6266 Q2 2026 Earnings Presentation

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TAZMO Q2 FY2026 Financial Announcement April 2026 - June 2026 10101 T ML C ORL August 10 , 2026 Security Code : 6266 Company Guide 1111000 0101111111101 11010110 ahttps : //tazmo.co.jp/wp/ pd - apin602 % Auedшoɔ / LL / https://tazmo.co.jp/wp/wp-content/uploads/2025/11/company%20guide.pdf 10

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4 © 2024 TAZMO Co.,Ltd. Q2 FY2026 Financial Highlights ◼ Overview ◼ Both sales and profit declined year on year. Net sales fell short of the plan in the Semiconductor Equipment, Transfer Equipment and Surface Treatment Equipment Businesses. ◼ Profit also fell well short of the plan, reflecting the lower net sales, valuation losses on equipment not yet inspected and accepted, and provisions for additional costs identified on certain equipment. ◼ Order intake grew substantially in the Semiconductor Equipment, Transfer Equipment and Surface Treatment Equipment Businesses, marking record highs on both a quarterly and a cumulative basis. 12,684 123 270 35 Net sales Operating income Ordinary income Net income(*) YoY Change △24.4% Million Yen Million Yen Million Yen Million Yen YoY Change △95.1% YoY Change △88.6% YoY Change △97.8% (*) Net income: Net income attributable to owners of parent

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© 2024 TAZMO Co.,Ltd. 5 Q2 FY2026 Financial Summary Net sales fell short of the plan, mainly due to delays in inspection and acceptance in the Semiconductor Equipment and Surface Treatment Equipment Businesses. Profit also fell well short of the plan, reflecting the lower net sales, valuation losses on equipment not yet inspected and accepted, and the recognition of additional costs. FY2026 Initial H1 Estimate vs. Initial H1 Estimate (%) FY2026 Full Year Estimate vs. Full Year Estimate (%) 15,570 81.5 35,500 35.7 - - - - 890 13.8 3,600 3.4 800 33.9 3,500 7.7 600 6.0 2,500 1.4 (Millions of yen) Q2 FY2025 Actual Q2 FY2026 YoY change (%)Actual Net sales ratio (%) Net sales 16,787 12,684 - △24.4 Gross profit 5,231 3,598 28.4 △31.2 Operating income 2,517 123 1.0 △95.1 Ordinary income 2,384 270 2.1 △88.6 Net income attributable to owners of parent 1,645 35 0.3 △97.8

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6 © 2024 TAZMO Co.,Ltd. Trend in Net sales and Operating profit (Quarterly ) 6,036 6,848 4,072 7,397 3,864 6,569 8,599 9,127 5,905 10,334 8,499 11,125 7,516 9,270 10,326 8,314 5,967 6,717 645 643 92 1424 -136 676 1865 1249 570 2265 1764 1316 1210 1307 1905 345 86 37 -2,000 0 2,000 4,000 6,000 8,000 10,000 12,000 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Net Sales Operating Income 2022 2023 2024 2025 2026 (Millions of yen)

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© 2024 TAZMO Co.,Ltd. 7 Trend in Net sales and Operating profit (Full year ) 11,329 17,169 19,036 18,223 19,516 22,001 24,356 28,161 35,865 35,428 12,684 1,346 1,672 1,606 951 1,886 2,092 2,806 3,654 5,917 4,768 123 -3,800 1,200 6,200 11,200 16,200 21,200 26,200 31,200 36,200 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 2026 2Q Net Sales Operating Income (Millions of yen)

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© 2024 TAZMO Co.,Ltd. 8 Balance Sheet (Millions of yen) FY2025 Actual Q2 FY2026 Actual YoY change(%) Current assets 37,809 38,383 573 Non-current assets 9,083 10,136 1,053 Property, plant and equipment 7,812 8,876 1,063 Intangible assets 199 193 △5 Investments and other assets 1,070 1,066 △4 Total assets 46,893 48,520 1,626 Current Liabilities 14,393 15,892 1,499 Non-Current Liabilities 5,462 5,720 257 Total liabilities 19,855 21,612 1,757 Total net assets 27,037 26,907 △130 Equity ratio 56.6% 54.4% △2.2P ▍Current Liabilities ▍Non -Current Liabilities Major Change ▍Current Assets Cash and deposits △1,498 Notes and accounts receivable - trade ＋397 Inventories ＋1,545 Notes and accounts payable - trade ＋888 Electronically recorded obligations – operating △1,478 Contract liabilities ＋2,557 Short-term borrowings ＋321 Income taxes payable △676 Long-term borrowings +207 ( Millions of yen )

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© 2024 TAZMO Co.,Ltd. 9 Cash Flow (Millions of yen) Q2 FY2025 Actual Q2 FY2026 Actual YoY change(%) Cash flow from operating activities 4,394 △336 △4,730 Cash flow from investing activities △4,540 △290 4,249 Free cash flow △145 △626 △480 Cash flow from financing activities △556 7 564 Cash on hand 8,719 13,456 4,737 ▍ Cash flow from operating activities Profit before income taxes 270 Contract Liabilities 2,401 Inventories △1,676 Income taxes paid △826 ▍ Cash flow from investing activities Net increase in time deposits 1,056 Purchase of property, plant and equipment △1,327 ▍ Cash flow from financing activities Proceeds from long-term borrowings 2,000 Repayments of long-term borrowings △1,640 Dividends paid △497 Highlights ( Millions of yen )

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10 © 2024 TAZMO Co.,Ltd. 7,491 8,008 8,469 9,083 10,136 2,415 1,959 866 566 1,034 17,983 22,173 20,294 15,410 17,205 6,365 8,387 9,226 5,559 5,368 5,141 6,899 10,343 16,274 14,775 2022 2023 2024 2025 2026 Q2 Cash equivalent Trade receivable Investors Other current assets Noncurrent assets Balance Sheet ▍Assets ▍Liabilities/Equity 17,549 20,095 24,642 27,037 26,907 13,906 15,810 15,742 11,929 13,156 7,941 11,522 8,815 7,926 8,456 0 10,000 20,000 30,000 40,000 50,000 2022 2023 2024 2025 2026 Q2 Interest-bearing debt Other liabilities Net assets 39,397 47,428 49,200 46,893 48,520 39,397 47,428 49,200 46,893 48,520 (Millions of yen) (Millions of yen)

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© 2024 TAZMO Co.,Ltd. 12 Net Sales and Operating Profit by Segment FY2026 Initial H1 Estimate vs. Initial H1 Estimate (%) FY2026 Full Year Estimate vs. Full Year Estimate (%) 12,870 82.9 29,700 35.9 900 24.5 3,400 6.5 - - 18,500 32.9 - - 8,860 39.0 - - 2,340 48.5 600 94.0 1,300 43.4 30 - 70 - 2,100 69.2 4,500 32.3 △40 - 130 - - - - - 15,570 81.5 35,500 35.7 890 13.8 3,600 3.4 (Millions of yen) Q2 FY2025 Actual Q2 FY2026 Actual YoY(%) Process equipment business Net sales 12,193 10,668 △12.5 Operating income 1,920 220 △88.5 ◼ Semiconductor equipment Net sales 7,088 6,080 △14.2 ◼ Transfer equipment Net sales 3,911 3,452 △11.7 ◼ Cleaning equipment Net sales 1,194 1,135 △4.9 Precision molding dies and plastic moldings business Net sales 606 563 △7.0 Operating income 56 △2 - Surface treatment equipment business Net sales 3,987 1,452 △63.6 Operating income 517 △89 - Elimination of inter- segment transactions Operating income 24 △5 - Total Net sales 16,787 12,684 △24.4 Operating income 2,517 123 △95.1

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© 2024 TAZMO Co.,Ltd. 13 Trend in Net sales by Segment (Quarterly ) (Millions of yen) 2,741 2,526 1,223 2,698 578 1,673 3,499 3,794 3,042 4,899 3,876 2,961 2,517 4,570 6,407 4,564 2,593 3,487 1,812 1,667 1,628 2,028 1,825 2,138 2,176 1,795 1,721 1,921 2,218 2,455 1,783 2,127 1,781 1,965 1,423 2,029 287 942 392 1,242 476 1,164 963 2,349 608 1,681 1,465 1,877 502 691 149 412 720 414 404 411 261 322 357 412 367 319 150 155 188 284 293 312 308 282 278 285 789 1,302 566 1,104 627 1,179 1,592 867 381 1,675 749 3,546 2,419 1,568 1,679 1,088 951 501 6,036 6,848 4,072 7,397 3,864 6,569 8,599 9,127 5,905 10,334 8,499 11,125 7,516 9,270 10,326 8,314 5,967 6,717 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 2022 2023 2024 2025 2026 Starting from the fiscal year ending December 2026, the business previously recorded under the “Coater” segment has been reclassified and reported in combination with the “Semiconductor Equipment” segment. Accordingly, past performance figures have also been restated under the same segment classification. For sales trends under the previous classification, please refer to the supplementary materials.

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© 2024 TAZMO Co.,Ltd. 14 Trend in Net sales by Segment (Full year) (Millions of yen) 4,744 6,465 7,122 4,964 6,593 8,269 9,190 9,547 14,781 18,060 6,080 3,429 4,358 4,692 5,729 5,320 5,526 7,136 7,936 8,318 7,657 3,452 1,702 1,558 2,400 1,905 2,760 3,730 2,864 4,954 5,634 1,756 1,1351,451 1,712 1,731 1,437 1,352 1,572 1,400 1,456 779 1198 563 3,074 3,089 4,185 3,489 2,900 3,763 4,267 6,352 6,754 1,452 0 5,000 10,000 15,000 20,000 25,000 30,000 35,000 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 2026 Q2 11,329 17,169 19,036 18,223 19,516 22,001 24,356 28,161 Starting from the fiscal year ending December 2026, the business previously recorded under the “Coater” segment has been reclassified and reported in combination with the “Semiconductor Equipment” segment. Accordingly, past performance figures have also been restated under the same segment classification. For sales trends under the previous classification, please refer to the supplementary materials. 35,865 35,428 12,684

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© 2024 TAZMO Co.,Ltd. 15 (Millions of yen) 2,992 2,582 2,662 3,722 2,058 1,801 6,456 4,999 430 4,878 2,379 5,720 1,304 1,868 5,482 2,773 11,710 18,428 2,102 2,991 2,088 1,861 1,757 1,269 1,305 1,948 1,700 1,847 2,193 1,937 2,004 1,921 1,067 1,755 2,544 3,051 1006 1,066 625 820 364 280 434 1463 301 183 648 573 282 542 193 485 385 551 431 402 240 304 308 374 321 281 150 142 190 309 336 322 257 282 264 360 1,188 1,840 4915 1,506 734 317 2,180 1,157 410 1175 598 1,253 502 580 1,250 622 1,153 7,723 8,884 10,533 8,215 5,225 4,044 10,699 9,851 2,995 8,226 6,010 9,796 4,430 5,336 8,252 5,919 16,058 31,711 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 2022 2023 2024 2025 2026 Starting from the fiscal year ending December 2026, the business previously recorded under the “Coater” segment has been reclassified and reported in combination with the “Semiconductor Equipment” segment. Accordingly, past performance figures have also been restated under the same segment classification. For sales trends under the previous classification, please refer to the supplementary materials. Trend in Sales Orders by Segment (Quarterly ) 2022 2023 2024 2025 2026

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© 2024 TAZMO Co.,Ltd. 16 Trend in Sales Orders by Segment (Full year) (Millions of yen) 7,028 6,838 5,708 5,625 8,617 12,326 11,961 15,317 13,409 11,532 30,139 3,539 4,677 5,206 5,342 5,805 7,373 9,043 6,281 7,679 6,749 5,596 1,370 2,944 2,858 2,959 2,528 8,636 3,519 2,543 1,708 1,503 937 1,517 1,719 1,732 1,430 1,344 1,725 1,378 1,286 793 1198 624 1,775 4,662 3,805 2,991 4,246 9,450 4,390 3,438 2,955 10,472 13,456 17,955 20,168 19,164 21,288 34,309 35,355 29,820 27,028 23,937 47,770 0 10,000 20,000 30,000 40,000 50,000 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 2026 Q2 Starting from the fiscal year ending December 2026, the business previously recorded under the “Coater” segment has been reclassified and reported in combination with the “Semiconductor Equipment” segment. Accordingly, past performance figures have also been restated under the same segment classification. For sales trends under the previous classification, please refer to the supplementary materials.

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17 © 2024 TAZMO Co.,Ltd. Trend in Order Backlog by Segment (Quarterly ) (Millions of yen) 12,450 12,508 13,947 14,971 16,452 16,579 19,537 20,742 18,129 18,108 16,610 19,370 18,159 15,557 14,633 12,841 21,960 36,901 4,401 5,725 6,185 6,018 5,951 5,082 4,211 4,364 4,343 4,268 4,243 3,725 3,946 3,740 3,026 2,816 3,938 4,960 8,708 8,833 9,066 8,644 8,532 7,649 7,119 6,234 5,927 4,429 3,612 2,308 2,087 1,938 1,982 2,054 1,719 1,856 375 366 345 326 277 239 194 156 156 142 144 170 212 221 170 170 156 230 3,075 3,613 7,962 8,364 8,471 7,608 8,196 8,487 8,516 8,017 7,866 5,573 3,656 2,668 2,240 1,774 1,976 10,794 29,012 31,047 37,507 38,325 39,685 37,160 39,260 39,984 37,073 34,966 32,477 31,148 28,062 24,127 22,053 19,658 29,750 54,743 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 2022 2023 2024 2025 2026 Starting from the fiscal year ending December 2026, the business previously recorded under the “Coater” segment has been reclassified and reported in combination with the “Semiconductor Equipment” segment. Accordingly, past performance figures have also been restated under the same segment classification. For sales trends under the previous classification, please refer to the supplementary materials.

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© 2024 TAZMO Co.,Ltd. 19 Business Environment ◼ For WLP equipment for advanced packaging, order intake declined quarter on quarter following the large orders received in Q1, while orders for coaters and developers expanded. Future orders will depend largely on market conditions, but we remain optimistic. For equipment for power semiconductors, inquiries are gradually increasing. ◼ In transfer equipment, inquiries have risen sharply and order intake has increased. Despite challenges such as longer lead times for materials and responding to individual customer requirements, we are strengthening our domestic and overseas supply chains. ◼ For PLP equipment for advanced packaging, inquiries are increasing for the coating, debonding and cleaning processes we have long worked on. The inquiries vary in scale, and we are working to secure them reliably while expecting further market expansion. ◼ Inquiries for slurry supply equipment are increasing, and we expect further orders going forward. For wafer cleaning equipment, new projects remain limited and we expect recovery to take time. ◼ In surface treatment equipment, orders expanded for both wet processing equipment centered on plating and substrate transfer equipment. Given the very strong conditions in this market, we remain optimistic going forward. ◼ Inquiries for slurry supply equipment are increasing, and we expect further orders going forward. For wafer cleaning equipment, new projects remain limited and we expect recovery to take time. ◼ In surface treatment equipment, orders expanded for both wet processing equipment centered on plating and substrate transfer equipment. Given the very strong conditions in this market, we remain optimistic going forward.

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© 2024 TAZMO Co.,Ltd. 21 Group employees Consolidated, as of June 30, 2026 ★ Founded Established in 1972 Number of sites 11 in Japan + 12 overseas Affiliated subsidiaries Japan and overseas total Company Profile and Business Overview TAZMO is a global manufacturer that has kept pace with customers and changing times for half a century. Nearly 80% of net sales come from semiconductor-related business (Process Equipment). Net sales FY ended Dec. 2025 Operating profit FY ended Dec. 2025 Operating margin FY ended Dec. 2025 ROE FY ended Dec. 2025¥ % Net sales by segment FY ended Dec. 2025 Process Equipment net sales breakdown FY ended Dec. 2025 Net sales by region FY ended Dec. 2025 Overseas ratio 52% Process Equipment 78% Molds & Resin 3% Surface Treatment 19% Semiconductor equipment 51% Transfer equipment 22% Cleaning equipment 5% Japan 48% Taiwan 36% China 5% Others 11% [Company profile as of June 30, 2026] [Full-year results, fiscal year ended December 2025] 1,224 54th year 23 sites 14 companies 35.42 billion yen 4.76 billion yen 13.5% 14.0%

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© 2024 TAZMO Co.,Ltd. 22 Business Evolution and Trend in Equipment Shipments (1) Founding to the 1990s Entered the semiconductor production equipment business Accumulated wet process and transfer technologies (2) 2000s FPD equipment became a core business Peaked in the mid-2000s (3) 2010s to present From FPD to power semiconductors and advanced packaging, the core business has shifted FPD equipment shipments peaked Equipment for power semiconductors drove the business recovery Bonding/debonding equipment for advanced packaging became a core business Semiconductor equipment (mainly coaters/developers) Semiconductor equipment (mainly bonding/debonding equipment)FPD equipment Founded in the 1980s in semiconductor production equipment. From the late 1990s through the 2000s, FPD equipment accounted for the bulk of shipments. The company then shifted to a semiconductor equipment- centered strategy, and has since expanded into the power semiconductor and advanced packaging markets. ■Trend in average shipments per period by main product group 1980-84 1985-89 1990-94 1995-99 2000-04 2005-09 2010-14 2015-19 2020-24 2025-26 *Shipments for 2025-26 include forecast figures for the fiscal year ending December 2026.

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© 2024 TAZMO Co.,Ltd. 23 AI-driven expansion of the logic semiconductor market has significantly grown sales of TAZMO's advanced packaging equipment. TAZMO equipment is used in logic semiconductor manufacturing, where technical requirements keep rising. 1,548 1,766 1,786 2,158 2,995 4,114 2021 2022 2023 2024 2025 2026 (est.) Logic semiconductors Power semiconductors (discretes) Source: WSTS (2021-2025 actual; 2026 is the 2026 spring forecast, June 2026). *Discretes is a category centered on power semiconductors. *Unit: US$100 million Growing along with the expansion of the logic semiconductor market ■Market size comparison: logic vs. power semiconductors ■TAZMO advanced packaging equipment: net sales trend 2021 2022 2023 2024 2025 Market size approx. 2.7x 2021 → 2026 (est.) Net sales approx. 8x 2021 → 2025

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© 2024 TAZMO Co.,Ltd. 24 Trend in Net sales by Conventional Segment (Quarter) 383 1,212 857 2,150 1,150 1,559 1,144 2,143 489 1,242 2,611 2,429 1,516 4,743 3,704 2,356 2,246 4,446 6,239 4,280 1,382 1,390 1,188 1,565 1,812 1,667 1,628 2,028 1,825 2,138 2,176 1,795 1,721 1,921 2,218 2,455 1,783 2,127 1,781 1,965 938 344 768 1,678 287 942 392 1,242 476 1,164 963 2,349 608 1,681 1,465 1,877 502 691 149 412 864 900 677 1,223 1,591 967 79 555 89 431 888 1,365 1,526 156 172 605 271 124 168 284 369 393 391 417 404 411 261 322 357 412 367 319 150 155 188 284 293 312 308 282 626 935 249 1,089 789 1,302 566 1,104 627 1,179 1,592 867 381 1,675 749 3,546 2,419 1,568 1,679 1,088 0 2,000 4,000 6,000 8,000 10,000 12,000 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Surface treatment equipment business Precision molding dies and plastic moldings business Coater Cleaning equipment Transfer equipment Semiconductor equipment 4,564 5,178 4,133 6,848 6,036 8,125 3,864 7,397 4,072 9,127 8,599 6,569 2021 2022 2023 2024 (Millions of yen) 5,905 10,334 8,499 11,125 2025 7,516 9,270 10,326 8,314

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© 2024 TAZMO Co.,Ltd. 25 Trend in Sales Orders by Conventional Segment (Quarter) 1,922 2,044 2,080 2,374 2,424 2,488 2,421 3,603 2,058 1,490 5,557 4,771 419 4,627 2,343 5,548 1,254 1,821 5,244 2,647 1,533 1,622 1,818 2,400 2,102 2,991 2,088 1,861 1,757 1,269 1,305 1,948 1,700 1,847 2,193 1,937 2,004 1,921 1,067 1,755 768 1,164 887 5,815 1,006 1,066 625 820 364 280 434 1,463 301 183 648 573 282 542 193 485 667 530 976 1,729 568 94 241 119 0 311 899 228 251 36 172 50 147 238 126 432 484 409 398 431 402 240 304 308 374 321 281 150 142 190 309 336 322 257 282 1,062 1,164 736 1,283 1,188 1,840 4,915 1,506 734 317 2,180 1,157 410 1,175 598 1,253 502 580 1,250 622 0 2,000 4,000 6,000 8,000 10,000 12,000 14,000 16,000 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Semiconductor equipment Transfer equipment Cleaning equipment Coater Precision molding dies and plastic moldings business Surface treatment equipment business 6,908 14,002 6,387 7,011 7,723 8,884 10,533 8,215 5,225 4,044 10,699 9,851 (Millions of yen) 2,995 8,226 6,010 9,796 4,430 5,336 2021 2022 2023 2024 2025 8,252 5,919

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26 © 2024 TAZMO Co.,Ltd. Trend in Order Backlog by Conventional Segment 3,089 3,921 5,144 5,369 6,642 7,572 8,849 10,310 11,879 12,127 15,073 17,415 16,317 16,201 14,840 18,033 17,042 14,417 13,423 11,789 2,415 2,647 3,277 4,111 4,401 5,725 6,185 6,018 5,951 5,082 4,211 4,364 4,343 4,268 4,243 3,725 3,946 3,740 3,026 2,816 2,914 3,734 3,853 7,989 8,708 8,833 9,066 8,644 8,532 7,649 7,119 6,234 5,927 4,429 3,612 2,308 2,087 1,938 1,982 2,054 6,397 6,027 6,325 6,831 5,808 4,936 5,098 4,661 4,573 4,452 4,464 3,327 1,812 1,907 1,770 1,337 1,117 1,140 1,210 1,052 257 348 366 347 375 366 345 326 277 239 194 156 156 142 144 170 212 221 170 170 1,765 1,994 2,481 2,676 3,075 3,613 7,962 8,364 8,471 7,608 8,196 8,487 8,516 8,017 7,866 5,573 3,656 2,668 2,240 1,774 0 5,000 10,000 15,000 20,000 25,000 30,000 35,000 40,000 45,000 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Surface treatment equipment business Precision molding dies and plastic moldings business Coater Cleaning equipment Transfer equipment Semiconductor equipment 2021 2022 2023 2024 16,840 18,674 21,449 27,326 29,012 31,047 37,507 38,325 39,685 37,160 39,260 39,984 2025 (Millions of yen) 37,073 34,966 32,477 31,148 28,062 24,127 22,053 19,658

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27 © 2024 TAZMO Co.,Ltd. Company name TAZMO Co., Ltd. Established February 26, 1972 Head office 5311, Haga, Kita -ku, Okayama -shi, Okayama 701 -1221, Japan Capital 3,556,890,682 yen Total number of issued shares 14,842,354 Number of shareholders 6,279 Number of employees Non-consolidated 481 Consolidated 1,224 Business content Development, Manufacturing and Sales of Semiconductor Manufacturing Equipment, Clean Transfer System, UV Laser Equipment, Plating Equipment, Mold ・Resin Molding, Plating/Circuit formation Equipment for PCB Company Info ▍Domestic locations, Subsidiaries Shinjuku-ku,Tokyo Tokyo office Ibara-shi, Okayama TAZMO Plant No.1 TAZMO Plant No.3 TAZMO Plant No.5 Quark Technology Co., Ltd. PRETEC Co., Ltd. ▍Global Network Vietnam TAZMO VIETNAM CO.,LTD. FACILITY HANOI CO.,LTD. Hong Kong Facility (HK) Co., Ltd. Shaoxing City, Zhejiang Province, China TAZMO Semitec Shaoxing Technology Co., Ltd. Doungguan City,Guangdong Province, China Facility Technology (Dongguan) Co., Ltd. Taiwan TAZMO Apprecia Formosa Inc. San Francisco TAZMO INC. Okayama-shi, Okayama Head office (as of June 30, 2026)

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28 © 2024 TAZMO Co.,Ltd. Milestones - Began production of molding dies, including injection molding dies. - Completed development of Fully-automated Photo Resist Coater; production and sales started. - TAZMO Co., Ltd. is incorporated to manufacture and produce electronic components and repair industrial equipment. - Developed TFT Full-color filter manufacturing system; production and sales started. - Constructed new head office/plant at 6186 Kinoko-Cho, Ibara, Okayama - Developed and produced Ultra Compact Transfer System for Super Clean Room. - Began production and sales of Emboss Carrier Tape. - Began production of injection Molding Products. - Developed “CS13” series Photo Resist Coater specialized for a thicker film application; production and sales started. - Listed on the JASDAQ market. - Established TAZMO VIETNAM CO., LTD. a consolidated subsidiary, in Ho Chi Minh City, Vietnam. - Developed 10th generation compatible full-color filter manufacturing system; production and sales started. - Concluded a license agreement with 3M(USA) for semiconductor manufacturing equipment. - Apprecia Technology Inc. became our wholly owned subsidiary company. - VIETNAM CO., LTD. Constructed new factory at Long Hau Industrial Park in Long An Province, Vietnam. - Facility Co., Ltd. and Quark Technology Co., Ltd. became our wholly owned subsidiary company. - Listed on the First Section of the Tokyo Stock Exchange - Constructed a new head office at 5311 Haga Kita-ku, Okayama- shi, Okayama - Merged with Apprecia Technology Inc. - TAZMOʼs listing transferred to Prime Market in Tokyo Stock Exchange. - Increased capital to 3,495,400,000 yen through public offering. - Established TAZMO SEMITEC SHAOXING TECHNOLOGY Co., Ltd. a consolidated subsidiary, in Zhejiang Shaoxing, China. 2022 2020 2019 2018 2017 2013 20091972 1980 1989 1990 1994 1995 2001 2004 2008

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29 © 2024 TAZMO Co.,Ltd. Business Introduction Semiconductor Manufacturing Equipment Business Unit ⚫ For Advanced Packaging(WLP *1／PLP *2) ⚫ For Power Semiconductors *1 WLP:Wafer-Level Packaging *2 PLP :Panel-Level Packaging Bonder / Debonder We develop, design, manufacture, and sell temporary bonding and debonding systems that enable wafer thinning, an essential process for the production of high-performance chips.By bonding wafers to glass carrier substrates, our systems allow wafer thinning while preventing damage to the wafers. Coater / Developer Leveraging the expertise gained through the development and manufacturing of FPD production equipment, we enable uniform chemical coating and precise circuit formation by selectively removing only the exposed areas during the development process. Transfer Business Unit ⚫ For Semiconductor Equipment Manufacturers (Wafers, Masks, and Related Components) Cleaner Business Unit We develop, design, manufacture, and sell single-wafer cleaning systems for wafer manufacturers, as well as slurry supply systems and equipment that recovers and reuses phosphoric acid from waste liquids. Surface Treatment Business We provide precision molds and resin molded products for connector manufacturers. Molding Business We provide plating systems for printed circuit boards used in semiconductor packages and electronic control systems for automobiles and other applications.

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Forward-looking statements with respect to TAZMO’s business plan, prospects and other such information are based on information available at the time of publication. Actual performance and results may differ significantly from the business plan described here due to changes in various external and internal factors. This material takes as its objective the provision of information regarding the management policy, plans, and financial situation of TAZMO to shareholders, investors and other visitors. It constitutes neither an offer nor a solicitation to purchase or sell TAZMO stock. keiki@tazmo.co.jp Notes Finance Department, Investor Relations Section TAZMO CO., LTD. Contact

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