6871 Q2 2026 Earnings Presentation

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© 2026 MICRONICS JAPANCO., LTD. 1 Disclaimer • The contents of this presentation were compiled based on information readily available at the time of this presentation. • Outlooks and other forward-looking statements are subject to change based on many uncertain worldwide factors including but not limited to market conditions, competition as well as semiconductor industry trends. • Accordingly, please take note that the actual performance of the Company may vary considerably from the information and statements made in this presentation. This English document is translated using a machine translation. You may use this for reference purposes only, fully understanding that it may include inaccurate translations. It is your sole responsibility if you rely not on the Japanese original but on this translation.

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© 2026 MICRONICS JAPANCO., LTD. 3 Consolidated Result Summary ※：Test Equipment (Unit : Mils. of Yen) *Amounts less than one million yen are rounded down FY12/2025 Apr.-Jun. Jan.-Mar. Apr.-Jun. Q2 Q1 Q2 （△）（％）（△）（％） ⓐ ⓑ ⓒ ⓒ-ⓑ ⓒ-ⓐ 18,996 20,945 28,261 +7,315 +34.9% +9,264 +48.8% Probe Card 18,536 20,629 27,912 +7,283 +35.3% +9,376 +50.6% TE ※ 460 316 348 +32 +10.1% (112) (24.4%) 8,787 9,898 15,217 +5,319 +53.7% +6,430 +73.2% 4,711 5,647 9,909 +4,261 +75.4% +5,197 +110.3% 4,492 5,991 10,268 +4,277 +71.4% +5,776 +128.6% 3,101 4,392 7,068 +2,675 +60.9% +3,966 +127.9% Net Income Attributable to Owner of Parent Gross Profit Operating profit Ordinary profit QoQ YoY Net Sales FY12/2026

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© 2026 MICRONICS JAPANCO., LTD. 4 Consolidated Result Summary ※：Test Equipment (Unit : Mils. of Yen) *Amounts less than one million yen are rounded down FY12/2025 Previous year Forecast Results （△）（％）（△）（％） ⓐ ⓑ ⓒ ⓒ-ⓑ ⓒ-ⓐ 33,120 45,700 49,206 +3,506 +7.7% +16,086 +48.6% Probe Card 32,199 45,000 48,542 +3,542 +7.9% +16,342 +50.8% TE ※ 921 700 664 (35) (5.1%) (256) (27.9%) 16,401 ━ 25,115 ━ ━ +8,714 +53.1% 7,569 12,900 15,557 +2,657 +20.6% +7,987 +105.5% 7,394 12,700 16,260 +3,560 +28.0% +8,865 +119.9% 4,774 9,200 11,461 +2,261 +24.6% +6,686 +140.0% Net Income Attributable to Owner of Parent Jan.-Jun. As of May.13 YoY Net Sales Gross Profit Operating profit Ordinary profit FY12/2026

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© 2026 MICRONICS JAPANCO., LTD. 5 Summary of Q2 FY2026 Results Probe card • Sales of memory probe cards reached another record high, following the previous quarter, driven by production capacity expansion and shipments brought forward from the prior quarter. • Sales of non-memory probe cards increased slightly quarter over quarter. • Segment profit increased quarter over quarter, supported by contributions from high value-added products for DRAM applications. • Order increased significantly quarter over quarter, with demand for DRAM applications, particularly HBM (High Bandwidth Memory), remaining strong. TE • Revenue increased quarter over quarter, reflecting solid demand for semiconductor test sockets. • The segment recorded a loss. • Customer evaluations are ongoing for Testalio semiconductor testers and Excelyze probe cards to secure new orders.

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© 2026 MICRONICS JAPANCO., LTD. 6 Quarterly Financial Result FY24Q2 Q3 Q4 FY25Q1 Q2 Q3 Q4 FY26Q1 Q2 Net Sales 14,376 12,812 16,659 14,124 18,996 17,291 19,761 20,945 28,261 Operating profit 3,255 2,878 3,928 2,857 4,711 3,730 5,241 5,647 9,909 Operating Margin 22.6% 22.5% 23.6% 20.2% 24.8% 21.6% 26.5% 27.0% 35.1% 0% 5% 10% 15% 20% 25% 30% 35% 40% 0 5,000 10,000 15,000 20,000 25,000 30,000 (Mils. of Yen)

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© 2026 MICRONICS JAPANCO., LTD. 7 Business Condition by Segment 460 374 353 316 348 (172) (220) (403) (310) (475)(37%) (59%) (114%) (98%) (136%) (150%) (100%) (50%) 0% 50% 100% 150% ( 1,000) ( 500) 0 500 1,000 FY25Q2 Q3 Q4 FY26Q1 Q2 Net Sales Segment profit Segment Margin 18,536 16,917 19,407 20,629 27,912 5,746 4,734 6,686 6,817 11,472 31% 28% 34% 33% 41% 0% 10% 20% 30% 40% 50% 60% 0 5,000 10,000 15,000 20,000 25,000 30,000 FY25Q2 Q3 Q4 FY26Q1 Q2 Net Sales Segment profit Segment Margin Probe card TE (Mils. of Yen) (Mils. of Yen)

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© 2026 MICRONICS JAPANCO., LTD. 8 Quarterly Net Sales by Product FY25Q2 Q3 Q4 FY26Q1 Q2 Non-Memory 1,437 1,945 1,329 1,383 1,447 Memory 17,098 14,971 18,078 19,245 26,465 total 18,536 16,917 19,407 20,629 27,912 92% 88% 93% 93% 95% 8% 11% 7% 7% 5% 0 5,000 10,000 15,000 20,000 25,000 30,000 Probe card TE (Mils. of Yen) (Mils. of Yen) ※1 Custom testers, Semiconductor probers, FPD test equipment, etc. ※2 Test sockets for semiconductors, Probe units for FPDs ※ Including sales of Cantilever type ※1 ※2 FY25Q2 Q3 Q4 FY26Q1 FY26Q2 Testing Equipment 98 94 77 52 38 Testing Device 361 279 276 263 309 total 460 374 353 316 348 78% 75% 78% 83% 89% 21% 25% 22% 16% 11% 0 250 500 750 1,000

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© 2026 MICRONICS JAPANCO., LTD. 9 Quarterly Net Sales by Region Net Sales Percentage of sales ■ US & Europe ■ Asia ■ Japan (Mils. of Yen) 784 1,407 1,468 2,377 1,347 17,886 15,691 18,171 18,324 26,265 325 192 121 243 648 18,996 17,291 19,761 20,945 28,261 0 5,000 10,000 15,000 20,000 25,000 30,000 FY25Q2 Q3 Q4 FY26Q1 Q2 4.1 8.1 7.4 11.4 4.8 94.2 90.8 92.0 87.4 92.9 1.7 1.1 0.6 1.2 2.3 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% FY25Q2 Q3 Q4 FY26Q1 Q2

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© 2026 MICRONICS JAPANCO., LTD. 52,002 57,170 66,052 73,986 91,323 2,264 3,028 3,877 6,819 11,085 12,654 12,308 15,069 16,952 20,381 6,605 6,605 6,530 6,422 6,444 8,107 7,550 7,497 9,276 9,566 81,634 86,663 99,026 113,457 138,802 0 20,000 40,000 60,000 80,000 100,000 120,000 140,000 FY25Q2 Q3 Q4 FY26Q1 Q2 6,430 10,065 14,781 26,652 41,239 34,718 36,181 38,744 41,298 43,570 1,727 1,507 1,604 2,341 2,663 11,462 11,905 13,190 14,203 15,457 10,837 11,419 11,400 13,818 15,821 16,458 15,584 19,305 15,143 20,049 81,634 86,663 99,026 113,457 138,802 0 20,000 40,000 60,000 80,000 100,000 120,000 140,000 FY25Q2 Q3 Q4 FY26Q1 Q2 10 ■ Cash and Deposits ■ Accounts Receivable ■ Inventories ■ Other Current Assets ■ Property, Plant and Equipment ■ Intangible Assets, Investments and Other Assets ■ Notes and Accounts Payable ■ Long- and Short-term Interest-bearing Debt ■ Other Current Liabilities ■ Other Long-term Liabilities ■ Total Net Assets Consolidated Balance Sheet Assets Liabilities & Net Assets (Mils. of Yen) (Mils. of Yen)

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© 2026 MICRONICS JAPANCO., LTD. 11 Investments/Cash Flows Investment,etc. Cash Flows (Mils. of Yen) (Mils. of Yen) ※ Including construction in progress FY25Q2 Q3 Q4 FY26Q1 Q2 R&D 1,555 1,673 1,825 1,859 2,047 CAPEX 3,203 2,893 4,563 4,568 4,356 Depreciation 1,355 1,489 1,735 1,624 1,974 0 2,000 4,000 6,000 8,000 10,000 (8,746) (4,098) (2,830) (3,507) (3,997) 4,442 2,192 6,245 3,918 8,246 (4,303) (1,905) 3,415 410 4,249 (10,000) (8,000) (6,000) (4,000) (2,000) 0 2,000 4,000 6,000 8,000 10,000 FY25Q2 Q3 Q4 FY26Q1 Q2 Cash Flow from Operations Cash Flow from Investments Free Cash Flow

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© 2026 MICRONICS JAPANCO., LTD. FY12/2025 As of May.13 (Jan.-Sep.) (△) (%) (△) (%) ⓐ ⓑ 　ⓒ ⓒ-ⓑ ⓒ-ⓐ 50,412 71,600 74,200 +2,600 +3.6% +23,787 +47.2% Probe Card 49,117 70,400 73,000 +2,600 +3.7% +23,882 +48.6% TE 1,295 1,200 1,100 (100) (8.3%) (195) (15.1%) 11,300 21,900 22,400 +500 +2.3% +11,099 +98.2% 11,273 21,400 23,100 +1,700 +7.9% +11,826 +104.9% 7,084 15,200 16,300 +1,100 +7.2% +9,215 +130.1% Net Sales Operating profit Ordinary profit Net Income Attributable to Owner of Parent Jan.-Sep. Jan.-Sep. (New) As of May.13 YoY FY12/2026 Financial Forecast 13 (Unit : Mils. of Yen) *Amounts less than one million yen are rounded down • FX rate assumption for FY12/2026: JPY 156.00 to USD, JPY 0.10 to KRW

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© 2026 MICRONICS JAPANCO., LTD. FY12/2025 Jan.-Dec. (Previous year) (△) (%) ⓐ ⓑ ⓑ-ⓐ 70,173 103,800 +33,626 +47.9% Probe Card 68,525 102,000 +33,474 +48.9% TE 1,648 1,700 +51 +3.1% 16,542 31,400 +14,857 +89.8% 17,100 32,000 +14,899 +87.1% 12,063 23,000 +10,936 +90.7% 95 178 +83 ━ Net Sales Operating profit Ordinary profit Net Income Attributable to Owner of Parent Dividend（Yen） FY12/2026 Jan.-Dec. (New) YoY 14 Financial Forecast • FX rate assumption for FY12/2026: JPY 156.00 to USD, JPY 0.10 to KRW (Unit : Mils. of Yen) *Amounts less than one million yen are rounded down

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© 2026 MICRONICS JAPANCO., LTD. 1,805 2,320 2,676 3,120 3,906 2,400 2,503 2,464 3,499 4,993 4,205 4,823 5,140 6,619 8,900 9% 13% 9% 9% 9% 0.0 % 5.0 % 10. 0% 15. 0% 20. 0% 25. 0% 0 1,000 2,000 3,000 4,000 5,000 6,000 7,000 8,000 9,000 10,000 1,342 2,515 3,091 7,795 8,925 2,878 4,106 12,349 7,457 12,074 4,220 6,621 15,440 15,252 21,000 2,131 2,203 2,845 5,494 9,400 0 5,000 10,000 15,000 20,000 25,000 Forecasts for R&D, Capex and Depreciation FY2022 FY2023FY2022 FY2026FY2025FY2024 Forecast Accelerated production capacity expansion in response to strong memory probe card demand, while anticipating continued growth in the semiconductor market. • Accelerating capital investments in production facilities for the new Aomori plant as much as possible. • Accelerating the development of next- generation probe cards in anticipation of advances in semiconductor technologies. • Promoting customer evaluations of Testalio and Excelyze to secure future orders 15 Capex & Depreciation R&D ■1H ■2H －Ratio to Net Sales (Mils. of Yen)(Mils. of Yen) ■1H ■2H －Depreciation ※Including construction in progress FY2023FY2022 FY2026FY2025FY2024 Forecast

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© 2026 MICRONICS JAPANCO., LTD. Glossary 17 Wafer: Circular crystalline silicon (Si) or gallium arsenide (GaAs) sliced into a thin disk substrate used for semiconductor electrical circuits. LSI: Large-scale integrated circuit. Called VLSI or ULSI when the transistor’s degree of integration is increased. IC: Integrated circuit. Micro Computer: An IC that integrates memory and a microprocessor for arithmetic processing on one chip. Recently, the word “microcomputer” is often used to refer to those incorporated in home appliances or other products for electronic control. Flip Chip: Flip chips have bump electrodes on the chip surface for the purpose of high-density surface mounting of IC chips on circuit boards. The bumps and wiring board terminals are connected with solder or conductive adhesive. Chip/Die: Dies and chips are small semiconductor devices. A semiconductor wafer is diced into many pieces, and each of these pieces is called a die or chip. DRAM: Dynamic random access memory. A type of volatile memory with a wide range of uses including main storage for computers and general-purpose memory. NAND-Type Flash Memory: A type of non-volatile memory that cannot be deleted even when the external power supply is interrupted. Used for USB memory, digital camera memory cards, mobile music players and mobile phone memory. Created by Toshiba in 1987. Bump: Bumps are solder bumps formed on IC pads. Bumps are normally formed with gold (Au) or solder and are used primarily in flip chips for connection to substrates. System on Chip (SoC) / System LSI: Large-scale IC containing nearly an entire system on one chip. Combines multiple functions previously spread across multiple ICs onto one chip. Realizes small, high-performance machinery. Mainly used in processors and memory, input/output, interface and telecommunications circuitry. Bonding Pad: Supply of power voltage to the chip and signal exchanges with exterior are normally conducted through the lead. The bonding pads are metal electrodes around the chip connecting this lead with each terminal on internal circuitry. IoT: Internet of Things, allowing physical devices to be sensed or controlled remotely across existing internet infrastructure. Memory IC: An integrated circuit made out of millions of capacitors and transistors that can store data such as DRAM, NAND Flash and etc. Logic IC: An integrated circuit that performs logic functions. FPD: Flat panel display. LCD: liquid crystal display.

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© 2026 MICRONICS JAPANCO., LTD. Glossary 18 MEMS: Micro-Electro-Mechanical Systems. MEMS Type Probe Card: MEMS type probe cards are probe cards using MEMS technology. They have a structure that allows the mechanical movement of probe terminals. Cantilever Probe Card: Also called a cantilever needle. A probe card using a one-sided needle probe as a fulcrum. Shaped by hand. Advanced Probe Card: Probe cards other than the cantilever type. Vertical Probe Cards: A vertical probe card is a probe card in which probe needles are vertical to the substrate. Vertical probe cards are suitable for area array, small pad, low voltage, low needle pressure, and high frequency measurement. DUT: Device under test. Area Array: A state which has test pads in a grid array on the surface of a chip. Wafer Test / Probe Test: An electrical test conducted by placing a probe needle on a wafer chip bonding pad. Final Test / Package Test: Electrical testing of assembled ICs. AI(Artificial Intelligence): The simulation of human intelligence processes by machines. It generally needs various type of semiconductors like image sensors. Generative AI: automatically creates diverse content, including images, videos, and text. It learns from extensive pre-analyzed data, enabling the generation of new content. High-performance semiconductors like GPUs or HBMs are crucial for effective generative AI. General-purpose server：A computer or program that performs necessary processing through a network in response to requests from users. AI server: A specialized server designed specifically for training and inference of generative AI. It is equipped with powerful CPUs, GPUs, HBM, and other devices, providing higher computational capabilities, large memory storage, high bandwidth, and low latency. HBM (High Bandwidth Memory) : A type of DRAM known for its wide bandwidth and high-power efficiency. By stacking DRAM chips and connecting them to a processor using multiple buses, it achieves fast and large-capacity data transfer. It is primarily packaged with GPUs/CPU and used in HPCs and AI servers. GPU (Graphics Processing Unit ):A semiconductor chip that handles complex data calculations, including 3D graphics processing. It excels in parallel computing. When combined with HBM, it enables even faster performance, especially for generative AI. Data center :A facility designed to securely store servers and network equipment. When investments in data centers increase, there is often a higher demand for general-purpose servers, which in turn can lead to an increased need for DRAM chips. HPC(High Performance Computing)：A technology that performs complex computational processing on massive data at high speeds. It uses high- performance processors to handle big data efficiently. DFT: Design for testability BIST: Built In Self Test

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© 2026 MICRONICS JAPANCO., LTD. Our Products 19 Probe Cards Main Applications for MJC Probe Card Products MEMS-SP: Probe card used for MEMS probe developed for testing SoC devices and other flip chip-type logic devices. U-Probe: Our core product, realizing the world’s first wafer-scale probing created with MJC’s proprietary MEMS probe “micro- cantilever” and global top-level thin-film multilayer technology. With a bare minimum of contacting times via a crescent arrangement for DRAM, this product is currently the industry standard. Mainly used for memory testing on DRAM and flash memory. SP-Probe: Vertical spring pin-type probe card suitable for 12-inch wafer batch measurements. Mainly used for testing NAND flash memory. MEMS-V / Vertical-Probe: Vertical needle-type probe card used for testing highly integrated, high-speed multi-pin logic devices. Provides flexible support for a variety of pad and fine pitch arrangements and is suitable for multiple individual simultaneous measurements during testing of SoC and other advanced logic devices. Memory Logic DRAM Flash SoC Vertical MEMS Type SP-Probe U-Probe MEMS-SPMEMS-V SPーProbeVertical-Probe

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© 2026 MICRONICS JAPANCO., LTD. Our Products 20 Test Equipment Test Socket: In the final inspection of semiconductor manufacturing, a fixture is used to electrically connect the packaged device and tester. There are two types: ‘J-Contacts,’ suitable for high-frequency and high-performance devices, and ‘BeeContacts,’ which have a unique spring probe structure with excellent contact stability. Semiconductor Tester: A system that gives electrical signals to a semiconductor device to compare output signals with expected values. Wafer Prober: A system that handles the wafer to make contact in the designated position on the device. RF Probe: RF Probe for High-frequency Measurement, Such as Radio Frequency and Microwave Signals. Probe Unit: Probe card with a built-in LCD prober. This blade-type unit developed by MJC is an industry standard. Probe UnitSemiconductor Tester Wafer Prober Test Socket RF Probe

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Technical information in this material is provided to explain normal operations and application of our products, not for the purpose of warranty of intellectual property rights and other rights of MJC and a third party or grant of license of the same. © 2026 MICRONICS JAPANCO., LTD.MICRONICS JAPANCO., LTD. MJC YOUR Best Partner, MJC Anytime Anywhere

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