6871 Q4 2025 Earnings Presentation

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© 2026 MICRONICS JAPANCO., LTD. 1 Disclaimer The contents of this presentation were compiled based on information readily available at the time of this presentation. Outlooks and other forward-looking statements are subject to change based on many uncertain worldwide factors including but not limited to market conditions, competition as well as semiconductor / LCD industry trends. Accordingly, please take note that the actual performance of the Company may vary considerably from the information and statements made in this presentation. This English document is translated using a machine translation. You may use this for reference purposes only, fully understanding that it may include inaccurate translations. It is your sole responsibility if you rely not on the Japanese original but on this translation.

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© 2026 MICRONICS JAPANCO., LTD. 2 1. Overviewof FiscalYearResultsEndedon December31, 2025 YukiKatayama Director & Senior Executive Officer, Deputy General Manager Administration Division. 2. Business Conditions MasayoshiHasegawa PresidentandRepresentativeDirector. 3. Forecasts MasayoshiHasegawa PresidentandRepresentativeDirector. 4. Q&A Session Today’s Agenda

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© 2026 MICRONICS JAPANCO., LTD. FY12/2024 Oct.-Dec. Jul.-Sep. Oct.-Dec. Q4 Q3 Q4 （△）（％）（△）（％） ⓐ ⓑ ⓒ ⓒ-ⓑ ⓒ-ⓐ 16,659 17,291 19,761 +2,469 +14.3% +3,101 +18.6% Probe Card 16,130 16,917 19,407 +2,490 +14.7% +3,276 +20.3% TE ※ 528 374 353 (20) (5.5%) (175) (33.1%) 8,283 7,683 9,719 +2,035 +26.5% +1,435 +17.3% 3,928 3,730 5,241 +1,511 +40.5% +1,313 +33.4% 3,247 3,878 5,827 +1,949 +50.3% +2,580 +79.5% 3,065 2,309 4,978 +2,669 +115.6% +1,913 +62.4% Net Income Attributable to Owner of Parent QoQ YoY Net Sales Gross Profit Operating profit Ordinary profit FY12/2025 4 Consolidated Result Summary ※：Test Equipment (Unit : Mils. of Yen) *Amounts less than one million yen are rounded down

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© 2026 MICRONICS JAPANCO., LTD. FY12/2024 Results Forecast Results （△）（％）（△）（％） ⓐ ⓑ ⓒ ⓒ-ⓑ ⓒ-ⓐ 55,643 68,900 70,173 +1,273 +1.8% +14,530 +26.1% Probe Card 53,526 67,100 68,525 +1,425 +2.1% +14,999 +28.0% TE ※ 2,116 1,800 1,648 (151) (8.4%) (468) (22.1%) 27,143 ━ 33,804 ━ ━ +6,661 +24.5% 12,572 13,800 16,542 +2,742 +19.9% +3,970 +31.6% 12,250 13,300 17,100 +3,800 +28.6% +4,850 +39.6% 8,811 9,200 12,063 +2,863 +31.1% +3,252 +36.9% 70 72 95 +23 ━ +25 ━ Dividend per Share(yen) Net Sales Gross Profit Operating profit Ordinary Income Net Income Attributable to Owner of Parent FY12/2025 Jan.-Dec. As of Nov.11 YoY 5 Consolidated Result Summary ※：Test Equipment (Unit : Mils. of Yen) *Amounts less than one million yen are rounded down

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© 2026 MICRONICS JAPANCO., LTD. 6 Summary on Results Probe card • Sales of memory probe cards reached a record high, driven by increased production capacity at the new Aomori plant, with strong growth particularly in DRAM applications. • Orders also hit a record high, supported by robust demand for DRAM probe cards. • Sales of non-memory probe cards declined compared to the previous quarter. • Segment profit improved significantly from the previous quarter, reflecting strong sales growth in DRAM probe cards. TE • Net sales decreased from the previous quarter due to the delayed recovery in the market for semiconductor test sockets. • The segment posted a loss.

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© 2026 MICRONICS JAPANCO., LTD. 7 Quarterly Financial Result FY23Q4 FY24Q1 Q2 Q3 Q4 FY25Q1 Q2 Q3 Q4 Net Sales 12,769 11,794 14,376 12,812 16,659 14,124 18,996 17,291 19,761 Operating profit 2,648 2,508 3,255 2,878 3,928 2,857 4,711 3,730 5,241 Operating Margin 20.7% 21.3% 22.6% 22.5% 23.6% 20.2% 24.8% 21.6% 26.5% 0% 5% 10% 15% 20% 25% 30% 0 2,000 4,000 6,000 8,000 10,000 12,000 14,000 16,000 18,000 20,000 (Mils. of Yen)

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© 2026 MICRONICS JAPANCO., LTD. 8 Business Condition by Segment 528 460 460 374 353 (830) (96) (172) (220) (403) (157.1%) (21.0%) (37.4%) (58.9%) (114.2%) (180%) (160%) (140%) (120%) (100%) (80%) (60%) (40%) (20%) 0% 20% ( 2,000) ( 1,500) ( 1,000) ( 500) 0 500 1,000 1,500 2,000 FY24Q4FY25Q1 Q2 Q3 Q4 Net Sales Segment profit Segment Margin 16,130 13,663 18,536 16,917 19,407 5,817 3,676 5,746 4,734 6,686 36.1% 26.9% 31.0% 28.0% 34.5% 0% 10% 20% 30% 40% 50% 60% 0 2,000 4,000 6,000 8,000 10,000 12,000 14,000 16,000 18,000 20,000 FY24Q4FY25Q1 Q2 Q3 Q4 Net Sales Segment profit Segment Margin Probe card TE (Mils. of Yen) (Mils. of Yen)

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© 2026 MICRONICS JAPANCO., LTD. 9 Quarterly Orders, Net Sales & Backlog FY24Q4 FY25Q1 Q2 Q3 Q4 Order Received 465 370 403 347 345 Net Sales 528 460 460 374 353 Order Backlog 316 226 170 143 135 0 250 500 750 1,000 Probe card TE (Mils. of Yen) (Mils. of Yen) FY24Q4 FY25Q1 Q2 Q3 Q4 Order Received 22,165 18,943 10,955 16,140 28,303 Net Sales 16,130 13,663 18,536 16,917 19,407 Order Backlog 28,684 33,965 26,384 25,607 34,502 0 5,000 10,000 15,000 20,000 25,000 30,000 35,000

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© 2026 MICRONICS JAPANCO., LTD. 10 Quarterly Net Sales by Product FY24Q4 FY25Q1 Q2 Q3 Q4 Non-Memory 1,924 1,432 1,437 1,945 1,329 Memory 14,206 12,230 17,098 14,971 18,078 total 16,130 13,663 18,536 16,917 19,407 88% 90% 92% 88% 93% 12% 10% 8% 11% 7% 0 2,000 4,000 6,000 8,000 10,000 12,000 14,000 16,000 18,000 20,000 Probe card TE (Mils. of Yen) (Mils. of Yen) ※1 Custom testers, Semiconductor probers, FPD test equipment, etc. ※2 Test sockets for semiconductors, Probe units for FPDs ※ Including sales of Cantilever type ※1 ※2 FY24Q4 FY25Q1 Q2 Q3 Q4 Testing Equipment 202 161 98 94 77 Testing Device 326 299 361 279 276 total 528 460 460 374 353 62% 65% 78% 75% 78% 38% 35% 21% 25% 22% 0 250 500 750 1,000

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© 2026 MICRONICS JAPANCO., LTD. 11 Quarterly Net Sales by Region Net Sales Percentage of sales ■ US & Europe ■ Other Asia ■ Taiwan ■ South Korea ■ Japan (Mils. of Yen) 16,659 14,124 18,996 17,291 19,761 0 2,000 4,000 6,000 8,000 10,000 12,000 14,000 16,000 18,000 20,000 FY24Q4 FY25Q1 Q2 Q3 Q4 3.4 10.6 4.1 8.1 7.4 56.3 46.1 60.2 46.5 57.4 26.7 33.7 27.1 36.5 27.7 11.8 9.0 6.9 7.8 6.9 1.8 0.6 1.7 1.1 0.6 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% FY24Q4 FY25Q1 Q2 Q3 Q4

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© 2026 MICRONICS JAPANCO., LTD. 12 Consolidated Balance Sheet ■ Cash and Deposits ■ Accounts Receivable ■ Inventories ■ Other Current Assets ■ Property, Plant and Equipment ■ Intangible Assets, Investments and Other Assets ■ Notes and Accounts Payable ■ Long- and Short-term Interest-bearing Debt ■ Other Current Liabilities ■ Other Long-term Liabilities ■ Total Net Assets (Mils. of Yen) (Mils. of Yen) Assets Liabilities & Net Assets 5,894 5,713 6,430 10,065 14,781 29,558 32,483 34,718 36,181 38,744 2,452 1,763 1,727 1,507 1,604 9,490 11,318 11,462 11,905 13,190 8,645 9,331 10,837 11,419 11,400 23,949 20,697 16,458 15,584 19,305 79,990 81,307 81,634 86,663 99,026 0 20,000 40,000 60,000 80,000 100,000 FY24Q4 FY25Q1 Q2 Q3 Q4 49,646 48,021 52,002 57,170 66,052 2,292 2,247 2,264 3,028 3,877 19,175 17,034 12,654 12,308 15,069 1,175 6,875 6,605 6,605 6,530 7,700 7,129 8,107 7,550 7,497 79,990 81,307 81,634 86,663 99,026 0 20,000 40,000 60,000 80,000 100,000 FY24Q4 FY25Q1 Q2 Q3 Q4

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© 2026 MICRONICS JAPANCO., LTD. 13 Investments/Cash Flows FY24Q4 FY25Q1 Q2 Q3 Q4 R&D 1,168 1,564 1,555 1,673 1,825 CAPEX 8,161 4,592 3,203 2,893 4,563 Depreciation 912 914 1,355 1,489 1,735 0 2,000 4,000 6,000 8,000 10,000 Investment,etc. Cash Flows (Mils. of Yen) (Mils. of Yen) ※ Including construction in progress (1,725) (6,017) (8,746) (4,098) (2,830) 4,588 22 4,442 2,192 6,245 2,863 (5,994) (4,303) (1,905) 3,415 (10,000) (8,000) (6,000) (4,000) (2,000) 0 2,000 4,000 6,000 8,000 FY24Q4 FY25Q1 Q2 Q3 Q4 Cash Flow from Operations Cash Flow from Investments Free Cash Flow

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© 2026 MICRONICS JAPANCO., LTD. Semiconductor Market Forecast 0 200 400 600 800 1,000 1,200 1,400 2023 2024 2025 2026 2027 2028 2029 Medium-to Long-term Business Environment Mid- to Long -Term Outlook for the Semiconductor Market • As generative AI expands from the cloud to local and edge environments, devices for edge AI are also expected to grow. • As generative AI evolves into agentic AI, demand for high-performance semiconductors for data centers will further accelerate. • Non-AI memory semiconductors are also expected to maintain solid demand. • Automotive and industrial semiconductors will continue to advance in performance, driving steady growth in testing demand for logic ICs. Our Mid - to Long -Term Outlook for the Probe Card Market • Although demand for memory semiconductors is centered around AI applications, overall memory demand remains strong, leading to significant growth in the probe card market. • In non-memory semiconductors, AI -related demand is driving expansion, resulting in growth in the probe card market for non- memory devices. （B$） 15 （Year） Graphs are based on Gartner research. Source, Gartner®, Forecast: Semiconductors and Electronics,2023-2029, 4Q25 Rajeev Rajput, Ben Lee, et al., 18 December 2025 Semiconductor_TTL=Aggregatable Pivot, Revenue basis. GARTNER is a registered trademark of Gartner Inc. or an affiliate in the United States and/or elsewhere. And is a service mark, used under the company's authorization. All rights reserved. Gartner content ("Gartner content") contained herein represents a research opinion or view issued by Gartner, Inc ("Gartner") as part of Gartner syndicated subscription services. It does not constitute a factual statement. The content of any Gartner content is the content at the time the content was issued, and not the content of the date this document was issued. The views contained in Gartner content are also subject to change without notice.

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© 2026 MICRONICS JAPANCO., LTD. 3,331 0 500 1,000 1,500 2,000 2,500 3,000 3,500 4,000 4,500 2023 2024 2025 2026 2027 2028 2029 Source：Company's own forecast based on research firm data 16 • Our forecast for the probe card market CAGR during the FV26 period is 17%, an increase of 3 points from the previous outlook.We project the market size in 2026 to reach the equivalent of USD 3.3billion, up 14% from 2025. • With continued expansion in the AI-related semiconductor market, the environment supporting growth of the overall probe card market remains intact. • Advances in HBM generations and increased production are expected to further drive demand for DRAM probe cards. Medium-to Long-term Business Environment （M$）（Year） YoY+14％ Probe Card Market Forecast

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© 2026 MICRONICS JAPANCO., LTD. • Driven by continued expansion in demand—particularly for high-performance memory-probe cards for memory applications remain strong. • We are accelerating the expansion of production capacity at the new Aomori plant building to meet robust demand. • We are promoting the development of new technologies compatible with next-generation HBM. • Anticipating a recovery in the automotive and industrial semiconductor markets—centered on MEMS-V and MEMS-SP—we are strengthening efforts to acquire new customers. • We are advancing R&D on vertical probe cards for high-performance logic devices. Memory Probe Card Non-Memory Probe Card TE • We continue to advance strategic initiatives to expand sales of the semiconductor tester Testalio and the wafer prober Excelyze. • We are continuing to strengthen R&D and sales initiatives for test sockets and high-frequency (RF) probes. • To expand product sales, we are enhancing support at our overseas locations. For semiconductor market Overview of Business Probe Card 17

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© 2026 MICRONICS JAPANCO., LTD. 18 Progress of FV26 Prerequisites (after revision): 3-year average exchange rate of $ 1 = 147 yen when the probe card market grew at an average annual growth rate of 20% (over the 23-year base) Category Results for 2024 Results for 2025 Forecast for 2026 H1 Management indicators Final year: 2026 Net sales 55.6 billion yen 70.1 billion yen 43.9 billion yen 80.0 billion yen Operating income 12.6 billion yen 16.5 billion yen 12.3 billion yen 20.0 billion yen Operating margin 23% 24% 28% 25% ROE 19% 21% - 23% Investment plan 2023-2026 (4 years) 2023 Cumulative for 2024 Cumulative for 2025 Cumulative forecast for 2026 Cumulative plan for 2026 Capital expenditure 6.6 billion yen 22.0 billion yen 37.3 billion yen 56.3 billion yen 48.0 billion yen R&D expenses 4.8 billion yen 9.9 billion yen 16.5 billion yen 25.0 billion yen 22.0 billion yen Total amount 11.4 billion yen 31.9 billion yen 53.8 billion yen 81.3 billion yen 70.0 billion yen • Both net sales and operating income are progressing smoothly in the first half toward achieving the management targets for the final year. • We plan to increase capital expenditures to expand production capacity. • We will also increase R&D expenditures to strengthen our competitive advantage in next-generation devices.

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© 2026 MICRONICS JAPANCO., LTD. 0 5 10 15 20 25 Q1 Q2 Q3 Q4 Q1 Q2 2025 2026 Our Forecast for 2026  World economy  Semiconductor market • Uncertainty in the global economy persists due to opaque policy operations, including the United States’ high-tariff policies. • Ongoing geopolitical risks and the potential resurgence of U.S.– China trade and economic friction continue to pose instability factors for the global supply chain. • By steadily capturing demand for memory-related probe cards, we expect first-half FY2026 results to exceed the level of the same period in the previous year. • To accommodate increased production of memory-related probe cards, we plan to bring forward capital investments. • With the full-scale implementation of generative AI, AI-related semiconductors-such as GPUs and HBM for data centers- continue to drive the market. • Strong demand for advanced memory used in AI applications is tightening supply, and as a result, supply constraints are emerging for non-AI memory products. 20 Sales Forecast ■■TE ■■Probe card (Billions of yen)

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© 2026 MICRONICS JAPANCO., LTD. FY12/2025 (△) (%) ⓐ ⓑ ⓑ-ⓐ 33,120 43,900 +10,779 +32.5% Probe Card 32,199 43,200 +11,000 +34.2% TE 921 700 (221) (24.0%) 7,569 12,300 +4,730 +62.5% 7,394 11,800 +4,405 +59.6% 4,774 8,200 +3,425 +71.7% FY12/2026 Jan.-Jun. (Previous year) Jan.-Jun. (New) YoY Net Sales Operating profit Ordinary profit Net Income Attributable to Owner of Parent Financial Forecast 21 (Unit : Mils. of Yen) *Amounts less than one million yen are rounded down • FX rate assumption for FY12/2026: JPY 150.00 to USD, JPY 0.10 to KRW

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© 2026 MICRONICS JAPANCO., LTD. 1,805 2,320 2,676 3,120 4,300 2,400 2,503 2,464 3,499 4,200 4,205 4,823 5,140 6,619 8,500 9.5% 12.6% 9.2% 9.4% 0 1,000 2,000 3,000 4,000 5,000 6,000 7,000 8,000 9,000 10,000 1,342 2,515 3,091 7,795 9,000 2,878 4,106 12,349 7,457 10,000 4,220 6,621 15,440 15,252 19,000 2,131 2,203 2,845 5,494 9,600 0 2,000 4,000 6,000 8,000 10,000 12,000 14,000 16,000 18,000 20,000 22,000 Forecasts for R&D, Capex and Depreciation FY2022 FY2022 FY2026FY2025FY2024 Forecast FY2023FY2022 FY2026FY2025FY2024 Forecast Expansion of production capacity to address mid - to long -term demand growth, and the continued investment in research and development with a view toward ongoing innovation in semiconductor technologies. • Investment in production equipment for the new building at the Aomori Plant. • Next-generation technology development for both non- memory and memory probe cards. • Development of new semiconductor- related products and expansion of applications in the TE business. FY2023 22 Capex & Depreciation R&D ■1H ■2H －Ratio to Net Sales (Mils. of Yen)(Mils. of Yen) ■1H ■2H －Depreciation ※Including construction in progress

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© 2026 MICRONICS JAPANCO., LTD. 23 Regarding the Sales Outlook Starting with this earnings announcement, we will present our outlook for full- year revenue in the next fiscal year based on recent business conditions, rather than providing specific numerical forecasts. 1. Revenue Outlook • The probe card market grew by 12% year-on-year in 2025 compared with 2024.In contrast, the Group’s full-year revenue increased by 26% year-on-year, significantly outperforming overall market growth. • For 2026, we forecast that the probe card market will grow by 14% year -on-year compared with 2025.Against this backdrop, the Group expects its full-year revenue growth to exceed the 26% growth rate achieved over the 2024–2025 period. 2. Outlook for the Mid-Term Management Plan “FV26” In the final fiscal year of the Mid-Term Management Plan FV26, we expect revenue to exceed the management target set under the plan. ※If the actual growth rate of the probe card market falls below the Company’s forecast, the outlook for full-year revenue may be adversely affected.

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© 2026 MICRONICS JAPANCO., LTD. 24 Regarding Order Information Non-Disclosure of Order Information • Disclosure of order intake and order backlog will be discontinued after FY2025, and such information will no longer be disclosed from the next financial results announcement onward. • We have determined that order information is not suitable for conveying the actual business situation or future outlook, due to short-term fluctuations and changes in the business environment.

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© 2026 MICRONICS JAPANCO., LTD. 27 Glossary Wafer: Circular crystalline silicon (Si) or gallium arsenide (GaAs) sliced into a thin disk substrate used for semiconductor electrical circuits. LSI: Large-scale integrated circuit. Called VLSI or ULSI when the transistor’s degree of integration is increased. IC: Integrated circuit. Micro Computer: An IC that integrates memory and a microprocessor for arithmetic processing on one chip. Recently, the word “microcomputer” is often used to refer to those incorporated in home appliances or other products for electronic control. Flip Chip: Flip chips have bump electrodes on the chip surface for the purpose of high-density surface mounting of IC chips on circuit boards. The bumps and wiring board terminals are connected with solder or conductive adhesive. Chip/Die: Dies and chips are small semiconductor devices. A semiconductor wafer is diced into many pieces, and each of these pieces is called a die or chip. DRAM: Dynamic random access memory. A type of volatile memory with a wide range of uses including main storage for computers and general-purpose memory. NAND-Type Flash Memory: A type of non-volatile memory that cannot be deleted even when the external power supply is interrupted. Used for USB memory, digital camera memory cards, mobile music players and mobile phone memory. Created by Toshiba in 1987. Bump: Bumps are solder bumps formed on IC pads. Bumps are normally formed with gold (Au) or solder and are used primarily in flip chips for connection to substrates. System on Chip (SoC) / System LSI: Large-scale IC containing nearly an entire system on one chip. Combines multiple functions previously spread across multiple ICs onto one chip. Realizes small, high-performance machinery. Mainly used in processors and memory, input/output, interface and telecommunications circuitry. Bonding Pad: Supply of power voltage to the chip and signal exchanges with exterior are normally conducted through the lead. The bonding pads are metal electrodes around the chip connecting this lead with each terminal on internal circuitry. IoT: Internet of Things, allowing physical devices to be sensed or controlled remotely across existing internet infrastructure. Memory IC: An integrated circuit made out of millions of capacitors and transistors that can store data such as DRAM, NAND Flash and etc. Logic IC: An integrated circuit that performs logic functions. FPD: Flat panel display. LCD: liquid crystal display.

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© 2026 MICRONICS JAPANCO., LTD. 28 Glossary MEMS: Micro-Electro-Mechanical Systems. MEMS Type Probe Card: MEMS type probe cards are probe cards using MEMS technology. They have a structure that allows the mechanical movement of probe terminals. Cantilever Probe Card: Also called a cantilever needle. A probe card using a one-sided needle probe as a fulcrum. Shaped by hand. Advanced Probe Card: Probe cards other than the cantilever type. Vertical Probe Cards: A vertical probe card is a probe card in which probe needles are vertical to the substrate. Vertical probe cards are suitable for area array, small pad, low voltage, low needle pressure, and high frequency measurement. DUT: Device under test. Area Array: A state which has test pads in a grid array on the surface of a chip. Wafer Test / Probe Test: An electrical test conducted by placing a probe needle on a wafer chip bonding pad. Final Test / Package Test: Electrical testing of assembled ICs. AI(Artificial Intelligence): The simulation of human intelligence processes by machines. It generally needs various type of semiconductors like image sensors. Generative AI: automatically creates diverse content, including images, videos, and text. It learns from extensive pre-analyzed data, enabling the generation of new content. High-performance semiconductors like GPUs or HBMs are crucial for effective generative AI. General-purpose server：A computer or program that performs necessary processing through a network in response to requests from users. AI server: A specialized server designed specifically for training and inference of generative AI. It is equipped with powerful CPUs, GPUs, HBM, and other devices, providing higher computational capabilities, large memory storage, high bandwidth, and low latency. HBM (High Bandwidth Memory) : A type of DRAM known for its wide bandwidth and high-power efficiency. By stacking DRAM chips and connecting them to a processor using multiple buses, it achieves fast and large-capacity data transfer. It is primarily packaged with GPUs/CPU and used in HPCs and AI servers. GPU (Graphics Processing Unit ):A semiconductor chip that handles complex data calculations, including 3D graphics processing. It excels in parallel computing. When combined with HBM, it enables even faster performance, especially for generative AI. Data center :A facility designed to securely store servers and network equipment. When investments in data centers increase, there is often a higher demand for general-purpose servers, which in turn can lead to an increased need for DRAM chips. HPC(High Performance Computing)：A technology that performs complex computational processing on massive data at high speeds. It uses high- performance processors to handle big data efficiently. DFT: Design for testability BIST: Built In Self Test

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© 2026 MICRONICS JAPANCO., LTD. 29 Our Products Probe Cards Main Applications for MJC Probe Card Products Test Equipment MEMS-SP: Probe card used for MEMS probe developed for testing SoC devices and other flip chip-type logic devices. U-Probe: Our core product, realizing the world’s first wafer-scale probing created with MJC’s proprietary MEMS probe “micro- cantilever” and global top-level thin-film multilayer technology. With a bare minimum of contacting times via a crescent arrangement for DRAM, this product is currently the industry standard. Mainly used for memory testing on DRAM and flash memory. SP-Probe: Vertical spring pin-type probe card suitable for 12-inch wafer batch measurements. Mainly used for testing NAND flash memory. MEMS-V / Vertical-Probe: Vertical needle-type probe card used for testing highly integrated, high-speed multi-pin logic devices. Provides flexible support for a variety of pad and fine pitch arrangements and is suitable for multiple individual simultaneous measurements during testing of SoC and other advanced logic devices. Test Socket: In the final inspection of semiconductor manufacturing, a fixture is used to electrically connect the packaged device and tester. There are two types: ‘J-Contacts,’ suitable for high-frequency and high-performance devices, and ‘BeeContacts,’ which have a unique spring probe structure with excellent contact stability. Semiconductor Tester: A system that gives electrical signals to a semiconductor device to compare output signals with expected values. Wafer Prober: A system that handles the wafer to make contact in the designated position on the device. Memory Logic DRAM Flash SoC Vertical MEMS SP-Probe U-Probe MEMS-SPMEMS-V SPーProbeVertical-Probe Probe Unit: Probe card with a built-in LCD prober. This blade-type unit developed by MJC is an industry standard.

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Technical information in this material is provided to explain normal operations and application of our products, not for the purpose of warranty of intellectual property rights and other rights of MJC and a third party or grant of license of the same. © 2026 MICRONICS JAPANCO., LTD.MICRONICS JAPANCO., LTD. MJC YOUR Best Partner, MJC Anytime Anywhere

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