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IIIII FY2026 1Q ( Fiscal Year Ending March 31 , 2027 ) Financial Results Presentation Materials August 6 , 2026 JX JX Advanced Metals 11 1 | 1 | 1 | === || || || II II II
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1 2 3 Highlights FY2026 1Q (Fiscal year ending March 31, 2027) Results Appendix4 FY2026 (Fiscal year ending March 31, 2027) Forecasts Table of Contents Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. 2
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Highlights 3Copyright © 2026, JX Advanced Metals Corporation, All rights reserved.
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Highlights – FY2026 1Q Results and FY2026 Forecasts 4Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. Operating Profit FY2026 1Q FY2026 Full-year Forecast Forecasts in May Forecasts in August Difference 190.0 bil. Yen 232.0 bil. Yen ＋42.0 bil. Yen Exchange rate 150 JPY/USD Copper(LME) 520 ¢/lb Exchange rate 157 JPY/USD Copper(LME) 586 ¢/lb Exchange rate 7 JPY/USD weak yen Copper(LME) +66 ¢/lb ●Market Environment ＋40.0 bil. Yen ●Reduced mine production due to adverse weather conditions in Chile -6.0 bil. Yen ● Increased sales in Focus Businesses ＋3.0 bil Yen ● Improved selling prices of Focus Businesses ＋2.5 bil. Yen FY2023 Results FY 2024 Results FY2025 Results FY 2026 Forecasts 86.2 bil Yen 112.5 bil. Yen 175.0 bil. Yen 232.0 bil. Yen 27.3 bil. Yen 51.8 bil. Yen 71.0 bil. Yen 100.0 bil. Yen 9% 13% 14% 17% Operating Profit Consolidated Focus Businesses Operating Profit margin Focus Businesses Expecting steady growth in both overall business performance and Focus Businesses Performance Trend External Environment Business Factors Same period in FY2025 Results Difference 29.6 bil. Yen 81.4 bil. Yen ＋51.8 bil. Yen Exchange rate 145 JPY/USD Copper(LME) 432 ¢/lb Exchange rate 159 JPY/USD Copper(LME) 604 ¢/lb Exchange rate 14 JPY/USD weak yen Copper(LME) +172 ¢/lb ●Market Environment ＋26.5 bil. Yen ●One-off factors ＋19.0 bil. Yen (Gain from partial sale of Caserones interest) ●Increased sales in Focus Businesses ＋8.0 bil. Yen External Environment & One-off Factors Business Factors
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＋19% ＋21% ＋7% ＋8% ＋13% ＋13% ＋16% For AI Datacenter ＋62％ Others ＋9% ＋2% For AI Datacenter ＋62％ Others ▲9％ ＋5% ＋5% ＋32% ＋33% Highlights – Sales volume Growth rate Thin Film Materials Semiconductor Materials Sputtering targets for SEMI Sputtering targets for magnetic devices InP substrates Tantalum Powder for tantalum capacitor TaNb* 5Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. ICT Materials Functional Materials Rolled Annealed Copper Foil Copper Titanium Alloys FY2026 1Q Results （FY2025 1Q FY2026 1Q） FY2026 Full-year Forecasts (FY2025 Results FY2026 Forecasts) in Augustin May ＋26% ＋8% ＋8% ＋89% ＋3% ＋42% *TaNb: Tantalum and Niobium Continued solid performance, supported by expanding demand for AI data center applications Sales exceeded the high level achieved in the same period of the previous fiscal year Continued solid performance, supported by expanding demand for AI data center applications AI data center-related demand remains strong. Seeking to improve profitability through selling price improvements and a portfolio shift toward higher-margin products Progressing steadily Forecasts for sputtering targets for SEMI and magnetic devices have been revised upward For InP substrates, initiatives to improve production efficiency at existing facilities are ongoing Progressing steadily Forecast for copper titanium alloys has been revised upward
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Highlights – Capacity increase 6Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. ✓ Driving capacity expansion to capture growth in AI data centers Semiconductor Materials Location Expansion scale (Based on Production capacity) Start of operations Thailand From 1H CY2027 onward1.5x Japan (Isohara works) 2H FY20261.2x FY2027 onwardJapan (Hitachinaka works) 1.3x(vs. FY2025) To support the anticipated growth, expanding local finishing and processing capacity Taiwan: 1.4x Korea: 2.0x Japan (Isohara/Hitachinaka works) 7-10x From 2H FY2026 onward ➢ Consider further capacity expansions as necessary for products expected to experience rapid demand growth, such as copper titanium alloys Sputtering targets for magnetic devices Sputtering targets for SEMI Tantalum Powder InP substrates (vs. FY2025) (vs. FY2025) (vs. FY2025)
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Highlights – Toho Titanium 7Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. ✓ Wholly-owned subsidiary since June 2026 (share exchange) ICT Materials CVD/ALD precursor materials Main business Main products Main applications Current Status / Future Direction Titanium Sponge Aircraft engine components and airframe materials Chemicals Business Ultra-fine Nickel Powder Multi-layer Ceramic Capacitors (MLCCs) Catalysts Business THC Catalysts Polypropylene and polyolefins for automotive interior and exterior components and home appliances High-Purity Titanium Sputtering targets for SEMI Expanding aerospace applications for both companies’ products through the sharing of sales channels and market intelligence. Evaluating the optimal business structure to support future growth In response to strong demand, reviewing measures to expand production capacity and strengthen manufacturing capabilities. Accelerating marketing and product development through market intelligence sharing with JX Advanced Metals to capture demand from AI data center Enhancing market analysis and customer development activities to expand sales by leveraging JX Advanced Metals’ network New Materials Division Titanium Business Semiconductor thin-film deposition materials Reviewing capacity expansion initiatives in anticipation of future demand growth and broadening the precursor product lineup Strengthening the supply of high-purity titanium for sputtering targets for SEMI applications AI Server MLCC Market Growth 100 138 FY2025 Results FY2026 Forecasts Ultra-Fine Nickel Powder Sales Volume (Index: FY2025 = 100) Strong growth expected, driven by expanding demand for our products and continued growth in the MLCC market. The capacity expansion previously announced in February 2023 has already started operation in FY2026. Sales expansion through enhanced marketing activities and further capacity expansion are under evaluation 20-40% (CAGR 2025~2035) *Our estimate
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Highlights – TATSUTA Electric Wire and Cable 8Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. ✓ Wholly-owned subsidiary since November 2024 (tender offer and share consolidation) ICT Materials Main business Main products Main applications Current Status / Future Direction Electric wires & cables Electronic materials Electric wires and cables for infrastructure and industrial equipment EMI shielding films Liquid leakage detection sensor Materials and products for medical devices Electric wires and cables for infrastructure applications (power plants, power distribution facilities, and building construction and sales) and industrial equipment applications (factory automation systems, robots, and machine tools) EMI shielding films designed to prevent malfunctions in electronic devices such as smartphones caused by electromagnetic noise Liquid leakage detection sensor for AI servers and data centers Microcatheters, carbon lead wires for ECG electrodes etc. Achieved revenue growth through the execution of pricing strategies. Promoting raw material source diversification, increased procurement of recycled materials, and product differentiation through the utilization of recycled copper Building cross-channel opportunities through the sharing of smartphone market intelligence, while accelerating performance improvements of existing products and the development of new products Rapid demand growth led to the decision to expand capacity. Further capacity expansion and the utilization of JX Advanced Metals' sites and sales channels are under consideration Promoting collaboration in product development and other areas Sensors & Medical Products In response to growing AI server- related demand, we decided to increase production capacity by approx. 30% vs. FY2025 (announced in August 2026). Considering additional capacity expansion with anticipating further demand growth AI Server Shipment Growth Rate 29.6% (CAGR 2025~2030) (Source) Prismark Partners LLC
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FY2026 1Q (Fiscal year ending March 31, 2027) Results 9Copyright © 2026, JX Advanced Metals Corporation, All rights reserved.
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FY2025 FY2026 bil. yen 1Q Results 1Q Results Absolute % Revenue 191.3 260.6 ＋69.3 ＋36% (Focus Businesses) 117.0 145.2 ＋28.2 ＋24% (Base Businesses) 75.0 123.7 ＋48.7 ＋65% (Other) -0.7 -8.3 - 7.6 ー Operating profit 29.6 81.4 ＋51.8 ＋175% (Focus Businesses) 16.2 27.5 ＋11.3 ＋70% (Base Businesses) 14.6 56.8 ＋42.2 ＋289% (Other) -1.2 -2.9 - 1.7 ー Profit before tax 28.5 79.6 ＋51.1 ＋179% Net profit 23.2 60.4 ＋37.2 ＋160% 18.9 53.1 ＋34.2 ＋181% Exchange rate (JPY/USD) 145 159 ＋14 ＋10% LME copper price (¢/lb) Average 432 604 ＋172 ＋40% End/start of period 439/455 552/605 Profit attributable to owners of parent Difference Consolidated statement of income 10Copyright © 2026, JX Advanced Metals Corporation, All rights reserved.
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(Details) + 19.1 + 26.5 + 7.8 -3.2 + 1.6 For more details SEMI － + 0.8 + 5.4 － - 0.3 p12 ICT － + 1.9 + 2.4 － + 1.1 p13 Base + 19.1 + 23.8 － - 3.2 + 2.5 p14 Others － － － － - 1.7 FY2025 FY2026 bil. yen 1Q Results 1Q Results Absolute % Focus Revenue 38.8 52.1 ＋13.3 ＋34% Businesses OP 8.5 14.4 ＋5.9 ＋69% Revenue 78.2 93.1 ＋14.9 ＋19% OP 7.7 13.1 ＋5.4 ＋70% Base Revenue 75.0 123.7 ＋48.7 ＋65% Businesses OP 14.6 56.8 ＋42.2 ＋289% Other Revenue - 0.7 - 8.3 - 7.6 ー OP - 1.2 - 2.9 - 1.7 ー Revenue 191.3 260.6 ＋69.3 ＋36% OP 29.6 81.4 ＋51.8 ＋175% Common expenses Semiconductor materials ICT materials Difference Total Metals & Recycling Revenue and operating profit by business segment 11Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. Difference in operating profit ＋19.1 ＋26.5 ＋7.8 - 3.2 ＋1.6 29.6 81.4 FY2025 1Q Results One-off Exchange rate, LME Copper, etc Volume variance (Focus) Volume variance (Base) Cost variance, etc FY2026 1Q Results (bil.yen) Exchange rate +6.0 Copper prices, etc. +21.0 [Mineral] Gain from partial sale of Caserones interest +19.0
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Analysis of difference in operating profit: Semiconductor Materials segment (FY2026 1Q Results vs. FY2025 1Q Results) 12Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. Thin Film Materials TaNb Analysis of difference in operating profit Segment overview Revenue and operating profit by segment ＋5.4 - 0.3 8.5 ＋0.8 14.4 FY2025 1Q Results Exchange rate Volume variance Cost variance, etc FY2026 1Q Results (bil. yen) [Thin Film] +4.5 [TaNb] +1.0 [Thin Film] +2.0 [TaNb] -1.0 FY2025 FY2026 bil. yen 1Q Results 1Q Results Absolute % Revenue 32.5 45.6 ＋13.1 ＋40% OP 8.4 15.3 ＋6.9 ＋82% Revenue 10.0 10.8 ＋0.8 ＋8% OP 0.3 -1.1 - 1.4 - Revenue -3.7 -4.3 - 0.6 - OP -0.2 0.2 ＋0.4 - Revenue 38.8 52.1 ＋13.3 ＋34% OP 8.5 14.4 ＋5.9 ＋69% Thin film materials Tantalum and Niobium Adjustments, etc. Segment total Difference ⁻ OP increased due to growth in sales of main products driven by the continuous expansion of AI data center related demand ⁻ OP declined due to the appreciation of the euro etc., despite higher sales volumes of tantalum powder for capacitors
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13 Analysis of difference in operating profit: ICT Materials segment (FY2026 1Q Results vs. FY2025 1Q Results) Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. Functional Materials Toho Titanium TATSUTA Electric Wire and Cable Analysis of difference in operating profit Segment overview Revenue and operating profit by segment ＋1.9 ＋2.4 ＋1.1 7.7 13.1 FY2025 1Q Results Exchange rate Volume variance Cost variance, etc FY2026 1Q Results (bil. yen) [Toho/TATSUTA] Inventory etc. +1.0 [Functional] +2.5 FY2025 FY2026 bil. yen 1Q Results 1Q Results Absolute % Revenue 37.8 49.3 ＋11.5 ＋30% OP 5.7 8.9 ＋3.2 ＋56% Revenue 40.4 43.8 ＋3.4 ＋8% OP 2.0 4.2 ＋2.2 ＋110% Revenue 78.2 93.1 ＋14.9 ＋19% OP 7.7 13.1 ＋5.4 ＋70% Functional materials Difference Toho Titanium, TATSUTAElectric Wire and Cable, and etc. Segment total ⁻ OP increased due to solid smartphone- related demand and increased sales resulting from expanding AI data center- related demand ⁻ OP increased mainly due to yen depreciation
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14Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. Metals & Recycling Mineral resources Analysis of difference in operating profit Segment overview Revenue and operating profit by segment ＋19.1 ＋23.8 - 3.2 ＋2.5 14.6 56.8 FY2025 1Q Results One-off Exchange rate, LME Copper, etc Volume variance Cost variance, etc FY2026 1Q Results (bil. yen) Yen depreciation +3.0 Copper prices,etc. +21.0 [Mineral] -2.5 [Metals & Recycling] -0.5 [Mineral] Mine expenses etc. +1.0 [Metals & Recycling] Sulfuric acid etc. +0.5 [Adjustments] Unrealized profit elimination＋1.0 [Mineral] Gain from partial sale of Caserones interest +19.0 FY2025 FY2026 bil. Yen 1Q Results 1Q Results Absolute % Revenue 0.8 1.2 ＋0.4 ＋50% OP 11.5 47.2 ＋35.7 ＋310% Revenue 74.2 122.7 ＋48.5 ＋65% OP 3.5 9.1 ＋5.6 ＋160% Revenue 0.0 -0.2 - 0.2 - OP -0.4 0.5 ＋0.9 - Revenue 75.0 123.7 ＋48.7 ＋65% OP 14.6 56.8 ＋42.2 ＋289% Segment total Mineral resources Difference Metals & Recycling Adjustments, etc. ⁻ OP increased mainly due to yen depreciation and higher copper prices etc. and sulfuric acid margin ⁻ OP increased mainly due to gain from partial sale of Caserones interest, yen depreciation and higher copper prices etc. Analysis of difference in operating profit: Metals & Recycling segment (FY2026 1Q Results vs. FY2025 1Q Results)
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111.8 83.1 726.5 642.4 1,439.0 342.7 1,451.1 508.0 66.3 324.3 219.0 436.6 ◼ Consolidated cash flows Consolidated balance sheet・Cash flows / CAPEX, Depreciation, R&D expenses / Shareholder returns 15Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. Net interest- bearing debt (bil. yen) FY2026 1Q Results Net interest-bearing debt temporarily decreased, as the proceeds from the CB issuance intended for the tender remained as cash on hand at the end of this quarter Cash/Deposit Other assets Interest bearing debt Other liabilities Total equity attributable to owners of the parent Minority interest Cash/Deposit Other assets Interest bearing debt (incl. bonds) Other liabilities Total equity attributable to owners of the parent Minority interest 257.9 217.6 ◼ CAPEX, Depreciation, R&D expenses (bil. yen) ◼ Consolidated balance sheet March 31, 2026 (Actual) June 30, 2026 (Actual) FY2024 FY2025 FY2026 (bil. yen) Results Results 1Q Results CAPEX 92.3 84.5 25.6 Depreciation 44.0 44.7 12.6 R&D Expenses 17.8 20.0 5.3 Cash flows from operating activities 13.2 Cash flows from investing activities 7.9 Free Cash Flow 21.1 Cash flows from financing activities 130.9 Net increase (decrease)in cash and cash equivalents 152.0 Impact from exchange rate, etc. 0.7
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FY2026 (Fiscal year ending March 31, 2027) Forecasts 16Copyright © 2026, JX Advanced Metals Corporation, All rights reserved.
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Consolidated statement of income 17 Operating profit sensitivity (July 2026 onward) Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. (bil. Yen) Exchange rate 5-yen weaker yen LME copper price ＋10¢/lb Focus Businesses ＋3.5 ー Base Businesses ＋3.5 ＋3.5 Total ＋7.0 ＋3.5 FY2026 Forecasts FY2026 Forecasts bil. yen (in May) (in August) Absolute % Revenue 930.0 1,025.0 ＋95.0 +10% (Focus Businesses) 530.0 585.0 ＋55.0 +10% (Base Businesses) 420.0 470.0 ＋50.0 +12% (Other) -20.0 -30.0 - 10.0 - Operating profit 190.0 232.0 ＋42.0 +22% (Focus Businesses) 82.0 100.0 ＋18.0 +22% (Base Businesses) 124.0 147.0 ＋23.0 +19% (Other) -16.0 -15.0 ＋1.0 - Profit before tax 178.0 221.0 ＋43.0 +24% Net profit 140.0 174.0 ＋34.0 +24% 114.0 141.0 ＋27.0 +24% Exchange rate (JPY/USD) 150 157 ＋7 +5% LME copper price (¢/lb) Average 520 586 ＋66 +13% End/start of period 552/520 552/580 Profit attributable to owners of parent Difference Exchange rate / LME copper price assumption July-September October-March Exchange rate (JPY/USD) 160 155 LME copper price (￠/lb) 580
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(Details) + 40.2 + 3.0 - 9.3 + 8.1 For more details SEMI + 3.4 + 1.8 － + 5.8 p19 ICT + 3.6 + 1.2 － + 2.2 p20 Base + 33.2 － - 9.3 - 0.9 p21 Others － － － + 1.0 FY2026 Forecasts FY2026 Forecasts bil. yen (in May) (in August) Absolute % Focus Revenue 200.0 230.0 ＋30.0 +15% Businesses OP 50.0 61.0 ＋11.0 +22% Revenue 330.0 355.0 ＋25.0 +8% OP 32.0 39.0 ＋7.0 +22% Base Revenue 420.0 470.0 ＋50.0 +12% Businesses OP 124.0 147.0 ＋23.0 +19% Other Revenue - 20.0 - 30.0 - 10.0 - OP - 16.0 - 15.0 ＋1.0 - Revenue 930.0 1,025.0 ＋95.0 +10% OP 190.0 232.0 ＋42.0 +22% Common expenses Semiconductor materials ICT materials Difference Total Metals & Recycling Revenue and operating profit by business segment 18Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. Difference in operating profit ＋40.2 ＋3.0 - 9.3 ＋8.1 190.0 232.0 FY2026 Forecasts (in May) Exchange rate, LME Copper, etc Volume variance (Focus) Volume variance (Base) Cost variance, etc. FY2026 Forecasts (in August) (bil.yen) Exchange rate +13.0 Copper prices, etc. +27.0 Improvement in selling prices +2.5 Mitigation of the impact from the Middle East situation +2.0 Sulfuric acid +1.5 Inventory, cost variance etc. +2.0 Reduced mine production due to adverse weather conditions in Chile -6.0
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＋3.4 ＋1.8 ＋5.8 50.0 61.0 FY2026 Forecasts (in May) Exchange rate Volume variance Cost variance, etc FY2026 Forecasts (in August) (bil. yen) [Thin film] +2.0 [Thin film] Improvement in selling prices +1.5 (Sputtering targets for SEMI+1.0, InP+0.5) Inventory, cost variance etc. (incl. impact from the Middle East situation) +2.5 [TaNb] Improvement in selling prices +1.0 Inventory etc. +0.5 Analysis of difference in operating profit: Semiconductor Materials segment (FY2026 Forecasts: August vs. May Forecasts) 19Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. Thin Film Materials TaNb Analysis of difference in operating profit Segment overview Revenue and operating profit by segment FY2026 Forecasts FY2026 Forecasts bil. yen (in May) (in August) Absolute % Revenue 170.0 190.0 ＋20.0 ＋12% OP 49.0 58.0 ＋9.0 ＋18% Revenue 50.0 55.0 ＋5.0 ＋10% OP 1.0 3.0 ＋2.0 ＋200% Revenue - 20.0 - 15.0 ＋5.0 - OP － － - - Revenue 200.0 230.0 ＋30.0 ＋15% OP 50.0 61.0 ＋11.0 ＋22% Adjustments, etc. Segment total Thin film materials Tantalum and Niobium Difference ⁻ OP will increase mainly due to growth in sales volume, improved selling prices for sputtering targets for SEMI and InP substrates and yen depreciation ⁻ Despite the lower sales in low profitable tantalum powder for capacitors, OP will increase due to improved selling prices etc.
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20 Analysis of difference in operating profit: ICT Materials segment (FY2026 Forecasts: August vs. May Forecasts) Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. Revenue and operating profit by segment Functional Materials Toho Titanium, TATSUTA Electric Wire and Cable, ＋3.6 ＋1.2 ＋2.2 32.0 39.0 FY2026 Forecasts (in May) Exchange rate Volume variance Cost variance, etc FY2026 Forecasts (in August) (bil. yen) [Functional]＋0.5 [Toho/TATSUTA] +0.5 Impact from the Middle East situation etc. +1.0 Cost variance etc. +1.0 FY2026 Forecasts FY2026 Forecasts bil. yen (in May) (in August) Absolute % Revenue 160.0 180.0 ＋20.0 ＋13% OP 23.0 26.0 ＋3.0 ＋13% Revenue 170.0 175.0 ＋5.0 ＋3% OP 9.0 13.0 ＋4.0 ＋44% Revenue 330.0 355.0 ＋25.0 ＋8% OP 32.0 39.0 ＋7.0 ＋22% Functional materials Toho Titanium, TATSUTAElectric Wire and Cable, and etc. Segment total Difference ⁻ OP will increase mainly due to yen depreciation and the mitigation of the impact from the Middle East situation Analysis of difference in operating profit Segment overview
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21Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. Revenue and operating profit by segment ＋33.2 - 9.3 - 0.9 124.0 147.0 FY2026 Forecasts (in May) Exchange rate, LME Copper, etc Volume variance Cost variance, etc FY2026 Forecasts (in August) (bil. yen) Yen depreciation +6.0 Copper price etc. +27.0 [Mineral] -8.0 [Metals & Recycling] -1.5 [Mineral] Mine expenses etc. -0.5 FY2026 Forecasts FY2026 Forecasts bil. yen (in May) (in August) Absolute % Revenue 10.0 5.0 - 5.0 - 50% OP 97.0 118.0 ＋21.0 ＋22% Revenue 410.0 465.0 ＋55.0 ＋13% OP 27.0 29.0 ＋2.0 ＋7% Revenue － － - - OP － － - - Revenue 420.0 470.0 ＋50.0 ＋12% OP 124.0 147.0 ＋23.0 ＋19% Segment total Mineral resources Difference Metals & Recycling Adjustments, etc. Metals & Recycling Mineral resources ⁻ Despite the reduced mine production due to adverse weather conditions in Chile, OP will increase mainly due to yen depreciation and higher copper price assumption ⁻ OP will increase mainly due to yen depreciation and higher copper price assumption Analysis of difference in operating profit: Metals & Recycling segment (FY2026 Forecasts: August vs. May Forecasts) Analysis of difference in operating profit Segment overview
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(bil.yen) Cash flows from operating activities 135.0 Cash flows from investing activities - 95.0 Free Cash Flow 40.0 Cash flows from financing activities - 24.0 Net increase (decrease)in cash and cash equivalents 16.0 Impact from exchange rate, etc. - 1.0 111.8 93.0 726.5 697.0 1,439.0 342.7 1,561.0 357.0 66.3 324.3 81.0 495.0 Consolidated balance sheet / Cash flows for FY2025, Shareholder returns 414.0257.9 Dividend Policy (Reproduced) Our basic dividend policy is to target a consolidated dividend payout ratio of approximately 25% as a benchmark and establish a minimum dividend of ¥20 per share. However, in the event of large- scale asset disposals or share repurchase, we intend to separately consider the total payout ratio. In addition, for the fiscal year ending March 31, 2027, given our execution of a substantial share repurchase (i.e. the Tender Offer), the dividend is expected to be set at the minimum level of ¥20 per share FY2026 Forecasts 22 March 31, 2026 (Results) (bil. yen) March 31, 2027 (Forecasts) Net interest- bearing debt Cash/Deposit Other assets Interest bearing debt Other liabilities Total equity attributable to owners of the parent Minority interest Cash/Deposit Other assets Interest bearing debt (incl. bonds) Other liabilities Total equity attributable to owners of the parent Minority interest Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. ◼ Consolidated cash flows ◼ Shareholder returns ◼ Consolidated balance sheet FY2026 Dividend per Share Expected 20 yen Interim Year-end 10 yen 10 yen Dividend payout ratio 13% (Reference: Total payout ratio for FY2026 is expected to be approx. 151%） While interest bearing debt is expected to increase mainly due to the issuance of CB, equity will decline thanks to share repurchases, resulting in an improvement in capital efficiency *Share repurchase amount 194.9 billion yen ◼ CAPEX （bil. yen） Forecasts in May Forecasts in August 114.0 135.0 Reflecting capacity expansion investments
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◼ Appendix 23Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. • Topics - FY2026 (Fiscal year ending March 31, 2027) • JX Advanced Metals at a Glance • Company history and the vision to which we aspire going forward • List of main products • Our data center-related products • Overview of Semiconductor sputtering targets • Strengths of our semiconductor targets that enable a global top market share • InP substrates • Initiatives in Base Businesses • Medium- to long-term business target
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• May • June • June • June • June • June • July • August Topics - FY2026 (Fiscal year ending March 31, 2027) 24Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. Execution of Final Agreement Concerning Integration of Businesses for the Purchase of Copper Concentrates and the Sale of Related Products Automation Investment in Semiconductor Sputtering Target Processing Line at Nikko Metals Taiwan Expansion of Production Capacity for Functional Tantalum Powder at TANIOBIS Plant in Thailand Expansion of Production Capacity for Sputtering Targets for Magnetic Devices Used in Hard Disk Media Decision on Capital Investment Policy to Significantly Expand InP Substrate Production Capacity Expansion of Production Capacity for Materials for Semiconductor Inspection Probe Cards (Rhodium Plating Solutions) Expansion of Processing Capacity for Semiconductor Sputtering Targets at JX Advanced Metals Korea Expansion of Production Capacity for Liquid Leakage Detection System in Response to Growing Demand from the AI Data Center Market (TATSUTA) Semiconductor Materials Metals & RecyclingICT Materials
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JX Advanced Metals at a Glance 25 Note 1: Our estimate; Note 2: Fuji Chimera Research Institute, Inc. “Electronics Mounting New Materials Handbook 2024” (actual record in 2023; for FPC only, based on shipping quantity basis); Note 3: FPC (Flexible printed circuits): Electronic circuits with combination of insulated base films and conductive metallic materials made with photolithographic; Note 4: Chemical Vapor Deposition; Note 5: Atomic Layer Deposition Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. Leading global supplier of advanced materials in semiconductor and ICT industries Businesses and Main Products Focus BusinessesBase Businesses Support growth of Focus Businesses by reinforcing sustainable supply chains of copper and minor metals (tantalum, titanium, etc.) Our highly competitive core business with an advanced technological excellence End Uses AI Servers Smartphones Mobility (xEV/ADAS) Wearable Semiconductor Materials Sputtering targets for Semiconductors Metals required for nano-scale deposition on semiconductor wafers #1 ICT Materials Rolled Annealed Copper Foil (RACF) 78%2 #1 Metal foil with great ductility used for FPC (Flexible printed circuits)3 Copper Titanium Alloys Alloy material with superior strength, conductivity and bendability Light emitting and receiving elements in optical communications InP Substrates Single crystal substrates used for radiation and infrared sensors CdZnTe Substrates Metal raw materials used to form thin film in CVD/ALD process Material for CVD4/ALD5 Precursors Sputtering targets for magnetic devices Metals required for nano- scale deposition Large Capacity HDD related to AI Server Electromagnetic shielding film Functional film to protect mobile device circuits from electromagnetic noise Metal powders for sputtering targets for SEMI and capacitors Functional Materials TATSUTA Thin film Materials TaNb. Tantalum powder Approx. 65%1
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26Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. Company history and the vision to which we aspire going forward Changed English name 2024 History of the business Company history English name changed to “JX Advanced Metals Corporation” Expanded into metal smelting and refining business 1916 Started operations at the Saganoseki Smelter & Refinery 1978Launched recycling business Establisehd Hitachi Works Built new recycling furnace 1985 Full-scale entry into electronic materials business Started operations at Isohara Works 1929 Established Nippon Mining Established Nippon Mining Holdings 2002 Established Nippon Mining Holdings (now JX Advanced Metals Corporation) as joint holding company of Nikko Metals and Japan Energy Changed to JX Metals Corporation 2016 Strengthened minor metals business Acquired H.C. Starck Tantalum & Niobium (now TANIOBIS GmbH) shares Revised long-term vision 2023 Full-scale entry into metal fabrication business 1964 Established Kurami Works Established Long-term vision 2019 Renamed upon the establishment of JXHD (now ENEOS HD) following the merger of Nippon Oil Corporation and Nippon Mining Holdings Changed name to JX Nippon Mining & Metals Corporation 2010 1905 Founded the Hitachi Mine (origin of JX Advanced Metals Group) Foundations of the Nissan Conglomerate, which fostered such companies as Hitachi and Nissan Motor under its umbrella Transition from a process industry-type firm to a technology- based firm, aiming to contribute to the realization of a sustainable society as a global leader in the semiconductor and ICT materials sectors to realize a highly profitable structure, even in the face of intensifying international competition ⚫ Key strategies ⚫ Target business portfolio [Growth] Focus Businesses - Position as the core of our growth strategy - Aim to achieve profit growth exceeding market growth through technological differentiation [Business Foundation] Base Businesses - Support growth of Focus Businesses by reinforcing supply chains - Position copper and minor metals indispensable to semiconductor and ICT materials as core domains 2018
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27Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. 147.0 45.8 160.2 159.6 5.7 402.1 40.9 21.1 10.4 100.9 37.6 Revenue 884.6 bil yen*1 Segment Subsegment Main products Main applications End uses Semiconductor Materials Thin Film Materials Sputtering targets for SEMI Formation of thin metal film on semiconductor wafers Semiconductors (data centers, PCs, smartphones) Sputtering targets for magnetic devices Formation of thin metal film on magnetic recording media HDD (data centers), magnetic sensors InP substrates Optical ⇔ electricity conversion (light-receiving and light-emitting elements) Optical communication (data centers) CdZnTe substrates Infrared detection, radiation detection Defense systems, CT scan CVD/ALD materials Wiring materials for semiconductors Semiconductors (data centers, PCs, smartphones) Tantalum and Niobium Tantalum powder for sputtering targets Materials for sputtering targets for semiconductors Semiconductors (data centers, PCs, smartphones) Tantalum powder for capacitors Materials for tantalum capacitors Tantalum capacitors (data centers, PCs) ICT Materials Functional Materials Rolled annealed copper foil Materials for FPC (flexible printed circuits) Smartphones, wearable devices, robots, medical catheters Copper titanium alloys Connector materials, spring materials for camera modules Connectors for servers (data centers), camera modules Toho Titanium/ TATSUTA Electric Wire and Cable (Toho Titanium) Titanium sponge Aircraft engine parts, fuselage materials Aircraft, chemical/power plants Chemical products (ultra-fine nickel powder) Materials for internal electrodes of multi-layer ceramic capacitors (MLCC) Multi-layer ceramic capacitors THC catalysts Catalysts for manufacture of polypropylene, polyolefin Automotive interiors and exteriors, home appliances, packaging materials (TATSUTA) Wires for infrastructure and industrial equipment Electric wires Electric wires and cables for power plants and other plants EMI shielding films Protection for internal circuits of mobile electronic devices Smartphones Metals & Recycling Mineral Resources Copper concentrate, electrolytic copper, molybdenum concentrate - - (Ownership interest) Caserones Copper Mine: 25% , Los Pelambres Copper Mine: 12.52%, Escondida Copper Mine: 3% Metals & Recycling Electrolytic copper, cast copper, precious metals, sulfuric acid - - (Ownership interest) Pan Pacific Copper: 47.8% Revenue and operating profit by subsegment (FY2025)Main products (photo) Semiconductor Materials ICT Materials Metals & Recycling Thin Film Materials Tantalum and Niobium Functional Materials Toho Titanium, TATSUTA Electric Wire and Cable, and etc. Metals & Recycling Mineral Resources Operating profit 175.0 bil yen*2 Sputtering targets for SEMI Sputtering targets for magnetic devices InP substrates CdZnTe substrates Tantalum powder CVD/ALD materials Copper titanium alloys Electrolytic copper Copper concentrate (copper mine) Focus Businesses Base Businesses *1: Includes -35.8 billion yen in internal eliminations; 2: Includes common costs, etc. of -35.2 billion yen and Tantalum and Niobium Business operating loss of -0.7 billion yen Thin Film Materials Functional Materials Toho Titanium, TATSUTA Electric Wire and Cable, and etc. Metals & Recycling Mineral Resources Rolled annealed Copper foil List of main products As of August 2026
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Our data center-related products 28 Global shareSemiconductor Materials ICT Materials HDD (Save Data) Sputtering targets for magnetic devices InP substratesCVD/ALD precursor materials Tantalum powderCopper Titanium Alloys Wafer leak sensor (Tatsuta Electric Wire and Cable) Approx. 60%*1 Approx. 60%*1 *1 Our estimate; *2 Our estimate, including for sputtering targets ; Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. Inside an AI Server (Out assumption) Signal line Optical network DRAM (Memorizing calculation) … Tantalum Capacitor RDL Interposer Package Substrate HBM PCB Substrate GPU TSV GPU package GPU GPU Switch (Inter-GPU computing coordination) Power line Sputtering targets for SEMI Approx. 40%*1 Approx. 50%*2 SSD (Memorizing data) DPU (Communication) CPU (Calculation Command) Approx. 65%*1
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Overview of Semiconductor sputtering targets 29Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. Si Wafer Semiconductor Chip Process in which sputtering targets are used Transistor formation Formation of oxide film Circuit pattern formation Embedded circuit Polishing Wiring layer formation (Repetitive process) Packaging High-purity metal materials required for the PVD*1 process used to form transistors and wiring layers on silicon wafers *1 PVD (Physical Vapor Deposition) : A method in which metal materials are vaporized and deposited onto a substrate. The sputtering method is one of the most common PVD processes. Manufacturing Process of Semiconductor Chip What is Semiconductor sputtering targets? Usage and structure of Semiconductor sputtering targets Magnet Ion Plasma Atoms from Target Wafer Sputtering targets Illustrative image of inside sputtering chamber Film formation in sputtering process (Illustrative) Global Share Approx. 65%
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Strengths of our semiconductor targets that enable a global top market share 30Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. First-class technology Possess superlative technology such as purification, composition- microstructure control, surface treatment, as well as analysis and evaluation Designated as the standard materials for SEMI equipment through relationships with SEMI equipment manufactures backed by our development capabilities Established long-standing suppliance relationships and recognized by SEMI manufactures as a great supplier, exemplified by their awards The highest global purity level copper Purity 99.9999999% JX Advanced Metals SEMI equipment manufacturer Building a strong global production network that has geographical advantages with SEMI manufacturing Hitachinaka Works Arizona Mesa Close-knit partnership with SEMI equipment manufacturers Long-standing customers (SEMI manufacturers) relationships Global production network Achieving a global top market share through strong technological capabilities, deep relationships with manufacturers and customers, and a fully established global production network TSMC Intel SK hynix
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InP substrates 31Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. ➢ Materials used in data centers and internet infrastructure for optical communications where electrical signals are converted into optical signals and vice versa ➢ Used in the light-receiving and light-emitting elements of optical transceivers ➢ With the shift toward higher-speed communications and increasing power consumption within data centers, optical communications are increasingly being applied to shorter distances ➢ The expanding scope of optical communications is driving higher demand for transceivers, which leads to rising demand for our InP substrates Electrical signal Electrical signal Optical fiberOptical signal Locations where InP substrates are used Shift from electrical to optical for faster/higher- capacity communications Between data centers Within data centers Between racks Within rack Inside AI server Short Long Communication link distance Optical connection Few Many Electrical connection Connection inside board Connection between chips Shift to on- chip optical What are InP substrates? Growth opportunities arising from shift from electrical to optical Initiatives to expand InP profitablity Press release Production capacity (vs. FY2025) Investment amount Jul. 2025 +20% Approx. 1.5 billion yen Oct. 2025 Approx. +50% Approx. 3.3 billion yen Feb. 2026 Approx. 3x (expected to start operations sequentially from FY2027 onward) Approx. 20 billion yen Jun. 2026 Approx. 7-10x Up to 120 billion yen Wiring between racks Wiring within rack ⚫ InP (indium phosphide) substrates for optical communications are seeing strong sales, driven by data centers ⚫ The company has decided to make additional capital investments to expand capacityto capture demand in this rapidly growing market ⚫ Further growth potential is expected from the progressive shift to the use of optical communications within data centers New AI server structure (generation) Old Number of optical transceivers
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Initiatives in Base Businesses 32Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. Build an optimal Base Businesses structure to advance toward a Focus Businesses centered portfolio aligned with our long-term vision Key initiatives in Base Businesses: Optimization of business scale and steadily securing the supply chain for focus business ➢ Execution of Final Agreement The ownership stakes in PPC: JX Advanced Metals 32.50%, Mitsubishi Materials 32.00%, Mitsui Kinzoku 21.90%, Marubeni 13.60% Integration of businesses for the purchase of copper concentrates and the sales of related products by Pan Pacific Copper (JX Advanced Metals, Mitsui Kinzoku, and Marubeni) and Mitsubishi Materials FY2025 Participation in Copi PJ (minor metals and rare earth)・Marubeni’s participation in the development evaluation Sale of all shares in LS-Nikko, a copper smelting JV in Korea Acquisition of shares in eCycle (in collaboration with Sojitz) FY2022 Investment in Mibra Mine (Tantalum) Partial transfer of shares in Pan Pacific Copper FY2023 Partial divestment of interests in the Caserones Copper Mine and Los Pelambres Copper Mine Enhancing the added value of smelting and recycling businesses (collaborating with Mitsubishi Corporation) FY2024 Additional divestment of interests in the Caserones Copper MineMineral Resources From base metals to minor metals Metals/ Recycling business Toward a more efficient, recycling- centered structure Partial transfer of shares of SCM Minera Lumina Copper Chile, operator of the Caserones Copper Mine, and the transfer of interests in the copper Mine development project in the Frontera Area Acquisition of shares in Fireweed Metals Corp,(minor metals etc.) （Closed in April 2026）
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Medium- to long-term business target 33 ✓ Steadily progressing toward achieving our goals Copyright © 2026, JX Advanced Metals Corporation, All rights reserved. FY2023 FY2024 FY2025 FY2026 (Ref.) FY2027 Results Results Results Forecasts CAGR (FY2023-FY2026) Target [Consolidated] 86.2 bil yen 112.5 bil yen 175.0 bil yen 232.0 bil yen (39%) (Year-on-year growth rate) 30.5% 55.6% 32.6% [Focus Businesses] 27.3 bil yen 51.8 bil yen 71.0 bil yen 100.0 bil yen (54%) (Year-on-year growth rate) 89.7% 37.1% 40.8% [Consolidated] 5.7% 15.7% 19.8% 22.6% 12%~17% [Focus Businesses] 8.8% 12.5% 14.3% 17.1% 15%~20% [Semiconductor materials segment] 21.4% 18.0% 22.3% 26.5% 25%~30% [ICT materials segment] 0.5% 9.5% 9.9% 11.0% 8%~13% Percentage of [Focus Businesses] 26% 41% 34% 40% 67% or more operating profit [Semiconductor materials segment] 25% 21% 19% 25% 45% or more ROE 18.3% 11.0% 15.6% 19.8% 10% or more Net Debt/EBITDA ratio 2.6x 1.6x 1.2x 1.5x Less than 1.5x CAGR10%~15% (FY2023-FY2027) CAGR35%~40% (FY2023-FY2027) Operating profit margin Operating profit
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The Company’s goals, plans, estimates, forecasts, expectations, targets, and other future information stated in this material are only the Company’s determinations or opinions based on the information available to the Company at the time of preparation of this material and certain assumptions, and the Company’s actual business results, financial condition, and other results may differ significantly from the details in this material or forecasts from this material due to economic situation and market environment, business activities, environment of competition with other companies, and other various factors, within or outside Japan. Disclaimer 34Copyright © 2026, JX Advanced Metals Corporation, All rights reserved.