6723 CMD 2025 Presentation

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 6 MODEL Non-GAAP *1: $1 = 100yen, €1 = 120yen, continuing business-basis and not including NREs 2019 2020 2021 2022 2023 2024 Model*1 Adjusted*1 Revenue (oku yen) 6,204 6,357 8,894 12,282 11,648 10,100 Grow @SAM+ Gross margin 43% 48% 54% 56% 57% 55% 55% Operating margin 12% 19% 29% 35% 32% 27% 30%  25 – 30%

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 9 UX  Renesas 365  Software products  Professional services  System-oriented marketing and roadmap  Winning Combo solutions  “Whole products”  Improved documentation (how-to notes, app notes, user manuals etc.)  Mass-market developers’ platforms  Enriched ecosystem UX Software & Digitalization Embedded Processing

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 11 BACK TO BASICS Efficiency Productivity Purposefulness  Centralization  Process  Standardization  Upstream design  Modular architecture  scale, reuse, upgrade  Constant update  Embedded compute  Digitalization  Vertical that moves the needle

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 12 ILLUSTRATIVE PURPOSEFUL INVESTMENTS High Performance Computing Embedded Processing Analog & Connectivity Power Software & Digitalization Technology People Renesas 365 | Altium.X RISC-V | Software Localization Whole productScalability | Core technologies GaN | Module Well-being NPU | AI & Methodology NPU: Neural Processing Unit

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© 2025 Renesas Electronics Corporation. All rights reserved. (FORWARD-LOOKING STATEMENTS) The statements in this presentation with respect to the plans, strategies and forecasts of Renesas Electronics and its consolidated subsidiaries (collectively “we”) are forward-looking statements involving risks and uncertainties. Such forward looking statements do not represent any guarantee by management of future performance. In many cases, but not all, we use such words as “aim,” “anticipate,” “believe,” “continue,” “endeavor,” “estimate,” “expect,” “initiative,” “intend,” “may,” “plan,” “potential,” “probability,” “project,” “risk,” “seek,” “should,” “strive,” “target,” “will” and similar expressions to identify forward looking statements. You can also identify forward-looking statements by discussions of strategy, plans or intentions. These statements discuss future expectations, identify strategies, contain projections of our results ofoperations or financial condition, or state other forward-looking information based on our current expectations, assumptions, estimates and projections about our business and industry, our future business strategies and the environment in which we will operate in the future. Known and unknown risks, uncertainties and other factors could cause our actual results, performance or achievements to differ materially from those contained or implied in any forward-looking statement, including, but not limited to: general economic conditions in our markets, which are primarilyJapan, North America, Asia and Europe; demand for, and competitive pricing pressure on, our products and services in the marketplace; our ability to continue to win acceptance of its products and services in these highly competitive markets; and movements in currency exchange rates,particularly the rate between the yen and the U.S. dollar. Among other factors, a worsening of the world economy, a worsening of financial conditions in the world markets, and a deterioration in the domestic and overseas stock markets, would cause actual results to differ from the projected results forecast. This presentation is based on the economic, regulatory, market and other conditions as in effect on the date hereof. It should be understood that subsequent developments may affect the information contained in this presentation, which neither we nor our advisors or representatives are under an obligation to update, revise or affirm.

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 1 JUNE 26, 2025 ARAM MIRKAZEMI SVP AND GM OF SOFTWARE & DIGITALIZATION RENESAS ELECTRONICS CORPORATION DIGITAL TO DIFFERENTIATE SILICON

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 3Page 3 DIGITAL UNLOCKING THE VALUE OF SILICON Strategic synergies Organizational synergies Customer network synergies Revenue synergies Our business strategy is based on “Digital differentiating silicon” (Digital includes all technologies related to Software, Silicon IP, Digitalization, UX, etc) We are seeing an exciting path ahead as we combine Altium’s leading software tools, cloud platform and electronic parts search capabilities with Renesas’ portfolio of advanced embedded solutions

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 4Page 4 DIGITALIZATION TO STREAMLINE INDUSTRY VALUE CHAINS Multi-Physics simulation Electronic CAD System engineering Embedded development tools providers Middleware & Embedded stack OS-Ware Linux / RTOS Back-End manufacturing IP core vendors EDA vendors Front-End manufacturing Semiconductor vendors Mechanical CAD Product lifecycle management Software.X Embedded software solution Silicon.X Semiconductor design & manufacturing Develop.X Electronic design & development Lifecycle.X Electronics lifecycle management Enterprise resource planning Discover.X Electronics parts distribution Brokers & Surplus dealers Search & Aggregators ` Electronics simulation Software defined products

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 5 .X STRATEGY – THE PATH TO DIGITALIZATION DIGITALIZATION Transformation of the Electronic Industry through the digitalization and cloud-enablement of key industry processes involved in the DISCOVERY, DEVELOPMENT, and LIFECYCLE management of electronics HARDWARE and SOFTWARE systems required for the creation of Software Defined Products. Other semi vendor RL78, RA, RX, RH850, RZ e2 studio, CS+ Software products

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 6Page 6 RENESAS 365 – THE PLATFORM FOR DIGITALIZATION  Based on the .X strategy and powered by Altium, Renesas 365 is the first-generation embodiment of Renesas’ digitalization vision, bringing together silicon and software on a collaborative cloud platform to streamline the development of software- defined products  Renesas 365 will deliver Application-Ready Silicon, Context-Rich Discovery, Multidisciplinary Development, Electronic System Lifecycle Management, and Intelligent Embedded Software Web application Embedded World booth Mini website

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 7 Synergy #3 - Leverage Renesas 365 to drive business success User adoption Business success Existing users of e2 studio & CS+ Early adopters Mainstream adopters Low hanging fruit targets Mass market Competitive business wins RENESAS 365 TO DRIVE REVENUE SYNERGIES 20302025 2026 2027 2028 2029 Synergy #2 - Investment in China, India and other emerging markets Synergy #1 - Leveraging Renesas brand to drive Altium enterprise business Launch & Early adoption Leading with strength to secure early business wins Early success in software defined products Expanding success to other industry segments Launch the automotive addition of Renesas 365 Virtual tier one platform for the electronics industry $1.0B – $1.5B Digital revenue Mid-to-long term

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 9Page 9 ALTIUM INDUSTRY LEADING PRODUCTS  Largest professional userbase  Most popular design tool  Over 100,000 active seats  Over 65,000 commercial subscribers  The first cloud platform for the electronics industry  Over 63,000 monthly active users  Over 18,000 monthly active accounts Leading Design Software for printed circuit boards Leading Cloud Platform for electronic design development Leading Search and Discovery website for electronics parts  The most popular search platform for electronics parts  Over 95 million components with active listings  Over 4 million searches each month  Over 41 million annual visits Develop Discover Lifecycle

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 10Page 10 DIVERSITY OF APPLICATIONS AND HIGH-PROFILE CUSTOMERS Altium is the differentiated category leader of PCB design and empowers innovation for a diverse array of leading customers Automotive Aerospace & Defence Life sciences Mobile devices Consumer electronics Electronics & High-tech Research & Education Industrial controls Computers Semiconductors

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 11Page 11 ALTIUM COMPETITIVE POSITIONING Develop Discover Lifecycle 2020’s Acquisition Unrivalled in the Mainstream Coopetition with the low-end tools (mostly free/open source) Competes against high-end tools with Agile Enterprise positioning IUT de Grenoble in France KiCAD EAGLE / Autodesk Fusion Expedition Siemens Allegro X Cadence CR-8000 Zuken

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 12 ALTIUM PERFORMANCE UPDATE 2022 Q3 2022 Q4 2023 Q1 2023 Q2 2023 Q3 2023 Q4 2024 Q1 2024 Q2 2024 Q3 2024 Q4 2025 Q1 Enterprise cohort view growth Enterprise customers continue to scale 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2022 2023 2024 2025  We continue to see strong growth in our enterprise segment  The continued adoption of enterprise platform portends our belief in scaling up- market with Altium Lifecycle solution for our high-end customer base  Annual Recurring Revenue (ARR) increased double-digits year-over-year while aligning and evolving towards .X strategy  Altium's standalone run-rate margin significantly increased, driven by realized cost synergies resulting from the acquisition

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 13 SUMMARY Bringing ‘software-first’ execution to Renesas .X strategy plays an integral role of transformation of the electronic industry resulting in a new platform for the creation of software-defined products Regaining Renesas MCU #1 position through digitalization

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 2 PROGRESS TO DATE Non-GAAP *1: FX $1 = 100yen, €1 = 120yen. Excluding 6” fab shutdown & structural reform-related EOLs. Excluding NREs 2019 2020 2021 2022 2023 2024 Mid-term model*1 (2024 Capital Market Day)Adjusted*1 Revenue (oku yen) 6,204 6,357 8,894 12,282 11,648 10,100 Grow @SAM+ Gross margin 43% 48% 54% 56% 57% 55% 55% Operating margin 12% 19% 29% 35% 32% 27% 30%

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 3 55% ≈16% 30% 55% Mid-term model (2024 Capital Market Day) Gross margin R&D (% of revenue) SG&A (% of revenue) Operating margin Revenue ≈8% SAM+ Non-GAAP *1: Research & development expenses. *2: Selling, general and administrative expenses. *3: FX $1 = 100yen, €1 = 120yen. Excluding 6” fab shutdown & structural reform-related EOLs. Excluding NREs *1 MID-TERM MODEL REVIEW 2024 result (Adjusted*3) *2 19% 27% 9% 10,100 (oku yen) Inventory management Fab-lite Expanded R&D IT integration delay

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 4 MID-TERM MODEL UPDATE Gross margin Operating margin Revenue 55% 30% Previous*1 (2024 Capital Market Day) Grow @SAM+ *1: FX $1 = 100yen, €1 = 120yen. Excluding 6” fab shutdown & structural reform-related EOLs. Excluding NREs. *2: including Altium 55% 25 - 30% Latest*1,2 (2025 Capital Market Day) Grow @SAM+ Rationale Purposeful and disciplined investment Operational excellence

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 5 LONG-TERM TARGETED PORTFOLIO High Performance Computing Embedded Processing Analog & Connectivity Power 28nm MCU and R-Car Regain market share by Renesas 365 Vertical and attach Digital power and MOSFET / GaN Software & Digitalization IoT Infra Industrial xEV ADAS Info Control By Application By Product By Application By Product Previous (2024 Capital Market Day) Strategic focus Latest (2025 Capital Market Day) Synergistic revenue Bolt-on

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 6 MID-TERM CAPITAL ALLOCATION POLICY Capex Deleverage Dividend Operating cash flow 5% of revenue Net <1x in mid-term Phased increase to 30+% of FCF Strategic investment (incl. buyback)Divestiture Recurring Opportunistic

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 7 Push out leverage target (Net < 1.0x) in mid-term Day 1 synergy complete, focus on scaling to maximize the benefit ALTIUM SYNERGIES Day 1 Mid- term Cost synergy Revenue synergy Platform Deleverage Value Time Today Long- term

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 8 MID-TERM MODEL HOUSE KEEPING Revenue growth SAM+ Gross margin 55% R&D % 20 - 22% SG&A % 8 - 9% Operating margin 25 - 30% EBITDA margin 35 - 40% Tax rate 15 - 20% Capital expenditures 5% Inventory 120 days FCF margin 20 - 30% Net leverage <1.0x in mid-term

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 9 6x BREAK DOWN a b-1 b-2 Execution of mid-term plan Valuation gap-fill Multiple expansion  Portfolio management  Capital allocation 3x 2x Valuation Scale a b-1 b-2  Back to basics  Focus on fundamentals  Digitalization 2022 Market cap 2023 2024

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© 2025 Renesas Electronics Corporation. All rights reserved. JUNE 26, 2025 DAVIN LEE SVP AND GM OF ANALOG & CONNECTIVITY AND EMBEDDED PROCESSING RENESAS ELECTRONICS CORPORATION EMBEDDED PROCESSING ANALOG & CONNECTIVITY

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 2 RX RL78 RZ Others RA Control Infotainment Industrial ADAS Infrastructure IoT Our products / technologies 2024 Revenue 32bit Arm Cortex-M based MCU for intelligent IoT 32bit high-performance, high-efficiency MCU 16bit low power consumption MCU 64bit MPU for HMI, e-AI, real-time control & industrial networking xEV AT A GLANCE EMBEDDED PROCESSING

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 3 Industrial / Mass market Scalable embedded platform Enablement & ecosystem with digitalization / Renesas 365 Core technologies to enable growing market, such as robotics IoT Edge and endpoint intelligence GROWTH DRIVERS EMBEDDED PROCESSING Growth drivers Revenue IoT Infrastructure Industrial xEV ADAS Infortainment Control 2024 Mid-to-long term

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 4 Enablement & Ecosystem Scalable embedded processing Core technology innovation EMBEDDED PROCESSING STRATEGY Motor control HMI Security & Safety AI / ML Rich product enablement & ecosystem Multi-layer developer stack UX: Easy find, buy & develop Unified digital experience

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 5 SCALABLE EMBEDDED PROCESSING PLATFORM Crossover MCU MPU Streamlined Software, Development Tools and Solutions for easy migration Common IPs & Compute Cores used across MCU and MPU families FSP Linux FSP: Flexible Software Package Compute performance

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 6 MCU SHARE GROWTH MCU share for Industrial & IoT No.5 2-Phase approach to increasing market share 2024 8.2% 2023 9.7% Focus on high-growth regions and markets  China and India  Motor control in appliance and industrial automation Focus on Renesas 365, Powered by Altium  Access to mass market customers  Enablement & ecosystem with digitalization Growing MCU share Phase 1 Phase 2 Graphs created by Renesas based on Gartner Research. Calculations performed by Renesas Source: Gartner®, Market Share: Semiconductors by End Market, Worldwide, 2024, Rajeev Rajput et al., 2 April 2025, MCU for Industrial & IoT = Total Microcontroller excluded Automotive application GARTNER is a registered trademark and service mark of Gartner, Inc. and/or its affiliates in the U.S. and internationally and is used herein with permission. All rights reserved. Gartner does not endorse any vendor, product or service depicted in its research publications, and does not advise technology users to select only those vendors with the highest ratings or other designation. Gartner research publications consist of the opinions of Gartner’s research organization and should notbe construed as statements of fact. Gartner disclaims all warranties, expressed or implied, with respect to this research, including any warranties of merchantability orfitness for a particular purpose.

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 7 *1: Renesas internal analysis + external market data Current presence Growth vectors Growth strategy Developer ecosystem University program Localization Robotics (Industrial, Enterprise, Cooperative robots) Green energy applications Industrial automation Security / Access control systems Complete SW stacks to enable robust solutions Washer RefrigeratorAir conditioner Leading market share at segment leaders*1 Smart power meter Electronic voting machine AADHAR NID Two and three wheelers Enhance local presence PHASE 1: ACCELERATING GROWTH IN CHINA & INDIA

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 8 Explore, Test & Learn Deploy on real hardware VIRTUAL OR PHYSICAL LEVERAGING CORE TECHNOLOGIES – MOTOR CONTROL Smart downloader MCU selection assistance QE for Motor - Next Renesas advanced motor control platform (FSP based) Simulation engine Renesas Motor Workbench - NextSmart documentation browser Design & Configure QE: Quick and Effective tool solution

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 9 Leading developer platform powering edge AI in industrial IoT & automotive applications Auto machine learning model development Explainable AI + hardware analytics Ultra-low power inferences Seamless developer experience Bridging together AI and embedded domains RENESAS REALITY AI PLATFORM HIGHLY EFFICIENT AI FOR ANY EDGE APPLICATION Reality AI Tools®

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 10Page 10 REALITY AI - DIVERSE MARKET SUCCESS  Ultra-low power for extended battery life (Solar powered wearable)  High precision behavior monitoring across entire herds  BOM reduction (sensor components optimization)  Smart climate control, automatically fine tunes indoor conditions for comfort  Remarkable energy efficiency and reduced carbon footprint  Extended system life through optimized operation  Prevent costly equipment failure before they occur  Reduce maintenance costs through precise fault detection in cost-effective hardware  Improve equipment reliability & uptime Pump health monitoring Adaptive energy efficient HVAC systems Remote livestock management & virtual fencing

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 11 Smart documentation PHASE 2: ENABLEMENT WITH DIGITALIZATION Embedded processing core technologies Embedded processing core technology building blocks Unified Renesas 365 platform experience Developer tools & SDKs App examples & Reference designsSpecialized IP Certified software & middlewareBoards & Kits 3rd party ecosystem Project configuration Virtual evaluation Core technology exploration Product selection assistance Virtual to real hardware Elevated experience Motor control Human machine interface Artificial intelligence Cybersecurity Functional safety Industrial networking

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 12 2024 Revenue Scalable portfolio for global megatrends Core technologies Sensors Custom mixed-signal Timing & Standard products Connectivity (BLE, Wi-Fi, NFC...) Compute & ConnectSense, Control, Actuate Remember Memory interface Rad hard AT A GLANCE ANALOG & CONNECTIVITY Consumer Cloud & Data center Industrial Infrastructure Custom mixed-signal Rad hard Standard products Sensor Memory interface Timing products Connectivity Automotive Infrastructure IoT IndustrialAutomotive

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 13 Revenue Infrastructure Market leadership and content expansion in DDR5, MRDIMM, and Precision Timing Industrial End-to-end solutions with ultra-low power Connectivity and advanced Analog Solutions Automotive Commanding the scalable portfolio for next- gen vehicles with Sensors + AFE ASSPs GROWTH DRIVERS ANALOG & CONNECTIVITY 2024 Note: MRDIMM (Multiplexed Rank DIMM): Highest performance and lowest latency main memory to accelerate data center workloads IoT Infrastructure Industrial xEV ADAS Infotainment Control Mid-to-long term Growth drivers

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 14 VERTICAL STRATEGY INCREASING HIGH VALUE ANALOG CONTENT IN CLOUD AND DATACENTER SERVER MARKET GROWTH DC/DC LDO Femto Network switch Switch SoC Dig mul phase Smart power Femto BufferBuffer GreenPAK Analog mux Accelerator Controller/GPU PCIe buffer GreenPAK Analog mux Versa BufferOsc DC/DC LDODig mul phase Smart power DC/DC LDO Motherboard CPU Dig mul phase Smart power PCIe buffer PCIe buffer GreenPAK Analog mux PCIe buffer PCIe buffer Storage Controller PCIe bufferVersa DC/DC LDO DDR DDR DDRDDR Memory interface: DDR5 data buffer, PMIC, Temp sensor Timing: FemtoClock, VersaClock, PCIe, Buffers, Osc Programmable analog: GreenPAK, Analog mux Renesas products *1 System: Ultra-high throughput of 102.4 Tbps for next-gen data center and AI networking GPAK: GreenPAK Programmable Logic. CLOUD & DATA CENTER SERVERS Up to 1K parts / system*1

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 15 VERTICAL STRATEGY - MEMORY INTERFACE MARKET GROWTH AND DDR5 TRANSITION AS AN OPPORTUNITY 0 500 1,000 1,500 2,000 2,500 2025 2028 2030 *1: Source: Renesas estimates based on Industry reports and Partner information *2: FX $1 = 100yen, €1 = 120yen TS: Temperature Sensor SPD: Serial Presence Detect RCD: Register Clock Driver DB: Data Buffer Market growth*1 (oku yen)*2 CAGR 11%  Complete DDR5 chipset with PMIC, TS, SPD Hub, RCD, DB  DDR5 adoption to reach 90% in 2025  Gen3 ramp begins 2H 2025  Multi-gen support sustains ASPs  AI server growth drives DDR5 demand for higher bandwidth  Technical leadership in Gen4 and Gen5  MRDIMMs to boost chipset content  Adoption accelerates in 2025  Positioned to lead with 6400 MT/s  Leader in Gen1 and Gen2 MRDIMMs  DDR6 expected by 2031; DDR5 MRDIMMs bridge the gap

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 16 Tech Leadership SLAM: Simultaneous Localization And Mapping HMI: Human Machine Interface e-SKIN: Electronic Skin IPS: Inductive Position Sensing HOD/Impedance Sensing: Hands On Detection Sense & motion control @ Edge DC/DC LDO Wired connectivity IF (backplane) RS485 CAN LVDS Ethernet Memory NOR flash Protection Wireless connectivityIF LP Wi-Fi BLE Timing MPU RZ/V2H AnalogPAK Communication module @ Core SLAM Lidar MPU HMI/E-SKIN Impedance sensing Strain gauge 10x Position sensor MCU Motion control Gripper CTRL MPU  Inductive,  Impedance  Strain gauge  Lidar Cross sell  Programmable analog  VersaClock 3S, 6E  RS485  EEPROM, NOR FLASH.  BLE SoC  Low power Wi-Fi  MCU, MPU  Power Core technologies: Innovative, Low power + PowerMCU / MPU Connect & Compute Control, Actuate / Memory Sensor Comms. modules 1-2 Gripper control 2-4 Motor control units 28-40+ SLAM modules 1-2 Robotics Cognitive robot (Humanoid AGI)ICOT GO CONFIGURE ZEPHYR FSP HORIZONTAL STRATEGY SCALABLE PORTFOLIO AS BEDROCK OF EDGE-CENTRIC PLATFORMS SW & Tools A&C content Up to 64 parts / Robot

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 17 SUMMARY High performance analog, sensors & connectivity products ideally suited to address market demands as edge expands Continued infrastructure investments leading to DDR5 / MCR & timing growth along with content increases Grow MCU share in 2-Phase approach  Focus on growth regions and markets  Renesas 365 & core technologies keys to mass market Total solution set built on our high-value analog strengths and leading MCU portfolio

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 2 AT A GLANCE HIGH PERFORMANCE COMPUTING Our products / technologies 2024 Revenue MCU SoC Custom ASIC High performance, ultra-low power consumption 32bit automotive MCU High performance custom ASIC & ASSP Control Infotainment xEV ADAS IIoT High performance, high efficiency SoC for automotive

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 3 Growth driver ADAS ADAS/AD with AI integration R-Car Gen4/5 Control Strong MCU/SoC portfolio for E/E architecture xEV Motor control MCU with Power and Analog solution GROWTH DRIVERS HIGH PERFORMANCE COMPUTING Revenue Growth drivers *1: Gateway is included in “Control” IIoT Infortainment xEV Control ADAS 2024 Mid-to-long term *1

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 4 PROCESSOR SHARE AND DESIGN IN MCU share for automotive No.2 2021 2024 Design-in MCU RH850 (40nm) MCU RH850 (≦28nm) 2021 2024 2024 23.7% 2023 22.4% CAGR 2% CAGR 69% 2021 2024 CAGR 60% Note : Bar heights are scaled independently in each chart Major design-in R-Car V4H outside of Japan R-Car X5H / AI for Honda Major design-in RH850 U2A / B for Zone & xEV SoC R-Car (Gen4/5) Graphs created by Renesas based on Gartner Research. Calculations performed by Renesas Source: Gartner®, Market Share: Semiconductors by End Market, Worldwide, 2024, Rajeev Rajput et al., 2 April 2025, MCU share for Automotive= Total Microcontroller for Automotive Electronics. GARTNER is a registered trademark and service mark of Gartner, Inc. and/or its affiliates in the U.S. and internationally and is used herein with permission. All rights reserved. Gartner does not endorse any vendor, product or service depicted in its research publications, and does not advise technology users to select only those vendors with the highest ratings or other designation. Gartner research publications consist of the opinions of Gartner’s research organization and should not be construed as statements of fact. Gartner disclaims all warranties, expressed or implied, with respect to this research, including any warranties of merchantability orfitness for a particular purpose.

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 5 MARKET OUTLOOK (AUTOMOTIVE) AUTO SEMICONDUCTOR MARKET GROWTH IS DRIVEN BY CONTENT PER VEHICLE Global light vehicle production*1 0 50 100 150 2024 2030 0 500 1,000 2024 2030 0 20 40 60 80 100 120 140 2024 2030 *1: Source: GlobalData Global Light Vehicle Forecast (May 2025) *2: Source: TechInsights Automotive Semiconductor Demand Forecast (2Q25) *3: Source: TechInsights Automotive Semiconductor Demand Forecast (2Q25) (M Unit) 1.1x 1.6x Content per vehicle*2 ($/Unit) Automotive semiconductor TAM*3 1.8x ($B)

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 6 AUTOMOTIVE COMPUTE STRATEGY FULL PORTFOLIO FROM MCU TO SOC WITH SCALABLE, FLEXIBLE AND CUSTOMIZABLE PLATFORM Scale with common SW Higher-reuse to improve time-to-market Comprehensive engineering-vetted solutions Competitor A Competitor B Competitor C Electrified, Automated & ConnectedOEM: Scale across entire vehicle fleet Digital + Analog attach Increasing semiconductor content per vehicle Increasing volume Luxury Premium Mid-range Entry

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 7 RENESAS PLATFORM APPROACH SCALABLE, FLEXIBLE AND CUSTOMIZABLE PLATFORM TO SUPPORT OEM DIFFERENTIATION & REUSABILITY Flexible and scalable Heterogenous and programmable architecture Optimized for automotive processing Compute platform supporting E/E architecture evolution Customizable platform Modular hardware combined with software assets reuse Solution-on-Chip ASSP Standard product Market specific Customer Specific Limited market ASIC No / Limited flexibility Highly integrated Power efficiencySafetyReal-time Scale performance Customize via chiplet Optimized for automotive Open Access R-Car CPU + GPU + Memory + Vision + NPU ADAS Control Cockpit Standard product + flexible solution by chiplets Multi-applications Multi-markets

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 8 RENESAS GROWTH IN E/E ARCHITECTURE MARKET REVENUE GROWTH IS EXPECTED TO OUTPERFORM THE MARKET *1: Source: Renesas Estimation based on TechInsights (2Q25) (GW+Zonal) Revenue growthSAM growth*1 2024 2032 2024 2032 CAGR 38% CAGR 25%

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 9 ZONAL ARCHITECTURE TREND IN VEHICLE CONTROL OUR FLEXIBLE AND SCALABLE INTEGRATED SOLUTIONS SUPPORT THE NEEDSOF GLOBAL OEMS VCU: Vehicle Control Unit (incl. DCU) PT: Powertrain (xEV) CS: Chassis and Safety BD: Body (BCM) ADC: ADAS Domain Controller CDC: Cockpit Domain Controller Domain Hybrid (Domain + Zone) Zone ADC CDC PT CS BD Central GW Central ECU Zone ECUPT CS BD ADC CDC Central compute PT CSADC CDC Zone BD Central compute ADC CDC Zone ECU BD VCU PT CS Central compute ADC CDC Zone BD Zone PT Zone CS VC integrated type VC centralized type OR Development cost minimization System BOM cost minimization

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 10 RENESAS GROWTH IN EV MARKET REVENUE GROWTH IS EXPECTED TO OUTPERFORM THE MARKET *1: Source: Renesas Estimation based on TechInsights (2Q25) Revenue growthSAM growth*1 2024 2032 2024 2032 CAGR 11% CAGR 7%

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 11 xEV MARKET TREND FOR INTEGRATION EXPANDING MCU PORTFOLIO COVERS FROM STAND-ALONE OBC UP TO FULL INTEGRATION OF X-IN-1 xEV system will be integrated into X-in-1 type in the future, but integration level will depend on OEM TomorrowToday BMS SoC MCU DCDC INV MCU MCU OBC BMS MCU MCU DCDC INV MCU MCUOBC Reduction gear BMS MCU MCU DCDC INV MCU MCUOBC BMS DCDC INV OBC MCU Separated High system costs & complicated supplier management Brain centralized Consolidate brain into SoC and assign MCUs to only control each system MCU integrated Integrate control function into one MCU to reduce size and BOM cost MCU dedicated Keep dedicated MCU structure because of system complexity, asset reusability & maintainability BCM BMS: Battery Management System OBC: On-Board Charger INV: Inverter

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 12 HIGH PERFORMANCE COMPUTING MCU PRODUCT STRATEGY BROAD AND SCALABLE MCUS TO ADDRESS ALL OEM AND TIER 1 APPLICATIONS  Broad market-leading MCU portfolio for all applications  Scale across all architectures with common software  Investments focused on strengths and emerging trends Broad & scalable MCU platform  Robust and common development tools and software  Broad and validated 3rd party partner solutions  Easy to use GUI development environment Easy & efficient development

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 13 TARGET MARKETS OF AUTO 32-BIT MCU PROVIDE A RICH LINE-UP OF AUTOMOTIVE MCUS FOR THE VARIOUS NEEDS OF OUR CUSTOMERS 32-bit MCU RH850 / Uxx RH850 / X1x RH850 / U2x  Address market required standard CPU demand  Standard spec and wide scalability line-up including SoC R-Car Gen5  Address our classical legacy MCU customer  High real-time performance with application specific IPs & SW legacy R-Car U series for general purpose Renesas core Arm® core Renesas plans investments in RISC-V Core, Sub-system, ISA for future

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 14 General purpose (128k-8MB) ASIL-B Mid range (2-16MB) ASIL-D High-end (6-32MB) ASIL-D R-Car U5x high-end R-Car / x5x (Vehicle computer / High-end DCU) RH850 / U2B-E RH850 / U2B 3 6R-Car U5x mid-range RH850 / U2A RH850 / U2C R-Car U5x low-end Zone / DCUxEV ADAS (excl. radar) Control & general purposeControl Crossover MCU (MPU) RH850 Uxx HPC 32-BIT AUTO MCU MARKET COVERAGE MCU PORTFOLIO WELL COVERS ENTIRE AUTO MARKET REQUIREMENTS

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 15 RENESAS GROWTH IN ADAS MARKET REVENUE GROWTH IS EXPECTED TO OUTPERFORM THE MARKET *1: Source: Renesas Estimation based on TechInsights (2Q25) *2: Including X5H Revenue growth 2024 2032 SAM growth*1 2024 2032 CAGR 25% CAGR 8%

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 16 R-CAR SOC PRODUCT STRATEGY MODULAR HARDWARE AND SYSTEMS TO MEET OEM PROCESSING NEEDS  High-performance compute SoCs with chiplet extension  Scale across entire vehicle fleet with common software  Early (shift left) & parallel HW & SW dev. (digital twin) Scalable compute platform  Software-Defined Vehicle (SDV) development platform  Open-source and pre-integrated ecosystem solutions  Cloud-native, optimized embedded dev. environment R-Car Open Access (RoX)

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 17 5TH GENERATION OF R-CAR AUTOMOTIVE SOC DESIGNED TO ADDRESS THE SHIFT TO CENTRALIZED ARCHITECTURE Leading-edge technology 3nm technology process for best-in-class power efficiency Modular hardware approach Cost effective heterogenous architecture with chiplet extension Mix-criticality up to ASIL-D E/E architecture transition to SDV and centralized architecture Available today First silicon derivative sampling to early adopters Cockpit ADAS Multi-domain integration Fusion Monolithic SoCs In-car user experience Drive autonomy Multi Die Package (MDP) NPU upgrade GPU upgrade Chiplet High-end sensor fusion Multi panoramic displays, GenAI R-Car R-Car R-Car

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 18 R-CAR FOR ADAS/AD MULTI-GENERATION HISTORY WITH DRIVING ASSISTANCE SYSTEMS Safety and regulation Advanced driving assist Advanced automated driving Japan and global footprint Gen3 on the road today for ADAS systems (and for cockpit) New products ramping Gen4 focused on ADAS ramping in 2H 2025 Core AI technology Gen5 optimized for advanced automated driving Building partner ecosystem Market-ready software and AI stacks From dozen to 2,000 TOPS CNN Transformer / GenAI LLM and VLM Gen3 Gen4 Gen5 LLM: Large Language Model VLM: Vision-Language Model

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 19 SDV architecture For centralized and multi-domain compute solution ADAS Cockpit Gateway System validation Test complex central ECU system integration and KPIs Emulators, HILS, SILS, Performance modelling Open, flexible platform Built on open-source, pre-integrated ecosystem solutions Tooling infrastructure Integrated tools platform with end-to-end AI toolchain R-CAR FOR SOFTWARE-DEFINED VEHICLE ACCELERATE TIME TO MARKET AND MAXIMIZE REUSE OF DEVELOPMENT ASSETS RTOS Commercial stacks AI workbench Large scale testing Simulators AI compiler CloudCentral compute & integration Software first approach Software oriented architecture Cloud-native environment Control Fast boot HILS: Hardware In the Loop Simulation SILS: Software in the Loop Simulation

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 20 Shift left, SW first development  HW and SW simulators, emulator and models  Chiplets & advanced packaging Our focus: Strengthening our capability and infrastructure for the SoCs of the future Invest in differentiating IP  New cores subsystem development and SW  Seamless AI tool chain Boost execution efficiency  Renesas integrated development environment  Intelligent automation through AI-powered flows SOC JOURNEY BEYOND GEN5: FOUNDATIONAL INVESTMENTS

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 21 Our approach under review for China market  Localize manufacturing to align with China’s supply chain  Ensure compliance with China-specific standards and regulations Accelerate “China production”  Collaborate closely with OEMs/Tier1s via joint labs, on-site teams, and early development engagement  Partner with local solution providers for fast, high-quality customer development Strengthen local partnerships  MCU footprint increasing by successful launch of 28nm products (Growing revenue YoY)  MCU market penetration in high growth segments (Zone, xEV, ADAS) 2021 2022 2023 2024 2025 28nm RH850 revenue for China CHINA STRATEGY

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 22 SUMMARY Strengthening engagement in China through local production and partnerships Open development platform accelerating time-to-market with flexibility and reusability Scalable MCUs with Renesas and Arm cores for legacy and standard CPU markets Comprehensive and scalable portfolio covering ADAS, Zonal, and xEV architectures R-Car Gen5 designed to support the shift toward centralized vehicle architectures Investing in stronger infrastructure, capability and foundations in preparation for next generation products

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 2Page 2 AT A GLANCE POWER Power management integrated circuit (PMIC) Battery management system (BMS) MOSFET Markets we serve Our products and technologies Automotive power Computing power 2023 and 1Q 2025 Revenue mix Automotive Infrastructure & AI computing Industrial IoT Macrotrends driving growth AI and Cloud infrastructure Smart connected edge GaNGaN PMIC Computing power Battery management GaN MOSFET Automotive power Other / Legacy Discrete portion 1Q 2025 2023 1Q 2025 2023 Automotive Industrial IoT Infrastructure & AI computing AI

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 3Page 3 GROWTH DRIVERS POWER Revenue 2023 2024 2027 IoT Infrastructure & AI computing Industrial Auto … … IC Discrete Growth driver Growth drivers CAGR 2023 - 2025 CAGR 2024 – Mid-to- long term Automotive GaN and MOSFET Battery management system Automotive power PMIC (attach to MCU/SoC) -5 ~ -10% 5 ~ 10% Industrial GaN and MOSFET PMIC (attach to MCU/SoC) Battery management system -20 ~ -15% 5 ~ 10% Infrastructure & AI computing Computing power GaN and MOSFET Battery management system 35 ~ 45% 25 ~ 35% IoT PMIC Battery management system 0 ~ 5% 5 ~ 10% Mid-to-long term

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 4Page 4 POWER STRATEGY AND SEGMENT FOCUS Infrastructure / AI & Computing Automotive Industrial and Energy Digital attach approach Focus areas Strategy Targeted approach AI infrastructure Other server & cloud AI on the edge  Full BOM focus with more products per systems  Solution and attach play: leverage Renesas digital footprint (MCU, MPU, SoC)  Leveraging Renesas 365 for platform attach & system integration  Target the fastest growing segment of our SAM with tailored solutions with more application specific products  Center of application expertise - dedicated engineering and segment specific teams  Deep engagement with strategic and lead customers. Develop scalable and repeatable richer solutions for end-equipment Accelerated growth Embedded system solution

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 5Page 5 GAN MARKET EXPANSION THROUGH FULL ECOSYSTEM SOLUTIONS 2024 2027 2032 HV GaN LV GaN >$3B SAM 2032 GaN SAM rapid growth*1 CAGR *1: Source: Yole, Renesas analysis. HV GaN: >600V LV GaN 40 ~ 200V xEV Infrastructure & Computing Industrial IoT 2024 2032 HV/LV GaN revenue >60% >30% Growth drivers Strong GaN foundation and expanding  Leading 650V d-mode, high power technology  Vertically integrated – own Epi and process  Expanding with 40-200V LV GaN e-mode  Optimized packaging, superior thermals System solution for best customer experience  GaN-optimized IC controllers & drivers  New topologies - GaN BiDirectional switch  Solutions with SiPs, power stages and reference design across all power ranges Scaling to 8-inch manufacturing  High quality 6-inch manufacturing today  8-inch ramp - licensing and supply agreement with US partner (2027)  LV GaN with external foundry and internal IP

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 6Page 6 AI DRIVING RAPID GROWTH IN A DIVERSIFIED INFRASTRUCTURE POWER BUSINESS 54% 45% Infrastructure power SAM*1 0.0 3.0 6.0 2023 2025 2027 2032 ■ AI ■ Non-AI CAGR *1: Source: Renesas analysis Infrastructure power revenue 2023 2025 2027 2032 AI Non-AI >10% >80% ($B) CAGR 3 ~ 5% 30 ~ 40% Growth drivers Richer solutions: Expanded product offerings in complementary areas that increase our content per system Non-AI infrastructure: A large and diversified business where we are gaining share in core power and growing with healthy margins AI infrastructure: Rapid growth in core power content, system unit volumes, and shift to higher-ASP products

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 7Page 7 OUTPACING INDUSTRY GROWTH WITHIN NON-AI INFRASTRUCTURE Non-AI infrastructure revenue*1 *1: Source: TrendForce, Renesas analysis Note: The Non-AI infrastructure market includes servers, data networking, and telecom equipment that do not adopt modules. Robust growth in a large, diverse customer base in non-AI infrastructure due to:  Core Technology: digital controllers, Power Stages, MOSFETs, ICs  Proprietary software and tools that accelerate customer design cycles  Supplier consolidation  Expanding product portfolio Gaining share with all major Hyperscalers  ~20% YoY revenue growth (2023~2025)  Designed into all next-gen systems at top Hyperscalers  Winning in x64, Arm, and networking platforms Succeeding in enterprise, networking and Telecom clients  ~10% YoY revenue growth (2023~2025)  Ramping in next-gen systems at all top server OEMs, capturing major market share and expanding in networking and telecom2023 2025 2027 2032 Top US hyperscalers Enterprise

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 8Page 8 CAPITALIZING ON AI MOMENTUM WITH MODULE AND SYSTEM POWER TOTAL SOLUTIONS Investing and ramping AI-tailored products for GPU, TPU, and custom AI SoCs  Core power remains solid backbone powering AI revenue growth: Digital controllers, Power Stages, MOSFETs, ICs  Building on existing relationships with leading GPU provider and Hyperscalers  Adding high density modules and vertical power solutions  Winning and co-developing with key AI cloud players and Hyperscalers Driving rapid market adoption through an innovative 48V solution  The first and the only proven onboard, cost-effective 48V solution, winning at majority of Hyperscalers and 3x 2023 to 2025 Expanding product portfolio to provide one-stop system solution  Total solutionsin development covering Point of Load and e-Fuse  Leveraging GaN / Ecosystem and BMS for complete system coverage*1: Source: TrendForce, Renesas estimate 2023 2024 2025 2027 2032 Dual smart power stage >1.5 x ASP Standard smart power stage 2009-present 1x ASP Integrated power stage > 3x ASP Quad-Phase power tower > 8x ASP 1.0 1.2 1.2~2x 3.0+Relative density High density module AI infrastructure revenue*1

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 9Page 9 POWER PORTFOLIO ADDRESSING GROWING OPPORTUNITY IN AI Point of load , e-Fuse MOSFETs, Controllers & Drivers 4th gen digital multiphase (DMP) controllers 3rd gen smart power stages (SPS) Proprietary test tools Vertical power high density modules DDR5 PMIC 48V HSC IBC Performance optimization software Renesas existing products & content Renesas new products & opportunity Switches $500 ~ $700 $10k-$12k Power content per 130kW+ rack Switch SoC PHY PHY… Switch 20~30KW 130+KW Server power consumption has surged from 20–30kW to 130kW+ due to GPU demand, leading to high-voltage bus and side car rack for AC/DC conversion to trend up to 1MW Digital controller + SPS as software- enabled system 16s BMS solution IBC $800 ~ $1000 Baseboard $6,000 ~ $7,200 DDR5 200G NIC GPU GPU … GPU GPU … AI Server IBC power distribution unit … AC/DC AC/DC AC/DC AC/DC BBU BBU … … … … … … PSU $900 ~ $1100 BBU: $1800 ~ $2000 GaN FETs PHY: Ethernet Physical Layer

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 10Page 10 POWERING RENESAS AUTOMOTIVE EMBEDDED SYSTEMS WITH AN OPTIMIZED & SCALABLE AUTOMOTIVE PMIC PORTFOLIO  Leverage large and expanding SoC/MCU footprint. Co-development for seamless system integration  Functional safety included at start simplifies customer design process  Established reference designs and proven reliability reduces risk and time-to-market  First winning combination released Dec 2024, shipping 1Mu+ in 2025  500+ projects with 8+ OEMs & 100+ Tier-1s  Numerous applications: ADAS central compute, Cockpit, BMS, Zone controller, Domain controller, Inverter, xEV X-in-1 (Inverter/BMS/OBC/DCDC) Proven market traction Attach rate and revenue growthRenesas embedded systems advantages SoC/MCU design PMIC design System & Safety CAGR >40% 2025 20322023 2025 SoC/MCU attach rate Revenue growth 1 MCU (RH850) + 1 PMIC (RAA271084) >1.7x Continue driving attach rate to power future growth

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© 2025 Renesas Electronics Corporation. All rights reserved. Page 11 SUMMARY Hyper-focus on solution selling into Renesas existing footprint of digital, analog, connectivity and power products Accelerated growth fueled by the momentum in AI - infrastructure GaN driving high voltage, high power business. Capitalize on Infrastructure & Automotive content expansion Comprehensive power portfolio and strong IP serves as a solid foundation for scalable and rapid growth Targeted high-growth verticals and digital attach strategy to drive diversification and sustainable, broad-based growth GET POWERED BY RENESAS

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