Slides
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Honsu Group 2026Q3 Business Update
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P-2 免責聲明 免責聲明: 本簡報所提供資訊皆以公開資訊觀測站公告為主 ，本公司所提供 之所有資訊僅供參考，不得據以做為買賣本公司或第三人所發行 之有價證券或其他金融商品交易使用，或要求本公司負責。
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P-3 I、Company II、Performance III、R&D Investment IV、Product Strategy V、Dividend Policy
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P-4 I、Company II、Performance III、R&D Investment IV、Product Strategy V、Dividend Policy
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P-5 Group Member Main Product: Wet Process Equipment (Etch /PR Strip/ Cleaner) 、 Chemical Deliver System Y2013 Merged Y2002 Founded Employee : 110 Main Product: Wet Process Chemistry (Etchant 、 PR Stripper 、 Plating Additive) Main Product: Software System Design(EDA、 SPC、FDC、Big data) Service Y1993 Founded Y2011 IPO (3131) Employee : 382 Main Product: Agent Metrology(X - Ray 、 CSAM 、 EPD )、 Inspection 、 Wafer Transfer 、 Robot 、 pump Overhaul Y2019 Merged Y1987 Founded Employee : 123 Y2018 Merged Y2002 Founded Employee : 25 As of July 31, 2026 • Excluding subcontractors • As of July 31, 2026
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P-6 I、Company II、Performance III、R&D Investment IV、Product Strategy V、Dividend Policy
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P-7 Income Statement(By Quarter) MNTD Quarter ／account 1Q25 2Q25 3Q25 4Q25 1Q26 2Q26 QoQ YoY Revenue 1,241 1,630 1,494 2,150 1,596 1,726 8.1% 5.9% Gross Profit 506 662 608 905 539 671 24.4% 1.4% OP Expense 230 255 291 269 329 306 -7.1% 20.1% OP Net Profit 277 407 317 636 210 365 73.9% -10.3% Non-OP Revenue 41 (114) 62 65 370 42 - - Income before Tax 318 293 379 700 580 407 -29.8% 39.1% Net Profit 255 205 303 562 461 323 -29.9% 57.5% EPS(NTD) 8.74 7.05 10.40 19.29 16.11 11.16 -30.7% 58.3% Gross Margin 40.8% 40.6% 40.7% 42.1% 33.8% 38.9% 5.1% -1.7% OP Margin 22.3% 25.0% 21.2% 29.6% 13.2% 21.1% 8.0% -3.8% Margin before Tax 25.6% 18.0% 25.4% 32.6% 36.3% 23.6% -12.8% 5.6%
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P-8 Income Statement MNTD Year／account 2020 2021 2022 2023 2,024 2025 1H'25 1H'26 YoY Revenue 2,488 3,658 3,723 3,544 4,073 6,514 2,871 3,322 15.7% Gross Profit 1,126 1,563 1,618 1,488 1,845 2,681 1,168 1,210 3.6% OP Expense 593 739 859 793 939 1,045 484 635 31.2% OP Net Profit 533 824 759 695 906 1,636 684 575 -15.9% Non-OP Revenue (23) 10 175 54 141 53 73 412 464.4% Income before Tax 510 835 934 749 1,047 1,690 611 987 61.5% Net Profit 397 670 722 616 846 1,325 460 784 70.4% EPS(NTD) 13.92 23.47 25.32 21.56 29.07 45 16 27 72.7% Gross Margin 45.3% 42.7% 43.5% 42.0% 45.3% 41.2% 40.7% 36.4% -4.3% OP Margin 21.4% 22.5% 20.4% 19.6% 22.2% 25.1% 23.8% 17.3% -6.5% Margin before Tax 20.5% 22.8% 25.1% 21.1% 25.7% 25.9% 21.3% 29.7% 8.4%
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P-9 I、Company II、Performance III、R&D Investment IV、Product Strategy V、Dividend Policy
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P-10 R&D Expense Investment 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 占比 9.30% 9.85% 8.01% 9.23% 11.78% 8.50% 7.82% 7.34% 7.87% 7.54% 7.95% 5.30% 研發費用 149,689 196,894 173,334 195,616 174,876 175,148 194,497 268,481 292,966 267,088 323,851 345,318 9.30% 9.85% 8.01% 9.23% 11.78% 8.50% 7.82% 7.34% 7.87% 7.54% 7.95% 5.30% 0.00% 2.00% 4.00% 6.00% 8.00% 10.00% 12.00% 14.00% 0 30,000 60,000 90,000 120,000 150,000 180,000 210,000 240,000 270,000 300,000 330,000 360,000 390,000 研發營收佔比% 研發費用 (KNTD) 弘塑科技研發費用及營收佔比( Group) 占比 研發費用
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P-11 I、Company II、Performance III、R&D Investment IV、Product Strategy V、Dividend Policy
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P-12 Recent Key Activities 01 Expanding Production Capacity 擴充產能 02 Strengthening Global Operations 強化全球營運 03 Driving Productivity Gains 提升生產力
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P-13 Process Application Opp. 2D to 3D Structure Wide Range Wafer Size 75mm 100mm 125mm 150mm 200mm 300mm 310*310 mm 510*515 mm 600*600 mm Fan-In / WL-CSP Fan-Out / WLP/PLP 2.5D Packaging 3D Hybrid Bond Package on package • CuP, FO • 2.5D • 3D、CPO • HBM Advanced Package Compounded Semi• SiC • GaAs/GaN • InP Automotive • Diode • CIS • Micro LED Others • Bio Chip • Crystal element • IC Substrate Multi - Application
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P-14 I、Company II、Performance III、R&D Investment IV、Product Strategy V、Dividend Policy
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P-15 EPS History 8.82 12.46 20.30 11.90 16.41 15.90 15.22 11.29 11.11 13.92 23.47 25.32 21.56 29.07 45.48 0.00 5.00 10.00 15.00 20.00 25.00 30.00 35.00 40.00 45.00 50.00 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 歷年EPS趨勢
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P-16 Dividend History 79.64% 90.07% 59.31% 63.04% 73.13% 62.88% 65.71% 83.87% 75.40% 80.98% 74.18% 72.83% 75.84% 75.68% 101.63% 0.00% 20.00% 40.00% 60.00% 80.00% 100.00% 120.00% 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 歷年股利配發率趨勢
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P-17 THANKS 感謝聆聽