5289 Investor presentation

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P1© COPYRIGHT INNODISK CORPORATION DISCLAIMER This file and the financial information and forecast information are based on information obtained by the company from internal and external sources. The actual operating results and financial conditions of the company may differ from these predictive sets of information due to various uncontrollable factors. The viewpoints in this file reflects the company's opinion on the future by the current date. If there are any changes or adjustment in the future, the company is not responsible for notifying the reader or updating the content.

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P2© COPYRIGHT INNODISK CORPORATION AGENDA ▪ Company Profile and Overview ▪ Market Trend and Product Strategy ▪ AI in Action Global Campaign ▪ ESG Commitment ▪ Financial Information ▪ Q&A

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P3© COPYRIGHT INNODISK CORPORATION COMPANY PROFILE & OVERVIEW

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P4© COPYRIGHT INNODISK CORPORATION REVENUE NT$ 35.62B (2026 1H) CUSTOMERS 4,000+ PATENTS 211 CAPITAL NT$964M EPS NT$166.45 (2026 1H) CORPORATE OVERVIEW

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P5© COPYRIGHT INNODISK CORPORATION GLOBAL BUSINESS OPERATIONS Taiwan Innodisk HQ / R&D and Production Center / Research Center Tokyo Jinan/ Hangzhou/ Suzhou/ Shanghai Beijing Vietnam Guangzhou Chengdu Shenzhen Netherlands GermanyFrance New Jersey Texas California Boston Korea 25 Locations 1,259 Employees Taiwan: 1,111 / Overseas: 148

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P6© COPYRIGHT INNODISK CORPORATION 27,000 Lot Size (Sq. Meter) 12,000 Floor Area: 1st building (Sq. Meter) 1,080K 2026 Capacity (SMT x 6) 1,440K Maximum Capacity (SMT x 8)Edge AI System and Solution Edge AI Embedded Peripheral Edge AI Camera Module15,000 Floor Area: 2nd building (Sq. Meter) R&D & MANUFACTURING CENTER YILAN SCIENCE PARK

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P7© COPYRIGHT INNODISK CORPORATION 17F 1,650 m² / Aetina 16F 3,300 m² / R&D Center, Sports & Activity Center, Training Room 5F 3,300 m² 4F 3,300 m² 3F 3,300 m² 2F 1,650 m² / Aetina 660 m² SPACE Total :19,800 m² 7F 3,300 m² / Aetina 660 m² INNODISK HEADQUARTERS

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P8© COPYRIGHT INNODISK CORPORATION QUALITY & SUSTAINABILITY: OUR TOP PRIORITY PRODUCTION 1,440K / Maximum Capacity (SMT x 8) CERTIFICATIONS ISO9001 / ISO14001 / ISO45001 / QC080000 / ISO14064-1 / ISO27001 / IEC62443-4-1 MANUFACTURING New Taipei City / Yilan County

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P9© COPYRIGHT INNODISK CORPORATION MARKET TREND & PRODUCT STRATEGY

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P10© COPYRIGHT INNODISK CORPORATION Innodisk Group: Comprehensive AI Core Architecture ▪ Compute: CPU / GPU / NPU / AI ASIC ▪ Memory: DRAM Module ▪ Storage: Flash Storage ▪ Power: Thermal & Energy Management ▪ Connectivity: Optical Communication AI CORE: COMPUTING, MEMORY, STORAGE

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P11© COPYRIGHT INNODISK CORPORATION 3 CORE VALUES: Market & Product Technology 01 Market & Application Value AI redefines value creation across products, services, and operations, driving unprecedented leaps in industry value. 02 Product Technology & Talent Value Deploying a robust five-layer AI architecture and expert talent to deliver highly compatible, collaborative solutions for diverse global needs. 03 Edge AI Integration & Deployment Value Bridging technology gaps with strong R&D capabilities and global partnerships to connect edge applications and accelerate rapid Edge AI deployment.

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P12© COPYRIGHT INNODISK CORPORATION 01 Market & Application Value AI redefines value creation across products, services, and operations, driving unprecedented leaps in industry value. 02 Product Technology & Talent Value Deploying a robust five-layer AI architecture and expert talent to deliver highly compatible, collaborative solutions for diverse global needs. 03 Edge AI Integration & Deployment Value Bridging technology gaps with strong R&D capabilities and global partnerships to connect edge applications and accelerate rapid Edge AI deployment. 3 CORE VALUES: Market & Product Technology

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P13© COPYRIGHT INNODISK CORPORATION 01 Market & Application Value AI Infrastructure ◼ GPU Server / Networking Switch / Router ◼ Humanoid Robot / Autonomous Global Vertical Leaders ◼ Medical / 5G / Surveillance / Entertainment / Automation ◼ Tier-1 Market Leaders High Value-added Industrial Solution Providers ◼ Manufacturing / Retail & Logistic / Smart Energy / Health Care / Communication / Entertainment / Enterprise

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P14© COPYRIGHT INNODISK CORPORATION AI Infrastructure Core Infrastructure for AI Computation, Smart Storage, Transmission, and Scaled Deployment CSP / Data Center / AI Computing Expanding AI training and inference fuel exponential growth in demand for high-performance computing, high-bandwidth transmission, and large-scale storage. Optical & Network Communications Exploding AI data traffic drives demand for low-latency, high- reliability transmission, backed by robust optical and network infrastructure to support heavy AI workloads. Robotics & Physical AI AI is moving from the digital realm to the physical world, empowering robotics and physical AI to integrate into everyday operations through perception, computing, and autonomous decision-making. Enterprise AI Enterprises are rapidly adopting generative AI to turn data into business insights while balancing data privacy, governance, and operational efficiency. 01 Market & Application Value

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P15© COPYRIGHT INNODISK CORPORATION Driving Market Standards and Industry Innovation for Scaled Edge AI Deployment Global Vertical Leaders Healthcare AI accelerates smart diagnostics, treatment, and care to boost precision and efficiency, driving the scaled adoption of advanced medical devices and services. Networking & Telecom AI enables real-time network analysis, smart traffic routing, and automated operations to enhance connectivity and power real-time decision-making. Security & Surveillance AI vision strengthens real-time recognition, event forecasting, and decision support, shifting security from passive recording to proactive prevention. Smart Manufacturing Transitioning from automation to AI-driven manufacturing, leveraging AI vision and robotics to massively boost overall production efficiency. 01 Market & Application Value

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P16© COPYRIGHT INNODISK CORPORATION Domain Expertise for 4,000+ Global Customers, Accelerating High-Value AI Deployment High Value-added Industrial Solution Providers Deep Domain Know-How Complex industrial environments require deep industry insight and application experience to address diverse operational conditions. High Customization & Integration Fragmented hardware specs and system architectures demand flexible, tailored hardware-software integration for successful project deployment. High Value-Added Growing demand for product differentiation and intelligence makes AI a key driver for equipment upgrades and competitive edge. Long Lifecycle Industrial equipment requires rigorous validation and extended lifecycles, demanding uncompromising reliability and supply stability. 01 Market & Application Value

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P17© COPYRIGHT INNODISK CORPORATION 01 Market & Application Value AI redefines value creation across products, services, and operations, driving unprecedented leaps in industry value. 02 Product Technology & Talent Value Deploying a robust five-layer AI architecture and expert talent to deliver highly compatible, collaborative solutions for diverse global needs. 03 Edge AI Integration & Deployment Value Bridging technology gaps with strong R&D capabilities and global partnerships to connect edge applications and accelerate rapid Edge AI deployment. 3 CORE VALUES: Market & Product Technology

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P18© COPYRIGHT INNODISK CORPORATION Stack 5: Software Stack 4: Sensing & Comm. Stack 3: Storage Stack 2: Memory Stack 1: Compute 02 Product Technology & Talent Value

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P19© COPYRIGHT INNODISK CORPORATION Stack 5: Software Stack 4: Sensing & Comm. Stack 3: Storage Stack 1: Compute Stack 2: Memory Five-Layer Stack × Proprietary Tech Across All Layers Heterogeneous Core Computing Power Industrial Module Integration Custom System Design In-House Firmware Value-Add Rapid Deployment Reliable platforms, industrial memory and high-end storage AI accelerator, network and video capture cards with flexible I/O Industrial structure and thermal design to speed up time-to- market BIOS / BMC / MCU system-level optimization and customization End-to-end solutions defined by field needs, solving real pain points 02 Product Technology & Talent Value

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P20© COPYRIGHT INNODISK CORPORATION Stack 5: Software Stack 4: Sensing & Comm. Stack 3: Storage Stack 1: Compute Stack 2: Memory 02 Product Technology & Talent Value Five-Layer Stack × Proprietary Tech Across All Layers Resilient Vendor Supply Chain Industrial High-Grade Components First-to- Market Rigorous Validation & Testing Global Localized Support Key Components & Hardware IntegrationAdvanced R&D & Specialized Solutions Global Services & Warranty Industrial Quality & Smart ManufacturingOriginal Grade DRAM IC & Strategic Sourcing

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P21© COPYRIGHT INNODISK CORPORATION Stack 5: Software Stack 4: Sensing & Comm. Stack 3: Storage Stack 1: Compute Stack 2: Memory 02 Product Technology & Talent Value Five-Layer Stack × Proprietary Tech Across All Layers Strategic Ecosystem Partners 100% In- House R&D Industrial R&D Team Cross-Domain HW/FW Integration Full Life-Cycle Warranty 20+year R&D team Full-Spectrum Design Validation Powered by proprietary, high- precision test platformsOriginal Tier-1 key components Tailored engineering support throughout the product lifecycle

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P22© COPYRIGHT INNODISK CORPORATION Stack 5: Software Stack 4: Sensing & Comm. Stack 3: Storage Stack 1: Compute Stack 2: Memory 02 Product Technology & Talent Value Five-Layer Stack × Proprietary Tech Across All Layers Cross- Platform Design In-House Driver / FW High-Speed Transmission & Smart Connectivity Custom Sensor Solutions Multi-Interface & Multi-Form- Factor Design Easy to integrate with hardware and software AI connectivity and data transmission In house R&D customization LAN, Optical, Series, CAN, EtherCAT with PCIe,M.2 FF X86, Nvidia, Qualcomm, AI ASIC

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P23© COPYRIGHT INNODISK CORPORATION Stack 5: Software Stack 4: Sensing & Comm. Stack 3: Storage Stack 1: Compute Stack 2: Memory 02 Product Technology & Talent Value Five-Layer Stack × Proprietary Tech Across All Layers Cloud Device Management API / SDK Support BIOS / BSP / Driver Customization Model Inference & Training Tools AI Engine iCAP, OTA, OOB remote management Friendly Utility Support In-house R&D support customization iVIT-T & iVIT-I Tool Kits MCP protocol expedite Agentic AI

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P24© COPYRIGHT INNODISK CORPORATION Stack 5: Software Stack 4: Sensing & Comm. Stack 3: Storage Stack 1: Compute Stack 2: Memory Heterogeneous Core Computing Power Industrial Module Integration Custom System Design In-House Firmware Value-Add Rapid Deployment Resilient Vendor Supply Chain Industrial High-Grade Components First-to- Market Rigorous Validation & Testing Global Localized Support Strategic Ecosystem Partners 100% In- House R&D Industrial R&D Team Cross-Domain HW/FW Integration Full Life-Cycle Warranty Cross- Platform Design In-House Driver / FW High-Speed Transmission & Smart Connectivity Custom Sensor Solutions Multi-Interface & Multi-Form- Factor Design Cloud Device Management API / SDK Support BIOS / BSP / Driver Customization Model Inference & Training Tools AI Engine 02 Product Technology & Talent Value Five-Layer Stack × Proprietary Tech Across All Layers Reliable platforms, industrial memory and high-end storage AI accelerator, network and video capture cards with flexible I/O Industrial structure and thermal design to speed up time-to- market BIOS / BMC / MCU system-level optimization and customization End-to-end solutions defined by field needs, solving real pain points iCAP, OTA, OOB remote management Friendly Utility Support In-house R&D support customization iVIT-T & iVIT-I Tool Kits MCP protocol expedite Agentic AI X86, Nvidia, Qualcomm, AI ASIC Easy to integrate with hardware and software AI connectivity and data transmission In house R&D customization LAN, Optical, Series, CAN, EtherCAT with PCIe,M.2 FF 20+year R&D team Full-Spectrum Design Validation Powered by proprietary, high- precision test platformsOriginal Tier-1 key components Tailored engineering support throughout the product lifecycle Key Components & Hardware IntegrationAdvanced R&D & Specialized Solutions Global Services & Warranty Industrial Quality & Smart ManufacturingOriginal Grade DRAM IC & Strategic Sourcing

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P25© COPYRIGHT INNODISK CORPORATION APEX-A100 10,000 TOPS 1,000 TOPS 100 TOPS (TOPS @ INT8) Enterprise AI Computing ◼ Enterprise AI Platform ◼ Multi-Agent AI Collab. ◼ RAG ◼ Fine-Tuning ◼ 70B+ LLM Deployment High-Performance Edge AI Inference ◼ Multi-Camera AOI ◼ Defect Inspection ◼ Machine Vision ◼ Medical Imaging ◼ Agentic AI Vision AI & Edge Analytics ◼ Surveillance Video Analysis ◼ Smart Retail ◼ AOI ◼ Crowd / Traffic Analysis ◼ AMR Edge Device AI Inference ◼ Image Classification ◼ Facial Recognition ◼ OCR ◼ License Plate Recognition (LPR) ◼ Single-Object Detection APEX-P100 APEX-S100 APEX-X100 APEX-X200 APEX-X100-Q APEX-P300 APEX-P200 APEX-E100 APEX-E300 Powered by NVIDIA Qualcomm Intel Stack 1: Compute AIB-AT78/68 AIE-PX11/12/21/22

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P26© COPYRIGHT INNODISK CORPORATION INDUSTRIAL EDGE AI Industrial Vertical Market AI Inference AI Training Enterprise Private AI Server ENTERPRISE EDGE AI ENTERPRISE EDGE AI AI Server / CSP Stack 2 & 3: Memory & Storage On-device SSD DDR5 ECC SODIMM / DDR5 ECC UDIMM / DDR5 RDIMM On-prem Edge AI / KV Cache SSD DDR5 RDIMM / DDR5 MRDIMM Central Cloud Data Center SSD CXL Memory Module / CXL AIC / DDR5 MRDIMM

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P27© COPYRIGHT INNODISK CORPORATION EMPOWERING EDGE AI COMPUTING DDR5 8000MT/s RDIMM Edge AI Ultra-High-Speed Computing Engine ◼ Target: Edge AI & high-speed networking bandwidth. ◼ Performance: Ultra-low latency & superior stability. ◼ Application: Real-time edge inference & massive data processing. Embedded Memory Wide Temp. Memory Customized Memory AI Memory Server Memory ◼ Formfactor: CAMM2 / CUDIMM / CSODIMM / SODIMM / RDIMM / VLP / ...... ◼ Technology & Generation: CXL / DDR5 / DDR4 / DDR3 / DDR2 DRAM Module Portfolio BREAKING AI ARCHITECTURE BOTTLENECKS CXL AIC (ADD-IN-CARD) Breaking Edge Computing's Memory Barrier ◼ Objective: Expand memory capacity for the next-gen AI. ◼ Key Feature: Seamless, large-scale memory scaling. ◼ Benefit: Optimized TCO for Hyperscale Data Centers & AI Training. Stack 2: Memory

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P28© COPYRIGHT INNODISK CORPORATION DATACENTER SSD | BOOT DRIVE MAXIMIZING SYSTEM BOOT RELIABILITY ◼ Optimized Booting: High-speed startup and OS loading. ◼ Reliability: High endurance for frequent write cycles. ACCELERATING LARGE-SCALE DATA THROUGHPUT DATACENTER SSD | STORAGE DRIVE ◼ High Throughput: Designed for large-scale data handling and sustained performance. ◼ Low Latency: Scalable for heavy processing and storage. PCIe Gen5, 5TS4-P Series: E1.S and U.2 PCIe Gen5, 5TS-P Serries: U.2, EDSFF (E3.S, E3.L and E1.S) SD PATA PCIe SATA ◼ Embedded Product Line: M.2 / U.2 / CFexpress / EDSFF / 2.5” / 1.8” / SATA Slim / SATADOM / mSATA / CFast / nanoSSD /CompactFlash Card / SD Card & MicroSD Card / USB / USB EDC Flash Storage (SSD) Portfolio USB PCIe Gen5 & 218-layer 3D NAND Flash Stack 3: Storage

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P29© COPYRIGHT INNODISK CORPORATION CAN Bus & CAN FD SerialLAN Intelligent Peripheral Solution Portfolio Wi-Fi 10GbE / 25GbE OPTICAL LAN MODULES REVOLUTIONIZING COMPACT SYSTEM BOOTING ◼ Space-Efficient: World's First M.2 Optical LAN Module Family for compact systems. ◼ High-Speed Transfer: Fast, stable data transfer for higher throughput. ENHANCING HIGH-EFFICIENCY DATA EXCHANGE 10GBE RJ45 LAN MODULE ◼ Industrial-Grade: World's First Industrial-Grade 10GbE LAN Module. ◼ Low-Latency: Real-time data transfer for high-performance applications. Stack 4: Sensing & Comm.

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P30© COPYRIGHT INNODISK CORPORATION GMSL2 CAMERA SERIES RUGGEDIZED LONG-RANGE VISION & CLARITY ◼ IP67/IP69K Ruggedized: Maximum dust, water proof. ◼ 15m Long-Reach: Stable performance over extended distances. ◼ On-board ISP: Superior image quality and professional control. ◼ NVIDIA Jetson & Raspberry Pi Ready: Support for leading AI platforms. REDEFINING THE EDGE AI VISION STANDARD INNODISK VISION SOLUTION: BUNDLE PACKAGE ◼ Unified Hardware Bundle: Pairs GMSL2 camera and capture card for seamless evaluation. ◼ Seamless Integration: Pre-validated design eliminates compatibility friction. ◼ Accelerated Development: Focus directly on vision software and rapid deployment. ◼ Superior Performance: Delivers sharp image quality and stable GMSL2 signal integrity. High-bandwidth, long-range, and low-latency transmission Seamless Integration. Rapid Deployment. Proven Performance MIPI CSI-2 GMSL2USB 2.0 Camera Module Portfolio MIPI over Type-C Capture Card Stack 4: Sensing & Comm.

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P31© COPYRIGHT INNODISK CORPORATION Retail Intelligence Surveillance Intelligence Enterprise & Building Intelligence Industrial Automation Intelligence Business Logic Layer iCAP iVIT innoPPE AccelBrain Service Communication Layer HTTP MQTT CoAP MCP Host Service API Endpoint Layer Device Management AI Engine Multi- Streaming Agentic AI Layer MCP Server Platform Empowerment Layer Driver HW Module Adapter Layer eAPI CANBus Utility SSD SMART Utility SPD Code R/W BSPOS Building INNOVATING IN SOFTWARE. ELEVATING VALUE AT THE EDGE. Stack 5: Software

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P32© COPYRIGHT INNODISK CORPORATION 01 Market & Application Value AI redefines value creation across products, services, and operations, driving unprecedented leaps in industry value. 02 Product Technology & Talent Value Deploying a robust five-layer AI architecture and expert talent to deliver highly compatible, collaborative solutions for diverse global needs. 03 Edge AI Integration & Deployment Value Bridging technology gaps with strong R&D capabilities and global partnerships to connect edge applications and accelerate rapid Edge AI deployment. 3 CORE VALUES: Market & Product Technology

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P33© COPYRIGHT INNODISK CORPORATION Cross-Stack Software Architecture Self-developed cross-stack architecture integrating OS, BSP, drivers, BIOS, middleware, utilities, AI models, and applications for zero porting effort, high integration, and fast deployment. iCAP iVIT AccelBrain Innodisk Middleware SDK (AVL Modules) OS — Ubuntu / Yocto / Android / Windows BSP Driver BIOS Storage, Memory, Communication, Sensing & Peripherals Edge Computing Platform and AI Accelerator Original Silicon Vendor Support & Complete Product Portfolio Partner with global leading storage and memory IC vendors to provide a complete portfolio covering data sensing, storage, computing, transfer, and applications. World-Class Design & Manufacturing ▪ Intel: Reference Kit / Customer Reference Design ▪ NVIDIA: Elite Partner / MGX Partner (Aetina) ▪ Qualcomm: IoT Partner / On-Premise Partner ▪ Global AI ASIC: Design & Manufacturing Services 03 Edge AI Integration & Deployment Value Bridging Tech Gaps to Minimize Client Integration Effort

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P34© COPYRIGHT INNODISK CORPORATION 03 Edge AI Integration & Deployment Value IHV Computing Power Modules Computing Platform AI System ISV AI Model APP OS AI Application System Integrator Distributor Domain Alignment Demand Integration AI Solution End Customer Equipment Stability Long-Term Supply Real-Time Support End-use Scenario Compatibility & Adaptability Gaps Deployment & Empowerment Gaps Trust & Value Gaps Bridging Tech Gaps to Minimize Client Integration Effort

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P35© COPYRIGHT INNODISK CORPORATION IHV Computing Power Modules Computing Platform AI System ISV AI Model APP OS AI Application System Integrator Distributor Domain Alignment Demand Integration AI Solution End Customer Equipment Stability Long-Term Supply Real-Time Support End-use Scenario ◼ Computing & HW Adaptation ◼ Model Porting & SW Compatibility ◼ HAL & API Standardization ◼ High-Integration Solutions ◼ Reference Designs ◼ Standardized Validation ◼ ROI/TCO & Mass Production ◼ Lifecycle Support & Long- Term Supply ◼ Stability & Local Support 03 Edge AI Integration & Deployment Value Bridging Tech Gaps to Minimize Client Integration Effort Bridging Compatibility & Adaptability Gaps Bridging Deployment & Empowerment Gaps Bridging Trust & Value Gaps

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P36© COPYRIGHT INNODISK CORPORATIONINNODISK EDGE AI BUILDING BLOCKS NVIDIA AI ASICIntel Qualcomm AI Peripheral AI Storage / Memory AI PLATFORM AI ACCELERATOR SOFTWARE / FIRMWARE iSeries SoftwareSoftware Tools Device Management Monitoring / OTA / DiagnosticsiCAPCloud AI Platform Inference & Tuning Model Deployment / Training / OptimizationAccelBrain, AccelTune, IQ Studio, iVITAI-Stack SDK Windows, Linux, BSP, eAPI, DriversOS & Middleware Flash DRAM Camera LAN Storage CAN Bus / CAN FD Serial Display Air Sensor / Gas Sensor Wireless Intel Atom x6000 / 7000 Intel Core Ultra Series1 / 2 / 3 Intel Xeon 6 Intel 12 / 13 / 14th Gen Core-i NXP i.MX 8M Plus / 95 NVIDIA Jetson Orin / Thor Qualcomm Dragonwing IQ 9 / 8 / X ARMx86 Runtime & System Support Data Management Sensing & Communication Vision Input / Transmission / Real-Time Control Firmware Customization / Health Monitoring / Encryption & RAID OS Porting / Runtime Support / Pre-Configured System / eAPI Hardware Control / Software Configuration

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P37© COPYRIGHT INNODISK CORPORATION AI Infrastructure ◼ GPU Server / Networking Switch / Router ◼ Humanoid Robot / Autonomous Global Vertical Leaders ◼ Medical / 5G / Surveillance / Entertainment / Automation ◼ Tier-1 Market Leaders High Value-added Industrial Solution Providers ◼ Manufacturing / Retail & Logistic / Smart Energy / Health Care / Communication / Entertainment / Enterprise Market & Application Value Exponential Growth Global Market Leader 4,000+ High-value Customer Base

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P38© COPYRIGHT INNODISK CORPORATION Innodisk R&D and Production Center Construction of Phase 3 Building and Dormitory Phase 3 Phase 2 2024 (In Operation) 2026 Q4 (Scheduled to Break Ground) Phase 1 2018 (In Operation)

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P39© COPYRIGHT INNODISK CORPORATION Innodisk R&D & Manufacturing center Construction of Phase 3 Building and Dormitory Scheduled to Break Ground in 2026 Q4 Phase 3 Phase 2 Phase 1

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P43© COPYRIGHT INNODISK CORPORATION Promote AI solutions with global partners INNODISK AI IN ACTION AI EXPO @Taiwan IT Week @Japan Automate @USA Hardware Pioneer Max @United Kindom

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P45© COPYRIGHT INNODISK CORPORATION ◼ Maintaining a Corporate Governance Evaluation between 6% to 20%. ◼ Approved by the Board of Directors, the company has set its Net Zero Emission Pathway, marking a proactive step toward long-term net-zero transition. ◼ Established the “Sustainability Development & Information Security Committee” to enhance ESG commitment. ◼ Received the EcoVadis Bronze Medal, CommonWealth Sustainability Awards, and the Parenting Family-Friendly Workplace Award, reflecting Innodisk’s well-rounded achievements in sustainability. ACHEIVEMENTS & HIGHLIGHTS Wuweigang Waterbird reserve: Biodiversity Three-Year Project ◼ Partner with local organizations on habitat protection, invasive species removal, and little tern conservation. ◼ Advance ecological monitoring and environmental education to foster a thriving, biodiverse ecosystem with stakeholders. Yue-Ming School: Three-Year Ocean Activists Program ◼ Connect academia and local communities to cultivate future ocean advocates and strengthen social impact. ◼ Build sustainability awareness through school-based conservation workshops and projects. ECOLOGICAL HARMONY 宜鼎國際永續之路

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P47© COPYRIGHT INNODISK CORPORATION 3,028,429 3,807,401 4,806,689 13,182,608 22,443,411 25.9% 32.8% 33.4% 59.1% 65.0% 0% 10% 20% 30% 40% 50% 60% 70% 0 2,500,000 5,000,000 7,500,000 10,000,000 12,500,000 15,000,000 17,500,000 20,000,000 22,500,000 25,000,000 2025Q2 2025Q3 2025Q4 2026Q1 2026Q2 GPMNT$: K Revenues and GPM over last 5 quarters

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P48© COPYRIGHT INNODISK CORPORATION Net Profits and EPS over last 5 quarters NT$:K 185,349 643,038 870,716 5,466,357 10,368,072 2.02 6.87 9.15 57.49 108.93 0.00 5.00 10.00 15.00 20.00 25.00 30.00 35.00 40.00 45.00 50.00 55.00 60.00 65.00 70.00 75.00 80.00 85.00 90.00 95.00 100.00 105.00 110.00 115.00 0 2,000,000 4,000,000 6,000,000 8,000,000 10,000,000 12,000,000 2025Q2 2025Q3 2025Q4 2026Q1 2026Q2 NT$: K EPS: NT$

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P49© COPYRIGHT INNODISK CORPORATION Revenue Breakdown by Product Lines 41% 52% 6% 1% 2025Q2 28% 69% 2%1% 2026Q1 34% 61% 4% 1% 2026Q2 AI Solutions OthersDRAM FLASH DRAM FLASH FLASH FLASH DRAM DRAM

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P50© COPYRIGHT INNODISK CORPORATION Revenue Breakdown by Regions 25 24 27 16 15 13 20 15 20 26 26 16 12 20 22 1 1 0 10 20 30 40 50 60 70 80 90 100 2025Q2 2026Q1 2026Q2 Taiwan Europe America China Asia Others

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P51© COPYRIGHT INNODISK CORPORATION 2026Q2 Operating Results 2026Q2 2026Q1 QoQ 2025Q2 YoY Revenues 22,443,411 13,182,608 70.3% 3,028,429 641.1% Cost of good sold 7,853,799 5,391,251 45.7% 2,243,340 250.1% Gross profit 14,589,612 7,791,357 87.3% 785,089 1758.3% Operation expenses 1,443,892 941,157 53.4% 431,279 234.8% Operation profits 13,145,720 6,850,200 91.9% 353,810 3615.5% Non-operating income and expenses 68,664 66,827 2.7% -126,311 -154.4% Profit before tax 13,214,384 6,917,027 91.0% 227,499 5708.5% Income tax expense 2,808,521 1,439,498 95.1% 53,708 5129.2% Net profits 10,405,863 5,477,529 90.0% 173,791 5887.6% Non-controlling interests 37,791 11,172 238.3% -11,558 -427.0% Net profit attributable to parent company 10,368,072 5,466,357 89.7% 185,349 5493.8% EPS 108.93 57.49 2.02 Gross margin 65.0% 59.1% 25.9% Operating margin 58.6% 52.0% 11.7% Net profit rate 46.4% 41.6% 5.7%

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