391 426 450 1,415 1,446 1,469 1,486 1,480 1,717 2,020 2,034 2,099 2,179 866 1,032 1,164 1,120 1,017 1,149 1,350 1,366 1,465 1,638 0 500 1,000 1,500 2,000 2,500 3,000 3,500 4,000 4,500 1-3 4-6 7-9 10-12 1-3 4-6 7-9 10-12 1-3 4-6 2024 2025 2026 8100 8101 Other CZ (Million yen) 2,589 2,818 2,970 2,928 2,821 3,200 3,728 3,791 3,990 4,267
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Financial Results Briefing for 1H FYE12/2026 Quarterly Performance : Region-Specific Sales and Overseas Sales Ratio Quarterly Performance : Region-Specific Sales and Overseas Sales Ratio 1-3 4-6 7-9 10-12 1-3 4-6 7-9 10-12 1-3 4-6 2024 2025 2026 Japan 1,857 1,688 1,931 1,728 1,594 1,756 2,191 2,284 2,366 2,197 Taiwan 795 878 792 859 860 954 1,006 1,065 1,115 1,212 China 1,265 1,504 1,625 1,506 1,370 1,607 1,835 1,919 1,894 2,234 Europe 259 273 202 254 400 382 269 340 379 389 Thailand 176 183 246 203 197 262 297 349 372 431 Foregin sales ratio 58.6 64.2 60.8 63.4 65.5 67.1 62.8 65.3 64.1 67.7 0 10 20 30 40 50 60 70 80 0 500 1,000 1,500 2,000 2,500 Overseas sales ratio is 82.7%(same period of the previous year: 81.2%) including sales to overseas customers through agents in Japan. 11 (Million yen) (%)
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Our Future Plans 12
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Financial Results Briefing for 1H FYE12/2026 Our Future Plans Our Future Plans • In the medium to long term, technological innovation is expected to advance against the backdrop of the ongoing digital revolution and the spread of technologies such as IoT, AI, 5G/6G, electrification of vehicles, and the promotion of DX and GX, and markets related to our company are expected continue expanding. • Demand for the related CZ series and chemical adhesion promoter is expected to increase, driven by ultra-high density, ultra-high frequency, and higher performance, as well as the rise in PKG substrates resulting from growing semiconductor demand. Business environment Major chemical CZ : In the short term, demand will be affected by trends in the semiconductor market. In the medium to long term, demand is expected to expand due to an increase in PKG substrates and advances in larger and more multilayered designs. V-Bond Demand for satellite communication boards is on an upward trend. Demand will be affected by trends in the automobile and smartphone market. EXE : Demand will be affected by trends in the display market. Due to the need for fine wiring formation, an increase in demand is expected in applications other than those for display market. SF : Demand will be affected by trends in the tablet PC mar ket. 13
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Financial Results Briefing for 1H FYE12/2026 FYE12/2026 Full-year Forecast FYE12/2026 Full-year Forecast 14 FYE12/2026 Revised: August 10, 2026 FYE12/2025 Full-year Full-year YOY change (%) Profit ratio (%) Amount (million yen) Profit ratio (%) Amount (million yen) 23.2 -25,800 -20,947 Net sales 44.4 32.2 8,300 27.4 5,748 Operating income 40.5 32.9 8,500 28.9 6,051 Ordinary income 19.3 23.3 6,000 24.0 5,028 Net income --328.58 -272.14 Net income per share(yen) FYE12/2026 Assumed FYE12/2025 Actual Exchange rates 4.96 4.81 N T D 22.58 20.94 R M B 4.93 4.57 T H B 183.65 169.14 E U R 156.45 150.40 U S D 16,329 14,020 18,234 20,947 25,800 4,004 2,492 4,562 5,748 8,300 3,064 2,304 2,291 5,028 6,000 24.5 17.8 25.0 27.4 32.2 0 10 20 30 40 0 10,000 20,000 30,000 12/2022 12/2023 12/2024 12/2025 12/2026 Net sales Operating income Net income Operating margin (Million yen) （％） （Forecast）
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Financial Results Briefing for 1H FYE12/2026 1,330 1,219 1,333 1,379 1,741 8.1 8.7 7.3 6.6 6.7 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 0 500 1,000 1,500 2,000 2,500 3,000 3,500 FYE12/21 FYE12/22 FYE12/23 FYE12/24 FYE12/25 15 Capital Investment, Depreciation Expenses and R&D Expenses Capital Investment, Depreciation Expenses and R&D Expenses 698 1,870 699 2,846 FYE12/22 FYE12/23 FYE12/24 FYE12/25 FYE12/26 （million yen） （%） （million yen）（million yen） 759 773 816 823 950 FYE12/22 FYE12/23 FYE12/24 FYE12/25 FYE12/26 減価償却費 Capital investment Depreciation expenses R&D expenses and Ratio of consolidated sales （Forecast） （Forecast） （Forecast） Depreciation expenses for the new production base: 280-300 million/year (Forecast from December 2026 onwards) (1,650) Includes investment for the new production base. (2,335) 3,985 For the new production base. Includes investment for the new production base.
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Financial Results Briefing for 1H FYE12/2026 862 850 850 1,769 2,022 899 1,292 FYE12/22 FYE12/23 FYE12/24 FYE12/25 FYE12/26 27.9 36.8 36.8 35.3 33.5 16 Trends in Total Dividends, Consolidated Dividend Payout Ratio, and ROE 20 20 20 25 55 25 25 25 71 55 FYE12/22 FYE12/23 FYE12/24 FYE12/25 FYE12/26 ■ Total dividends（million yen） ■ Treasury stock Repurchase Amount（million yen ） ● Consolidated dividend payout ratio (%) ■ 2Q-end（yen） ■ Fiscal year-end（yen） （Forecast） 13.8 9.6 8.9 17.5 17.5 FYE12/22 FYE12/23 FYE12/24 FYE12/25 FYE12/26 Dividends per share Total dividends / Treasury stock repurchase amount/Consolidated dividend payout ratio ROE （％） （Forecast） （Forecast） *Net profit declined in FY 2024 due to group restructuring for efficiency. *Net profit increase in FY 2025 due to subsidy income. Shareholder Return Policy ・ Consolidated dividend payout ratio:35% or higher, and ・ DOE (Dividend on Equity): 4.0% or higher ・ Share repurchases to be conducted flexibly depending on circumstances ROE ・ 13% 〜 16%
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Financial Results Briefing for 1H FYE12/2026 Basic Policy on Cash Allocation Basic Policy on Cash Allocation 17 The basic policy on cash allocation for 2030 Vision: Phase 2 (cumulative for 2025–2027) is as follows. Cash inflow/cash on hand (three-year total) Cash outflow (three-year total) Investment Over ¥8,000 million Investment allocation Capital investment for growth Investment for maintaining and renewing facilities Reinforcement of technical support and marketing structures M&A R&D ¥5,200 million R&D ¥5,200 million Shareholder returns Over ¥5,300– 5,400 million Dividends ¥5,300–¥5,400 million Share buybacks To be implemented flexibly (Share buybacks of ¥1,292 million completed in 2025) Amount to be determined as appropriate Operating cash flows ¥18,200– ¥18,800million (before R&D tax credits) External procurement Cash on hand *The size of each item is not an indicator of the amount. ¥4,000 million ¥4,000 million
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Financial Results Briefing for 1H FYE12/2026 ESG Effort ESG Effort • Development of products that reduce environmental impact. • Appropriate chemical substance management. • Promotion of resource recycling. • Measures to address climate change. Environment Environment • Human capital strategy. • Utilization of diverse human resources (empowerment of women, WLB, promotion of men taking childcare leave, etc.). • Contribution to social development (5G, autonomous driving). Social Social • Reinforcement of management foundations (CG system, various committees, risk management, etc.). Governance Governance 18
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Financial Results Briefing for 1H FYE12/2026 Our Products ＆ PKG Substrate Trend Our Products ＆ PKG Substrate Trend General-purpose CZ-8100 Cutting-edge Advanced CZ-8201 Chemical adhesion promoter AP series CZ-8401 ×Chemical adhesion promoter AP series CZ-8101 Ultra-high density Ultra-high frequency 19
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Financial Results Briefing for 1H FYE12/2026 Aiming to Expand the Technical Domain Aiming to Expand the Technical Domain 20 Interposer Si Die Si Die PCB PKG PCB 2PKG Ultra-high density, low signal loss, low power consumption ・Products︓Chemical adhesion(AP) ・Technical trend︓Reduction of roughening amount due to low signal loss requirements ・Final products︓Generative AI, Data centers, Semiconductor inspection equipment New field（High-frequency） Existing field（PKG） ・Products︓Roughening adhesion(CZ), Chemical adhesion(AP) ・Technical trend︓High density（Low L/S） Reduction of coarsening amount due to low Power consumption needs ・Final products︓Generative AI、Data centers New field（Interposer） ・Products︓Roughening adhesion(CZ)×Chemical adhesion(AP) ・Technical trend︓Ultra-high density（Low L/S） ・Final products︓Generative AI、Data centers Evolution of Our Company's Technology and Required Technology PKGs/PCBs: Larger and with more multilayered
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Financial Results Briefing for 1H FYE12/2026 Aiming to Expand the Business Domain Electronic board manufacturing market Application development of existing technology Creation of new business Technical trend 21
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Appendix 22
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Financial Results Briefing for 1H FYE12/2026 23 Corporate Profile MEC COMPANY LTD. Company name 3-4-1, Kuise Minamishimmachi, Amagasaki, Hyogo Head quarters location May 1, 1969 Date of establishment R&D, production and sales of chemicals, equipment and related materials used in the production of PCBs and electronic components. Business activities President and CEO Kazuo Maeda Presentative 594,142,400 JPY Capital 20,947 million JPY (Consolidated) Net sales Tokyo Stock Exchange Prime Market, Securities code: 4971 Stock listing 508 persons (Consolidated),292 persons (Non-consolidated) Number of employees （As of December 31, 2025 ）
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Financial Results Briefing for 1H FYE12/2026 24 0 5,000 10,000 15,000 20,000 25,000 '70/3 '72/3 '74/3 '76/3 '78/3 '80/3 '82/3 '84/3 '86/3 '88/3 '90/3 '92/3 '94/3 '96/3 '98/3 '00/3 '02/3 '04/3 '06/3 '08/3 '10/3 '12/3 '14/3 '16/3 '17/12 '19/12 '21/12 '23/12 '25/12 MEC Sales Trend Since Foundation （Million yen） Spread of the internet Driven by chemicals for PKG substrates for PCs Spread of electronic equipment May ‘69 Started as a chemical technology consulting company in Kita-ku, Osaka Feb. ‘70 Started manufacturing chemicals for electronic Circuit boards Our products are used all over the world ‘95 start selling CZ series Financial crisis The collapse of IT bubble 5G/IoT/AI/ autonomous driving/ DX/GX '03 Listed on the Second Section of TSE '07 Listed on the First Section of TSE Driven by chemicals for smartphone boards and electronic parts '22 Transition on the Tokyo Stock Exchange Prime Market Net sales COVID-19 *FYE 12/2017 is a period of nine months from April 1 to December 31 of 2017 due to the change of the a ccounting period. The consolidated period for MEC is a period of nine months (from April 1 to December 31 of 2017) while that for consolidated subsidiaries is a period of twelve months (from January 1 to December 31 of 2017). '01 Listed on NASDAQ Japan (now Tokyo Stock Exchange) Electronic circuit boards mainly used for personal devices Uses of electronic circuit boards expanded to social infrastructure
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Financial Results Briefing for 1H FYE12/2026 Process of Commercialization Process of Commercialization 25 Beaker experiment ⇒ Scale-up experiment ⇒ Production line verification From R＆D To Factory To customers Manufacturing ⇒ Quality inspection ⇒ Filling
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Financial Results Briefing for 1H FYE12/2026 Example of Product Usage Process Example of Product Usage Process 26 ≪Chemical treatment≫ ≪Water rinse≫ ≪Drying≫
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Financial Results Briefing for 1H FYE12/2026 MEC’s Core Technologies MEC’s Core Technologies Pattern formation Selective etching Roughen the surface, and physically improve adhesion Treat the surface, and chemically adhesion promoter EXE CZ,V-Bond SF Creating and Fostering Value at Various Interfaces 27 AP
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Financial Results Briefing for 1H FYE12/2026 Examples of Major Chemical Applications and Final Products Examples of Major Chemical Applications and Final Products Final products Characteristic Major chemical Infrastructure (Generative AI, 5G/6G-related, data centers, etc.) and high-function devices (PCs, smartphones, tablet PCs, etc.) A copper surface treatment agent that enhances adhesion between copper and resin. It is mainly an adhesion improver for PKG substrates, and is also used for high-density PCBs. Super-roughening type adhesive enhancement CZ series Automobile, smartphones, Satellite communications etc. A copper surface treatment agent that enhances adhesion between copper and resin. Adhesion improver mainly for multilayer substrates. Not used for PKG substrates. Adhesion improvers for multilayer substrates V-Bond series TV and PC monitors, etc. Fine wiring can be formed through subtraction. Etching agent for COF substrates. Anisotropic etchant EXE series Tablet PCs, etc. Etching agent with selectivity to copper. Selective etchant SF series 28
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Financial Results Briefing for 1H FYE12/2026 29 Our Strength: Interlayer Adhesion Technology The CZ series, our main products, is used as an adhesion promoter in the parts where copper contacts with resin. It is an indispensable technology in the process of improving adhesion between the copper and the build-up resin of package substrates. As package substrates become larger and adopt more layers ⇒ The amount of CZ series used increases CZ-8101 1.0μm Finely roughened Super finely roughen + Organic adhesion promoter CZ-8401 + series （0.1μm + Chemical adhesion） CZ-8201 0.5μm Very finely roughened 0.0μm （Chemical adhesion） Flat organic adhesion promoter Reduced etching volume Places where the CZ series is used Copper Solder masks Resin PCB Package substrate Semiconductor Under development
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Financial Results Briefing for 1H FYE12/2026 Changes in Copper Adhesion Surface Technology Core Business: Package substrates Application and Expansion: PCBs (High-frequency substrates) Minimum Line Width [µm] Ethernet communication speed [bE]〜800G 1.6T〜 ~60 40 20 10 0 Fine roughening Growing demand for roughening technology and non-roughening technology (chemical adhesion) Demand for CZ-8101 is increasing in conjunction with expansion of related markets. Demand for CZ-8201 and 8401 is increasing due to the need for reduced etching (demand for low loss) AP, a non-roughening technology, is undergoing continuous evaluation and adoption and deepening of technology. Even in areas other than package substrates, the demand for low signal loss is becoming more evident. Expand the knowledge gained with package substrates to PCBs used in data centers and other applications using non- roughening technology. Against the backdrop of demand for low loss, demand for non-roughening technology will increase! No roughening (Low signal loss) No roughening (Low signal loss) Reduced etching volume Low signal loss Reduced etching volume CZ-8100 CZ-8101 CZ-8201 CZ-8401 × AP ＊ AP ＊ Roughening Fine roughening Ultra-fine roughening Ultra -fine roughening No roughening (low signal loss) AP ＊ No roughening (Low signal loss) Deployment of the same technologies on PCBs Reduced etching volume Low signal loss ＊AP︓Adhesion Promotor (Chemical adhesion using non-roughening technologies, chemical adhesion enhancement against fine roughening） 30
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Financial Results Briefing for 1H FYE12/2026 Layers Size(cm 2) 14 27.44 XEON ８ 14.44 Core i7 12 16.00 Ryzen 7 XEON PKG 14 layers (6-２-6） Core i7 PKG 8 layers (3-2-3) Cross Section Observations Cross Section Observations Ryzen PKG 12 layers (5-2-5) 31 Core layer Core layer Core layer
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Financial Results Briefing for 1H FYE12/2026 32 Evolution of the PKG Substrate PKG Si Die Conventional PKG substrate One PKG, One Si Die Advanced PKG substrate（Chiplet, 2.X/3D） Enlarging PKG to mount multiple semiconductors ・High-density PKG ・Large-size PKG ・High multi-layer PKG EMIB/EMIB-T (Embedded Multi-die Interconnect Bridge) PKG Si Die Si Die Si bridge PKG Organic interposer Si Die LSI Si Die Organic interposer CoWoS-L (Chip on Wafer on Substrate) CoWoS-R (Chip on Wafer on Substrate) PKG Organic interposer Si Die Si Die CoWoS-S (Chip on Wafer on Substrate) PKG Si interposer Si Die Si Die
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Financial Results Briefing for 1H FYE12/2026 33 MEC Group Equipment Capacity Amagasaki Factory 900ｔ/ mo. Nagaoka Factory 2,750ｔ/ mo. MEC TAIWAN 1,200ｔ/ mo. MEC SUZHOU 1,350ｔ/ mo. MEC ZHUHAI 1,000ｔ/ mo. MEC EUROPE 400ｔ/ mo. MEC THAILAND 500ｔ/ mo. Kitakyushu Plant Maximum capacity 2,500ｔ/mo.（Plan） ＊The equipment capacity is the maximum value based on the equipment specifications. New production base (Under construction) Domestic base (Japan) Global base As of December 31, 2025
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Financial Results Briefing for 1H FYE12/2026 This presentation includes forward-looking statements (such as predictions and business forecasts) made on August 10, 2026. These statements are assumptions based on information available at the time, and they are subject to risks and uncertainties. Actual results or events could differ substantially from those forecasted in such statements due to a variety of factors.