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TOKYO SEIMITSU CO., LTD. Earnings Conference for FY2027/3 1Q 2026/08/04 KIMURA Ryuichi, President and CEO KOIZUMI Kimito, Managing Executive Officer and CFO TAKASHIMA Naoki, IR Team Leader, Management Support Dept. • Cautionary Statement with respect to Forward-Looking Statements ： This presentation data and information verbally provided contai n “forward-looking statements” that are based on current best available information and policies. There are various factors such as world economic conditions and semiconductor/automobile ma rket conditions which will directly and indirectly impact the Company’s results in the future. As a result, future outcomes may differ from those projected in this presentation. • Wordings and Data in presentation : Unless otherwise noted, “SPE” denotes our Semiconductor Production Equip. Segment, “Metrology (or Metr.)” denotes our Metrology Equip.Segment, “Net profit” denotes Net profit attributable to owner of the parent, and “MTP” denotes Mid-Term business Plan. • About data: Information listed in this presentation is summarized in Billions of Yen (BJPY or B) or percentage except as otherwise noted. As a result, there may be a case where the total of i ndividual amount and total amounts in each matter may differ. • Audit procedure: This presentation is not subject to audit procedures. • Translation of the document: This document has been translated from the Japanese original fo r reference purposes only. In the event of any discrepancy betwe en this translated document and the Japanese origi nal, the original shall prevail. The Company assumes no responsibility for this translation or for direct, indi rect or any other forms of damages arising from the translati on.
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@ TOKYO SEIMITSU Executive Summary 2 FY2027/3 1Q Results Current Business Environment FY2027/3 Forecast • Company-wide orders totaled 65.8BJPY (up 83% year-over-year(YoY)), reaching a new quarterly high, with particularly strong growth in the SPE (up 102% YoY) • Revenue increased by 19% YoY, OP rose 29% year-over-year • Strong demand for SPE continues • Metrology equipment segment also maintains a moderate growth trend • The production division remains busy and is considering additional investments to increase production capacity • Revised FY Earnings Forecasts Based on Backlog and Business Environment (Sales: 181.5BJPY => 189.0BJPY; Operating Profit: 40.0BJPY => 44.0BJPY • Dividend projection updated following the Revision of Earnings (276JPY per share => 304JPY per share)
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@ TOKYO SEIMITSU FY2027/3 1Q Quarterly Results 3 YoYQoQ1Q4Q3Q2Q1QSegment Results +102%+47%53.236.126.034.926.4Orders SPE +21%-31%28.541.127.435.923.5Sales +34%-50%5.410.75.38.34.0OP +2pt-7pt(19%)(26%)(20%)(23%)(17%)(OPM) +32%+29%12.69.710.79.89.5Orders Metr. +12%-36%8.212.88.510.37.3Sales -7%-75%0.52.10.91.80.5OP -1pt-10pt(6%)(16%)(10%)(18%)(7%)(OPM) YoYQoQFY2027/3 1Q4Q3Q2Q FY2026/3 1Q Company-Wide results (BJPY) +83%+44%65.845.836.644.735.9Orders +19%-32%36.753.935.946.230.9Sales +29%-54%5.912.86.210.14.6Operating profit (OP) +1pt-8pt(16%)(24%)(17%)(22%)(15%)(OP Margin) (OPM) +44%-51%6.413.16.710.54.5Recurring profit +45%-56%4.710.64.56.43.2Net profit +34%-6%3.33.62.93.02.5R&D -23%-28%1.92.71.54.42.5Capex +17%-5%1.41.61.41.41.2Depreciation Company-wide sales and profits increased YoY, order reached record high (2Q sales and profits to increase QoQ)
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@ TOKYO SEIMITSU 27.1 24.6 29.5 26.5 26.4 34.9 26.0 36.1 53.2 22.0 32.3 23.0 36.1 23.5 35.9 27.4 41.1 28.5 3.3 7.8 4.4 8.7 4.0 8.3 5.3 10.7 5.4 0.0 10.0 20.0 30.0 40.0 50.0 60.0 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q FY2025/3 FY2026/3 FY2027/3 Orders Sales Operating Profit SPE Segment Quarterly Trend 1Q orders were well above expectations, driven by HPC (incl. gen AI) as well as strong demand from China and others 4 (BJPY)
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@ TOKYO SEIMITSU Metrology Segment Quarterly Trend 1Q orders at a high level thanks to additional investments for HV production, and AI data centers, robots, and others 5 10.3 9.1 9.8 8.7 9.5 9.8 10.7 9.7 12.6 7.6 9.5 8.7 11.3 7.3 10.3 8.5 12.8 8.2 0.8 1.5 1.2 1.9 0.5 1.8 0.9 2.1 0.5 0.0 5.0 10.0 15.0 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q FY2025/3 FY2026/3 FY2027/3 Orders Sales Operating Profit(BJPY)
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@ TOKYO SEIMITSU Balance Sheet Cash and cash equivalents and inventory increased compared to Mar/E (自己資本比率) 69.0％ 69.4％ 73.2％Fixed Assets 68.6 75.9 77.0 Others 5.5 5.6 2.3 Inventories 69.5 68.0 73.0 Accounts Receivable 39.8 47.9 39.4 Cash 54.5 53.1 59.9 238.0 250.5 251.5 MAR/E 2025 MAR/E 2026 JUNE/E 2026 Net Assets 176.2 Net Assets 192.9 Net Assets 192.1 Fixed Liab. 14.8 9.7 8.3 Others 30.3 30.4 32.5 Accounts Payable 16.7 17.5 18.7238.0 250.5 251.5 MAR/E 2025 MAR/E 2026 JUNE/E 2026 < Assets > < Liabilities / Net Assets > (BJPY) (Equity Ratio) 73.2％ 76.3％ 75.6％ (BJPY) 6
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@ TOKYO SEIMITSU R&D, Capex and Depreciation 7 10.4 12.0 13.0 10.2 11.1 15.0 5.1 5.6 6.2 FY2025/3 FY2026/3 FY2027/3 1Q Results, FY Plan R&D Capex Depreciation (BJPY) 1Q results were generally in line with plans. The Capex plan was revised upward by ¥4.0B to increase capacity (Plan) 3.3 1.9 1.4 (Prev. plan : ¥11.0B)
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@ TOKYO SEIMITSU Premises of FY2027/3 Forecast (Blue: changed by August) 8 Order Trend Sales & Profits SPE： 1H order environment is very strong. 2H quantitative plan is not yet finalized; order level be on par with that of 1H HPC-related including Gen.AI : Except increase HoH mainly driven by Logic-related business Global OSAT：Inquiries likely to increase China Demands： Solid demand remains mainly for high-end use Memory (Non-HBM)： Expect acceleration toward DRAM/NAND investments Metr.：Except an increasing opportunities among in aerospace, defense, AI infrastructures, semis, and also from subsidy- related business SPE： Reflecting current demand, forecast mainly on 2H has revised (upward revision) HPC-related including Gen.AI： Sales/profits contribution to rise (approximately to Mid-40%) Global OSAT：Shipments of probers not limited to HPC but other Logics to increase China Demands：Maintain firm demand driven by high-end use Memory (Non-HBM)：Shipments for DRAM/NAND to increase Metr.： Increase YoY amid recover in industry, price revision, and businesses among aerospace, defense and semis Profits：Although pressures from an increase of various costs including from a manufacturing volume increase remain, aim to move closer to MTP target through high-value products and other factors
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@ TOKYO SEIMITSU FY2027/3 Forecast 9 YoYChangesFull Year2H(f)FY2027/3 1H(f)Full Year2HFY2026/3 1HSegment Sales +15%+6.0147.578.069.5127.968.559.4SPE +7%+1.541.522.519.039.021.317.7Metr. YoYChangesFull Year 2H(f) FY2027/3 1H(f)Full Year2H FY2026/3 1H Company-Wide results (BJPY) ----163.182.580.6Orders +13％+7.5189.0100.588.5166.889.877.1Sales +30％+4.044.024.919.133.719.014.7Operating profit +3pt+1pt(23％)(25％)(22％)(20％)(21％)(19％)(OP Margin) +26%+4.044.024.919.134.819.915.0Recurring profit +24%+2.830.817.413.424.715.19.6Net profit +8%±0.013.0--12.06.55.5R&D +36%+4.015.0--11.14.26.9Capex +11%±0.06.2--5.62.92.7Depreciation +42+28304152152262151111Dividend per share (JPY) The forecast disclosed on May 13th, 2026, has been revised mainly for 2H (upward revision for both SPE and Metrology) Forex assumption remains unchanged : ¥150 / US$ (Forex impact is minimal: High ratio of Yen-based businesses) Per share dividend projection has also been updated following forecast revision
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@ TOKYO SEIMITSU SPE Sales/Orders incl. Forecasts FY2027/3 1H order forecast has been updated from approx. +20% HoH to approx. +50% HoH (2Q orders likely to show a QoQ decrease as some orders might have been brought forward) 10 42.3 43.8 51.7 56.0 61.3 62.1 47.0 53.1 54.3 59.2 59.4 68.5 69.5 0.0 20.0 40.0 60.0 80.0 100.0 1H 2H 1H 2H 1H 2H 1H FY2024/3 FY2025/3 FY2026/3 FY2027/3 Orders Sales (BJPY) 1Q (results) 2Q (forecast)
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@ TOKYO SEIMITSU 17.2 17.6 19.4 18.5 19.3 20.4 16.6 18.1 17.1 19.9 17.7 21.3 19.0 0.0 10.0 20.0 30.0 1H 2H 1H 2H 1H 2H 1H FY2024/3 FY2025/3 FY2026/3 FY2027/3 Orders Sales Metrology Sales/Orders incl. Forecasts 11 (BJPY) FY2027/3 1H orders are expected to increase by approximately 10% HoH 1Q (results) 2Q (forecast)
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@ TOKYO SEIMITSU 12 質疑応答 / Q&A
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@ TOKYO SEIMITSU Supplementary Data - 生成AIを含むHPC / HPC-related business incl. Gen.AI 13 <売上高/Sales> <受注高/Orders> 2026年度上期予 FY2027/3 1H (f) 2025年度下期 FY2026/3 2H 2025年度上期 FY2026/3 1H(前半期比増減率 / HoH Changes) 前半期比 +29% HoH前半期比 +32% HoH前半期比 +55% HoH生成AIを含むHPC 全体 HPC-related incl. Gen. AI 前半期比 +78% HoH前半期比 +11% HoH前半期比 +81% HoHうちロジック (生成AIを含む) of which Logic (incl. Gen AI) 前半期比 -15% HoH前半期比 +64% HoH前半期比 +28% HoHうちHBM of which HBM 40%半ば / Mid 40%30%半ば / Mid-30%30%強 / Low 30%SPE売上高に占めるHPC関連の割合 HPC-related proportion of total SPE sales 2026年度上期予 FY2027/3 1H (f) 2025年度下期 FY2026/3 2H 2025年度上期 FY2026/3 1H(前半期比増減率 / HoH Changes) 前半期比 +56% HoH前半期比 +4% HoH前半期比 +24% HoH生成AIを含むHPC 全体 HPC-related incl. Gen. AI 前半期比 +50% HoH前半期比 +84% HoH前半期比 -11% HoHうちロジック (生成AIを含む)( * ) of which Logic (incl. Gen AI) (*) 前半期比 +68% HoH前半期比 -48% HoH前半期比 +65% HoHうちHBM of which HBM 40%強 / Low 40%40%40%SPE受注高に占めるHPC関連の割合 HPC-related proportion of total SPE orders • 変動が大きいため、四半期別の開示は行っておりません。 Due to significant volatilities, the Company does not provide quarterly forecasts. • 『生成AIを含むHPC全体』は、「うちロジック(生成AIを含む)」および「うちHBM」の合計です。「うちロジック(生成AIを含む)」には、ロジックデバイス向けプローバやAIパッケージング向けの加工装置の需要が含まれています。 なお、当社は製品の特性上、検査や加工がおこなわれる半導体デバイスの種別を特定することが困難であることから、生成AIに限定した分類は行っておりません。“HPC-related incl. Gen.AI” represents the sum of ‘of which Logic (incl. Gen.AI)' and ‘of which HBM’. The ‘of which Logic (incl. Gen. AI)' encompasses businesses for probers for logic devices and assembly equipment for AI packaging. Note that due to the nature of our products, it is difficult to identify the specific types of semiconductor devices undergoing inspection or processing; consequently, the Company does not undertake classification limited solely to Generative AI.
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@ TOKYO SEIMITSU Supplementary Data - 製品別構成比 半導体 / SPE Segment per Product 14 H60% 60% H50% H50% M60% M60% H60% L70% 70% L30% 40% L40% L40% M30% M30% L30% H20% H20% 0% 20% 40% 60% 80% 100% 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2024年度 FY2025/3 2025年度 FY2026/3 2026年度 FY2027/3 M50% 60% 60% L70% 70% M70% L60% L70% 80% L40% 40% 40% H20% 30% M20% H30% M20% 20% 0% 20% 40% 60% 80% 100% 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2024年度 FY2025/3 2025年度 FY2026/3 2026年度 FY2027/3 <売上高 Sales> < 受注高 Orders> プローバ Probers 加工装置 Assemble Machines プローバ Probers 加工装置 Assemble Machines 備考：表中の記載は、L:Low(前半), M:Middle(半ば), H:High(後半)を、LSD％：一桁%前半 (0-3%) 、MSD% :一桁%半ば (4-6%)、HSD%:一桁%後半 (7-9%)を示します。内訳の合計が100%にならない場合があります。 Note: The entries in the table represent L: Low, M: Middle, and H: High; LSD%: Low Single Digit % (0-3%), MSD%: Mid Single Digit % (4–6%), and HSD%: High Single Digit % (7–9%), respectively. SUM may not equal 100%.
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@ TOKYO SEIMITSU Supplementary Data - 製品別構成比 計測 / Metrology Segment per Product 15 M60% M60% M60% H60% M60% H50% 70% 60% 70% 30% H20% 30% M20% 30% 30% M20% H20% H20% LSD% HSD% LSD% HSD% MSD% L10% LSD% 10% LSD% 0% 20% 40% 60% 80% 100% 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2024年度 FY2025/3 2025年度 FY2026/3 2026年度 FY2027/3 H50% 70% 70% 70% M60% 70% H60% M60% M60% 30% L20% 20% 20% 30% L20% L20% H20% H20% L10% MSD% 10% HSD% LSD% HSD% 10% MSD% MSD% 0% 20% 40% 60% 80% 100% 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2024年度 FY2025/3 2025年度 FY2026/3 2026年度 FY2027/3 <売上高 Sales> < 受注高 Orders> 汎用計測機器 Measuring Instruments 自動計測機器 Auto Gages 充放電試験システム Battery Testing Systems 汎用計測機器 Measuring Instruments 自動計測機器 Auto Gages 充放電試験システム Battery Testing Systems 備考：表中の記載は、L:Low(前半), M:Middle(半ば), H:High(後半)を、LSD％：一桁%前半 (0-3%) 、MSD% :一桁%半ば (4-6%)、HSD%:一桁%後半 (7-9%)を示します。内訳の合計が100%にならない場合があります。 Note: The entries in the table represent L: Low, M: Middle, and H: High; LSD%: Low Single Digit % (0-3%), MSD%: Mid Single Digit % (4–6%), and HSD%: High Single Digit % (7–9%), respectively. SUM may not equal 100%.
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@ TOKYO SEIMITSU Supplementary Data - アプリ別構成比 半導体 / SPE Segment per Application 16 20% 20% H10% 20% M10% 20% H10% M20% M20% M30% H30% L40% H40% M40% 50% 50% 50% M50% M10% H10% L10% HSD% H10% 10% L10% HSD% HSD% M10% 10% 10% HSD% 10% MSD% MSD% MSD% LSD% 10% L10% M10% M10% L10% L10% L10% L10% MSD% 0% 20% 40% 60% 80% 100% 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2024年度 FY2025/3 2025年度 FY2026/3 2026年度 FY2027/3 M10% L20% L10% L30% 10% M40% H10% M30% H10% 50% M40% M50% L40% M50% M40% L50% M40% M60% H10% 10% L10% HSD% M10% MSD% 10% HSD% MSD% HSD% 10% HSD% MSD% MSD% LSD% MSD% MSD% MSD% HSD% 10% 10% 10% 10% LSD% 10% HSD% MSD% 0% 20% 40% 60% 80% 100% 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2024年度 FY2025/3 2025年度 FY2026/3 2026年度 FY2027/3 <売上高 Sales> < 受注高 Orders> メモリ Memory 電子部品 Electronic Components その他 Others ロジック Logic パワー半導体 Power Semi メモリ Memory 電子部品 Electronic Components その他 Others ロジック Logic パワー半導体 Power Semi 備考：表中の記載は、L:Low(前半), M:Middle(半ば), H:High(後半)を、LSD％：一桁%前半 (0-3%) 、MSD% :一桁%半ば (4-6%)、HSD%:一桁%後半 (7-9%)を示します。内訳の合計が100%にならない場合があります。 Note: The entries in the table represent L: Low, M: Middle, and H: High; LSD%: Low Single Digit % (0-3%), MSD%: Mid Single Digit % (4–6%), and HSD%: High Single Digit % (7–9%), respectively. SUM may not equal 100%.
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@ TOKYO SEIMITSU Supplementary Data - アプリ別構成比 計測 / Metrology Segment per Application 17 H40% L50% 40% M40% L50% 50% L40% 40% 40% LSD% LSD% 10% LSD% LSD% MSD% 10% 10% HSD% 40% H30% L40% M30% M30% H30% M30% M30% H30% 10% HSD% MSD% L10% MSD% HSD% 10% 10% M10% 0% 20% 40% 60% 80% 100% 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2024年度 FY2025/3 2025年度 FY2026/3 2026年度 FY2027/3 L50% 40% M40% M40% 40% L40% M40% M40% M40% LSD% LSD% HSD% MSD% H10% HSD% M10% MSD% 10% M30% H40% H30% M30% 30% 40% 30% H30% M30% HSD% 10% HSD% 10% 10% MSD% 10% 10% HSD% 0% 20% 40% 60% 80% 100% 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2024年度 FY2025/3 2025年度 FY2026/3 2026年度 FY2027/3 <売上高 Sales> < 受注高 Orders> 自動車 Auto 機械・機械部品 Machinery & Parts 航空機関連 Aero, etc. その他 Others 自動車 Auto 機械・機械部品 Machinery & Parts 航空機関連 Aero, etc. その他 Others 備考：表中の記載は、L:Low(前半), M:Middle(半ば), H:High(後半)を、LSD％：一桁%前半 (0-3%) 、MSD% :一桁%半ば (4-6%)、HSD%:一桁%後半 (7-9%)を示します。内訳の合計が100%にならない場合があります。 Note: The entries in the table represent L: Low, M: Middle, and H: High; LSD%: Low Single Digit % (0-3%), MSD%: Mid Single Digit % (4–6%), and HSD%: High Single Digit % (7–9%), respectively. SUM may not equal 100%.
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@ TOKYO SEIMITSU Supplementary Data - 地域別構成比 半導体 / SPE per Region 18 L20% H10% L10% L10% H10% M10% M10% H10% HSD% H30% 50% M40% H30% H10% M20% M20% 20% 30% HSD% MSD% L10% L10% L10% L10% MSD% HSD% 10% HSD% HSD% M10% L10% H10% M20% M20% 20% M20% M10% HSD% 10% HSD% M10% MSD% M10% 20% L10% HSD% 10% MSD% M10% 20% H10% 10% 10% 10% 0% 20% 40% 60% 80% 100% 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2024年度 FY2025/3 2025年度 FY2026/3 2026年度 FY2027/3 M10% M10% 10% L10% 10% L10% HSD% L10% MSD% L50% L40% 30% 30% L40% 20% H20% 30% H40% 10% M10% MSD% 10% 10% HSD% MSD% MSD% MSD% MSD% L10% L20% M20% L10% H10% H20% 20% M20% MSD% L10% 10% 10% MSD% 30% HSD% H10% HSD% 10% MSD% H10% HSD% 20% 10% 20% 10% MSD% 0% 20% 40% 60% 80% 100% 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2024年度 FY2025/3 2025年度 FY2026/3 2026年度 FY2027/3 <売上高 Sales> < 受注高 Orders> 日本 Japan 台湾 Taiwan 中国 China 韓国 Korea 東南アジア SEA 欧米 EU & North America 日本 Japan 台湾 Taiwan 中国 China 韓国 Korea 東南アジア SEA 欧米 EU & North America 備考：表中の記載は、L:Low(前半), M:Middle(半ば), H:High(後半)を、LSD％：一桁%前半 (0-3%) 、MSD% :一桁%半ば (4-6%)、HSD%:一桁%後半 (7-9%)を示します。内訳の合計が100%にならない場合があります。 Note: The entries in the table represent L: Low, M: Middle, and H: High; LSD%: Low Single Digit % (0-3%), MSD%: Mid Single Digit % (4–6%), and HSD%: High Single Digit % (7–9%), respectively. SUM may not equal 100%.
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@ TOKYO SEIMITSU Supplementary Data - 地域別構成比 計測 / Metrology per Region 19 H70% M80% M80% H80% H70% 80% M70% M80% 70% MSD% LSD% LSD% MSD% MSD% MSD% MSD% LSD% 10% HSD% MSD% MSD% MSD% HSD% MSD% 10% MSD% 10% LSD% LSD% LSD% LSD% LSD% LSD% LSD% LSD% LSD% LSD% LSD% LSD% LSD% LSD% LSD% LSD% LSD% LSD% MSD% LSD% LSD% LSD% MSD% MSD% MSD% LSD% MSD% 60% 80% 100% 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2024年度 FY2025/3 2025年度 FY2026/3 2026年度 FY2027/3 90% L80% M80% L80% H70% 80% M80% H70% H70% LSD% MSD% MSD% MSD% MSD% MSD% LSD% MSD% HSD% LSD% MSD% MSD% MSD% HSD% HSD% MSD% HSD% HSD% LSD% LSD% LSD% LSD% LSD% LSD% LSD% LSD% LSD% LSD% LSD% LSD% LSD% LSD% LSD% LSD% LSD% LSD% LSD% LSD% LSD% MSD% LSD% MSD% MSD% LSD% MSD% 60% 80% 100% 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2024年度 FY2025/3 2025年度 FY2026/3 2026年度 FY2027/3 <売上高 Sales> < 受注高 Orders> 日本 Japan 台湾 Taiwan 中国 China 韓国 Korea 東南アジア SEA 欧米 EU & North America 日本 Japan 台湾 Taiwan 中国 China 韓国 Korea 東南アジア SEA 欧米 EU & North America 備考：取引顧客の国籍による分類であり、日本向け売上高・受注高には第3国への輸出案件が含まれています。This data classifies based on customers’ nationality. Sales and orders for Japan include export transactions to third countries. 備考：表中の記載は、L:Low(前半), M:Middle(半ば), H:High(後半)を、LSD％：一桁%前半 (0-3%) 、MSD% :一桁%半ば (4-6%)、HSD%:一桁%後半 (7-9%)を示します。内訳の合計が100%にならない場合があります。 Note: The entries in the table represent L: Low, M: Middle, and H: High; LSD%: Low Single Digit % (0-3%), MSD%: Mid Single Digit % (4–6%), and HSD%: High Single Digit % (7–9%), respectively. SUM may not equal 100%.
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@ TOKYO SEIMITSU Supplementary Data - セグメント別業績推移 / Segment Information 20 四半期 Quarterly 連結会計期間 Consolidated Fiscal Year (百万円) Million Yen 2027年3月期 FY2027/32026年3月期 FY2026/32026年 3月期 FY2026/3 2025年 3月期 FY2025/3 2024年 3月期 FY2024/3 2023年 3月期 FY2023/3 4Q3Q2Q1Q4Q3Q2Q1Q 53,23636,10625,96534,94526,378123,396107,71386,08299,366半導体 SPE Orders受注高 12,5839,72810,6619,7869,52339,70037,91734,80236,960計測 Metr. 65,82045,83536,62744,73235,901163,096145,631120,885136,326合計 Total 89,87065,14970,13471,54172,46665,14969,63075,39889,371半導体 SPE Backlog受注残高 18,59214,21017,25715,12315,66014,21013,47012,60612,428計測 Metr. 108,46379,35987,39186,66488,12779,35983,10188,004101,799合計 Total 28,51541,09227,37235,87023,542127,878113,481100,055112,365半導体 SPE Sales売上高 8,20112,7758,52810,3237,33338,96037,05334,62434,436計測 Metr. 36,71653,86735,90046,19430,876166,839150,534134,680146,801合計 Total 5,40910,7275,3478,2974,03128,40424,31119,89929,866半導体 SPE OP 営業利益 5112,0778671,8385495,3335,3925,4084,628計測 Metr. 5,92012,8056,21410,1364,58133,73829,70325,30734,494合計 Total 19.0％26.1％19.5%23.1%17.1%22.2%21.4%19.9%26.6%半導体 SPE OP Margin営業利益率 6.2％16.3％10.2%17.8%7.5%13.7%14.6%15.6%13.4%計測 Metr. 16.1％23.8％17.3%21.9%14.8%20.2%19.7%18.8%23.5%合計 Total
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@ TOKYO SEIMITSU Supplementary Data - 損益計算書 / Income Statement 21 四半期 Quarterly 連結会計期間 Consolidated Fiscal Year (百万円 (EPS除く)) Million Yen(excl. EPS) 2027年3月期 FY2027/32026年3月期 FY2026/32026年 3月期 FY2026/3 2025年 3月期 FY2025/3 2024年 3月期 FY2024/3 2023年 3月期 FY2023/3 4Q3Q2Q1Q4Q3Q2Q1Q 36,71653,86735,90046,19430,876166,839150,534134,680146,801売上高 Net Sales 21,31631,03421,06327,41118,46897,97888,08179,91784,967売上原価 Cost of goods sold 15,40022,83214,83718,78312,40768,86062,45354,76261,834売上総利益 Gross Profit on Sales 9,47910,0268,6228,6477,82535,12232,75029,45427,339 販売費および一般管理費 Selling, general and administrative expenses 5,92012,8056,21410,1364,58133,73829,70325,30734,494営業利益 Operating profit 5764286093091331,4819211,404965営業外収益 Non-operating income 6612684-69252394684259162営業外費用 Non-operating expenses 6,43013,1086,73910,5154,46234,82529,93926,45335,297経常利益 Recurring Profit 301058531944,493824103特別利益 Extraordinary gains --269-2,103-1,833158212,099特別損失 Extraordinary losses 6,43413,3776,8448,4984,46533,18634,27527,25533,301税金等調整前当期/四半期純利益 Profit before income taxes and minority interests 1,6982,7682,2682,0901,2288,3548,5317,7919,607法人税等合計 Total Income tax and others 671839257921068462非支配株主に帰属する当期/四半期純利益 Net Profit attributable to minority interests 4,66710,5904,5366,3823,22924,73925,63719,37823,630親会社株主に帰属する当期/四半期純利益 Net Profit attributable to Owners of the Parent 115.01260.73112.74157.3279.77610.02633.75480.49581.331株当たり当期/四半期純利益(円) Net Profit per Share(Yen) -----606.14628.31475.42575.62 潜在株式調整後 1株当たり当期/四半期純利益(円) Net Profit per Share(diluted)(Yen)
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@ TOKYO SEIMITSU Supplementary Data - 貸借対照表 / Balance Sheet 22 2027年3月期 第1四半期 FY2027/3 1Q 2026年3月期 FY2026/3 2025年3月期 FY2025/3 2024年3月期 FY2024/3(百万円)(Million Yen) 59,92553,07354,54136,782現金及び預金 Cash and cash equivalents Current Assets 流動資産 39,35547,87739,80942,801売上債権※1 Accounts Receivable※1 73,01768,02269,51367,225棚卸資産 Inventories 2,2595,6345,4777,022その他 Others 174,558174,607169,341153,831合計 Total 76,97375,92568,61071,693固定資産合計 Total Fixed Assets 251,531250,533237,952225,524総資産 Total Assets 18,65117,52916,66517,845買入債務※2 Accounts Payable ※2 Current Liabilities流動負債 32,49030,35030,26828,156その他 Others 51,14147,87946,93346,002合計 Total 8,3309,73714,78921,094固定負債合計 Total long-term liabilities 59,47257,61761,72367,097負債合計 Total Liabilities 192,058192,916176,229158,427純資産合計 Total Net Assets 251,531250,533237,952225,524負債・純資産合計 Total Liabilities and Net Assets 13,18114,71320,08425,171有利子負債合計 Total interest-bearing debt 75.6％76.3％73.2%69.4%自己資本比率 Equity Ratio(%) -13.5％15.5%12.9%自己資本利益率 ROE(%) ※1: 電子記録債権、契約資産を含みます。 Incl. Electronically recorded monetary claims. ※2: 電子記録債務を含みます。 Incl. Electronically recorded obligations-operating.
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@ TOKYO SEIMITSU Supplementary Data - 各種費用, キャッシュフロー/ Expenses and Cash Flows 23 2027年3月期 第1四半期 FY2027/3 1Q 2026年3月期 FY2026/3 2025年3月期 FY2025/3 2024年3月期 FY2024/3(百万円)(Million Yen) 3,33312,03710,3549,042研究開発費 R&D expenses 1,93011,06910,24511,602設備投資 Capex 1,4375,5825,1054,673減価償却費（のれんの償却を除く） Depreciation（excl. Amortization of goodwill） 2026年3月期 FY2026/3 2025年3月期 FY2025/3 2024年3月期 FY2024/3(百万円)(Million Yen) 25,01228,8244,892営業活動によるキャッシュフロー Cash flows from operating activities -11,4912,541-10,563投資活動によるキャッシュフロー Cash flows from investing activities 13,52031,365-5,671フリーキャッシュフロー Free cash flows -15,674-13,9911,616財務活動によるキャッシュフロー Cash flows from financing activities 689404755現金及び現金同等物に係る換算差額等 Adjustments 53,05254,51636,736現金及び現金同等物の期末残高 Cash and cash equivalents at the end of year 2027年3月期 第1四半期 FY2027/3 1Q 2026年3月期 FY2026/3 2025年3月期 FY2025/3 2024年3月期 FY2024/3(従業員) (# of Employees) 2,9942,8902,7672,658正社員合計 Total full-time employees 1,3701,3651,2581,225期間平均臨時従業員数 (外書) Average number of part-time employees, not included in the above figure 4,3644,2554,0253,883従業員合計 (※1) Number of employees ※1: 従業員合計は、正社員合計人数と、期間平均臨時従業員数の単純合算です。“Number of employees” is a simple sum of the total number of regular employees and the a verage number of temporary employees during the period.