Slides
Page 1
Global Family, Global Solutions! 2026/08/04 GlobalWafers (6488TT) Q2 2026 Earnings Call
Page 2
Disclaimer This presentation has been prepared by GlobalWafers Co., Ltd. (the “Company”). This presentation and the materials provided herewith do not constitute an offer to sell or issue or the solicitation of an offer to buy or acquire securities of the Company in any jurisdiction or an inducement to enter into investment activity, nor may it or any part of it form the basis of or be relied on in connection with any contract or commitment whatsoever. Any decision to purchase securities in a proposed offering should be made solely on the basis of the information contained in the offering circular published in relation to such proposed offering, if any. The information contained in this presentation has not been independently verified. No representation, warranty or undertaking, express or implied, is made as to, and no reliance should be placed on, the fairness, accuracy, completeness or correctness of the information or the opinions contained herein. The information contained in this document should be considered in the context of the circumstances prevailing at the time and has not been, and will not be, updated to reflect material developments which may occur after the date of the presentation. None of the Company nor any of its affiliates, advisors or representatives will be liable (in negligence or otherwise) for any loss howsoever arising from any use of this presentation or its contents or otherwise arising in connection with the presentation.
Page 3
© GlobalWafers Co., Ltd. All rights reserved. 01 Executive Comment 3
Page 4
© GlobalWafers Co., Ltd. All rights reserved. 4,112 2,914 4,123 3,140 2,662 3,726 2025 2026 Q1 Q2 Q3 Q4 2025 1H, 26.1% 2026 1H, 20.7% Executive Comments ➢ Financial Highlights 4 Revenue 15,595 13,985 16,008 15,214 14,493 14,502 2025 2026 Q1 Q2 Q3 Q4 60,598 (NT$ Mn) Gross Profit Margin (%) 14,624 (NT$ Mn) Gross Profit Margin (%) • Q226 → NT$15.2 billion, 8.79% QoQ • 1H26 → NT$29.2 billion, -7.60% YoY • Q226 → 20.6% • 1H26 → 20.7% 29,199 6,054
Page 5
© GlobalWafers Co., Ltd. All rights reserved. • Q226 → 9.4% • 1H26 → 9.9% 2,589 1,475 2,438 1,423 1,230 2,379 2025 2026 Q1 Q2 Q3 Q4 Operating Income (%) 2025 1H, 15.9% 2026 1H, 9.9% Executive Comments ➢ Financial Highlights 5 8,636 (NT$ Mn) Operating Income (%) 1,456 1,896 1,682 3,779 1,969 2,205 2025 2026 Q1 Q2 Q3 Q4 2025 1H, 9.9% 2026 1H, 19.4% Net Profit (%) 7,312 (NT$ Mn) Net Profit (%) • Q226 → 24.8% • 1H26 → 19.4% 2,898 5,675
Page 6
© GlobalWafers Co., Ltd. All rights reserved. • Q226 → NT$7.90 • 1H26 → NT$11.87 EPS Executive Comments ➢ Financial Highlights 6 Note: 1. FX Rate: NTD:USD = 31.85, including guarantee (NT$) Prepayment 3.05 3.97 3.52 7.904.12 4.60 2025 2026 Q1 Q2 Q3 Q4 15.29 11.87 • NT$20.8 billion (US$0.66 billion)1
Page 7
© GlobalWafers Co., Ltd. All rights reserved. Executive Comments ➢ Industry & Overview ◼ Improved outlook as AI demand broadens while recovery remains gradual and uneven ✓ AI demand structurally robust – Leading hyperscalers continue to raise their AI-related capex outlooks, supporting visibility into strong demand cycle over the medium term. Rising compute and memory requirements, particularly from agentic AI and greater cloud-edge orchestration, are key drivers of this growth. ✓ Recovery is broadening but remains gradual and uneven – Customer inventory levels are returning to healthier levels, and order visibility is improving across wider range of end markets and applications. AI demand is also broadening beyond advanced nodes and improving conditions in selected mature nodes such as industrial and power, as well as extending to emerging applications (e.g. AI wearables, next-gen communications). ✓ Global supply chain restructuring is reshaping priorities – Customers are placing greater emphasis on supply certainty, regional production and operational resilience as geopolitical uncertainty continues to reshapes supply chains. Procurement criteria are broadening beyond price to include supply stability, localized and low-carbon manufacturing capabilities, product traceability, renewable energy availability, and deeper long-term collaboration. ✓ Technology roadmaps are tightening advanced wafer supply– Continued investments in AI, new packaging technologies and advanced process migration are increasing wafer intensity and qualification requirements. Supply-demand conditions remain tight across selected high-specification products, supported by strong demand and limited number of suppliers capable of producing qualified advanced wafers. 7
Page 8
© GlobalWafers Co., Ltd. All rights reserved. Executive Comments ➢ Industry & Overview ◼ GWC well-positioned to benefit as AI-led growth broadens across end markets ✓ Improving utilization supported by stronger operating momentum – Beyond strong demand for AI and advanced nodes, demand in mature nodes such as industrial and power management has continued to improve. Existing 12-inch wafer lines remain fully utilized, excluding newly added capacity still in the ramping stage. 8-inch wafer lines maintained high utilization with recovery extending gradually to 6-inch wafer lines. ✓ Expansions beginning to bear fruit – GWC has continued to invest in its global capacity expansion strategy in recent years. As new capacity is progressively completed and qualified, the Company is increasingly focused on customer qualification, production ramp-up and operational optimization. Combined with supportive industry fundamentals, these investments enable GWC to capitalize on growth opportunities and further unlock the value of its newer and expanded manufacturing sites. ✓ Comprehensive global manufacturing footprint – GWC’s diversified production network is aligned with customers’ regional expansion plans, strengthening localized supply capabilities and enabling closer, more responsive service across key markets. GWC will continue to flexibly allocate capacity according to customer demand and qualification progress, while enhancing supply stability and operational efficiency through long- term partnerships, including the recently announced strategic collaboration with Micron. ✓ High-value portfolio expansion progressing – Strong demand visibility into advanced and specialty products such as SOI, GaN, 12-inch SiC and square wafers. Most of GWC’s newer sites are catered towards producing higher technology silicon wafer products, positioning the Company for future high-value opportunities. 8
Page 9
© GlobalWafers Co., Ltd. All rights reserved. Semiconductor Application Trends Indicate Structural Support Beyond Cyclical Recovery 9 Compute & AI Infrastructure ⚫ Still early innings of a multi-year AI proliferation, supported by hyperscaler capital expenditure plans that have continued to be revised upwards during this year. ⚫ Leading players continue to invest in advanced-node capacity for future inference and cloud-edge demands, reinforcing sustained long-term demand for leading-edge silicon wafers. ⚫ Agentic AI is broadening data center architectures beyond AI accelerators to include greater CPU content, increasing silicon requirements. Memory Market Smartphone & PC Structurally Robust ⚫ Despite ongoing capacity expansion, supply constraints are expected to persist over the next few years, supported by favorable industry conditions. ⚫ Customers are securing supply through long term agreements, providing stronger visibility into near to medium term wafer demand. ⚫ Rising HBM adoption and increasing memory complexity are driving greater wafer requirements, supporting sustained demand for silicon wafers. Solid Fundamentals ⚫ AI-enabled and premium devices continue to increase semiconductor content per device, supporting demand for higher-value logic, memory, and RF components. ⚫ An aging installed base and the rollout of AI-capable smartphones and PCs are expected to support a multi-year device refresh cycle, reinforcing long-term semiconductor demand. Stabilizing Demand
Page 10
© GlobalWafers Co., Ltd. All rights reserved. Semiconductor Application Trends Indicate Structural Support Beyond Cyclical Recovery (cont'd) 10 Automotive & Industrial ⚫ Demand conditions across power and industrial applications are gradually improving, while automotive semiconductor demand remains mixed as inventories normalize. Rising semiconductor content per vehicle continues to support medium-term demand. ⚫ Growth in ADAS, software-defined vehicles and increasingly intelligent vehicle architectures is driving higher demand for logic, sensors, power and connectivity semiconductors. ⚫ Continued investment in robotics and physical AI represents an additional long-term demand driver for logic, memory, sensors and power devices, supporting broader silicon wafer demand. Advanced Packaging ⚫ Packaging technologies, including CoWoS, CoPoS, Wafer-on-Wafer and HBM stacking, are becoming increasingly critical to AI system performance as chipmakers integrate more dies and components within complex architectures. ⚫ These technologies require multiple wafer layers, tighter specifications and more complex manufacturing process, while lower yields can further increase wafer requirements per system, supporting demand for advanced and specialty wafers. Gradual Recovery with Rising Silicon Content Solid Fundamentals
Page 11
© GlobalWafers Co., Ltd. All rights reserved. 02 Company Overview 11
Page 12
© GlobalWafers Co., Ltd. All rights reserved. AI Infrastructure Investment is Driving Structural Growth In Wafer Demand Top US Hyperscalers’ CAPEX Estimates by Date1 430 542 606 577 686 864 889 974 2026E 2027E 2028E 2029E Dec '25 Jul '26 Worldwide Silicon Wafer Shipments (US$ bn) (Million square inches) Source: Company filings, SEMI Silicon Wafer Shipment Statistics (Jul 2026), FactSet (as of 07/18/2026) Notes: 1. Represents figures for Amazon, Meta, Microsoft, Alphabet and Oracle 12 Rising AI Capex ◼ AI demand remained robust in 2Q 2026, with continued enterprise adoption and broader AI use cases continuing to support capital investment. ◼ Consensus estimates for cumulative hyperscaler AI capex increased by approximately US$1.3 trillion (+58%) for 2026–2029 versus December 2025, reinforcing sustained investment in advanced semiconductor manufacturing. Semiconductor Expansion ◼ Leading semiconductor manufacturers continue expanding advanced logic and HBM manufacturing capacity, reinforcing long-term wafer demand as new production lines progress toward production. ◼ Capacity expansion across the US, Japan, Korea, and Europe reflects manufacturers’ localization strategies and reinforces regional semiconductor manufacturing ecosystems. Sustained Wafer Demand for GWC ◼ AI-driven capacity expansion continues to translate into sustained demand across GWC’s silicon wafer portfolio. ◼ Strong utilization across GWC’s production network reflects healthy customer demand as new capacity ramps. ◼ Long-term customer engagement continues to support visibility into future wafer demand. 2,896 3,327 3,313 3,437 3,275 3,573 1Q25 2Q25 3Q25 4Q25 1Q26 2Q26 9.6% 3.1% 8.0% 13.1% 7.4%YoY growth
Page 13
© GlobalWafers Co., Ltd. All rights reserved. New Applications Are Broadening Demand for Silicon, SOI and Compound-Semiconductor Wafers AI Wearables & Edge ◼ AI inference is expanding to edge devices, increasing demand for low-power sensing, connectivity, power- management technologies, and high-performance edge computing chips. ◼ Growing adoption of SOI, GaN, and SiC, advanced epitaxial wafers, and polished wafers is supporting sensing and MicroLED display applications (e.g., AR glasses). AI Servers & Packaging ◼ Agentic AI is driving broader demand across CPUs, ASICs, GPUs, HBM, and power semiconductors, resulting in higher wafer intensity. ◼ Higher AI power density accelerates adoption of SiC thermal management, GaN power technologies and square panels for advanced packaging. ◼ GaN power device market projected ~$3bn by 2030, ~42% CAGR from 2024. ◼ AI clusters increasingly rely on high-speed optical interconnects, driving structural demand for silicon photonics. ◼ Demand for silicon photonics substrates (Photonics-SOI) is growing rapidly, with a CAGR of over 35%. ◼ Electrification, robotics and industrial automation are accelerating adoption of SiC, GaN power semiconductors and Power-SOI. ◼ Higher-voltage, higher-efficiency systems require next-generation compound semiconductor materials. ◼ SiC power device market projected ~$110bn by 2031, ~20% CAGR from 2025. 13 Source: Yole Group (Oct 2025 and Jun 2026); Kaiso Research (Jun 2026) Next-Gen Communications Electrification & Automation Broader Volume Growth Growing demand for analog, power and industrial semiconductors supports stronger demand for 12-inch, 8-inch and 6-inch wafers Mix Improvement Accelerating adoption of SOI, compound-semiconductor wafers and square wafers supports a higher-value product mix Long Term Growth Broader end-market exposure supports more diversified and sustainable long-term growth Expanding AI Applications Drive Demand for Advanced-Node, Specialty, and Mature-Node Wafers
Page 14
© GlobalWafers Co., Ltd. All rights reserved. GWC’s Local Manufacturing Footprint is Aligned with Customer Capacity Expansion Site Status Ecosystem Capacity Highlights On-going Expansion Sherman, Texas, US ◼ Successfully completed qualification with multiple customers. ◼ Ongoing process optimization. >$600B of announced U.S. expansion by leading semiconductor manufacturers supports localized manufacturing demand St. Peters, Missouri, US ◼ Customer sampling activities are ongoing. ◼ RF-SOI and silicon photonics products have entered small- volume production. >$10B of announced investment by leading semiconductor manufacturers reinforces long-term demand for specialty wafers, including SOI Novara, Italy ◼ Initial customer qualifications are progressing smoothly. ◼ Capacity utilization will be steadily ramped up in line with customer qualification progress and market demand. >$10B of announced investment by leading semiconductor manufacturers supports Europe’s power semiconductor ecosystem Recent Completion Utsunomiya, Japan ◼ Capacity expansion has been successfully completed, with all additional capacity fully in place. ◼ Overall capacity utilization remains at a high level. ◼ Operational and financial performance continue to improve. >$30B of announced investment by leading semiconductor manufacturers supports advanced semiconductor manufacturing in Japan ◼ GWC's global manufacturing footprint is increasingly aligned with customer localization requirements, enabling closer customer collaboration and more resilient regional supply, and greater support for customers’ traceability and sustainability requirements. ◼ Localized manufacturing is strengthening strategic customer relationships, as demonstrated by its recently announced long-term collaboration with Micron in July 2026 to support US wafer supply chain localization. ◼ GWC's expansion investments are beginning to bear fruit, with the focus shifting from fab construction to customer qualification and production ramp-up as new capacity begins contributing to revenue and earnings. 14
Page 15
© GlobalWafers Co., Ltd. All rights reserved. Advanced packaging architectures are increasing wafer consumption per system ◼ Wafer-on-wafer, CoWoS, HBM stacking and silicon interposers require significantly greater silicon area and wafer consumption per end system. HBM structurally increases wafer intensity ◼ Larger die sizes and TSV-enabled 3D stacking require more silicon per unit of memory capacity vs. conventional DRAM. Advanced-node scaling increases wafer complexity and value ◼ The migration from FinFET to Gate-All-Around (GAA) and Backside Power Delivery (BSPDN) requires tighter silicon wafer specifications and manufacturing tolerances. ◼ Growing demand for wafer bonding is creating new requirements for specialized silicon wafer parameters. Advanced-node migration is lifting wafer value ◼ Advanced-node manufacturing requires silicon wafers with higher purity, greater flatness, tighter defect control, and other specialized specifications, increasing the value of high-specification wafers. Semiconductor Technology Roadmaps Are Increasing Silicon Wafer Content and Value More silicon usage per GB HBM DRAM Silicon wafer products required for advanced-node manufacturing command significantly higher value than those used in mature-node manufacturing. Representative AI accelerator architecture: 2.5D and 3D multi-die packaging require greater silicon area per device than traditional monolithic designs, increasing overall silicon wafer consumption As demand for new metrology and manufacturing equipment grows, academia collaboration, supplier co-development, and in-house R&D advance in parallel. Select areas of technology transitions Example 15 GWC’s differentiated technology portfolio is aligned with evolving semiconductor technology roadmaps ◼ Driven by continued growth in silicon photonics demand, SOI production continues to ramp up, with demand exceeding supply. 12-inch SOI ◼ Capacity remains fully utilized with expansion progressing (~30% completed, ~20% underway). GaN ◼ 12-inch SiC qualification is progressing with multiple customers, supporting future commercialization. SiC ◼ Qualification activities with multiple customers are progressing smoothly. Square wafers
Page 16
© GlobalWafers Co., Ltd. All rights reserved. 03 Financial Performance 16
Page 17
© GlobalWafers Co., Ltd. All rights reserved. Financial Highlight : Q226 vs. Q126 vs. Q225 (NT$ Mn, except EPS) Q226 Q126 Q225 QoQ YoY Revenue 15,214 13,985 16,008 8.8% -5.0% Gross Profit % 20.6% 20.8% 25.8% -0.2p.p. -5.2p.p. Operating Income 1,423 1,475 2,438 -3.6% -41.6% Operating Income % 9.4% 10.5% 15.2% -1.1p.p. -5.8p.p. Net Profit 3,779 1,896 1,682 99.3% 124.7% Net Profit % 24.8% 13.6% 10.5% 11.2p.p. 14.3p.p. EPS1 NT$7.90 NT$3.97 NT$3.52 NT$3.93 NT$4.38 EBITDA2 6,969 4,060 4,472 71.6% 55.9% EBITDA % 45.8% 29.0% 27.9% 16.8p.p. 17.9p.p. EBIT3 4,556 1,855 2,027 145.5% 124.8% ROE4 (annualized) 15.9% 8.1% 7.6% 7.8p.p. 8.3p.p. ROA5 (annualized) 8.15% 4.17% 3.40% 3.9p.p. 4.7p.p. Capex6 2,202 3,460 7,537 - - Depreciation 2,408 2,199 2,440 - - Note: 1. EPS = Net Profit Attributable To The Shareholders of The Company / Weighted -average Number of Ordinary Shares Outstanding Durin g The Period 2. EBITDA = Net Profit + Tax + Interests + Depreciation + Amortization 3. EBIT = Net Profit + Tax + interests 4. ROE = Net Profit / Average Shareholders Equity 5. ROA = (Net Profit + Interest*(1- Effective Tax Rate)) / Average Asset 6. Capex = Ending Acquisition of property, plant and equipment, and prepayments of equipment - Beginning Acquisition of property, plant and equipment, and prepayments of equipment 17
Page 18
© GlobalWafers Co., Ltd. All rights reserved. (NT$ Mn, except EPS) 1H26 1H25 YoY Revenue 29,199 31,602 -7.6% Gross Profit % 20.7% 26.1% -5.4p.p. Operating Income 2,898 5,027 -42.4% Operating Income % 9.9% 15.9% -6.0p.p. Net Profit 5,675 3,138 80.9% Net Profit % 19.4% 9.9% 9.5p.p. EPS1 NT$11.87 NT$6.56 NT$5.31 EBITDA2 11,029 8,505 29.7% EBITDA % 37.8% 26.9% 10.9p.p. EBIT3 6,411 3,804 68.5% ROE4 (annualized) 11.9% 7.1% 4.8p.p. ROA5 (annualized) 6.05% 3.2% 2.9p.p. Capex6 5,662 19,094 - Depreciation 4,607 4,689 - Financial Highlight : 1H26 vs. 1H25 18 Note: 1. EPS = Net Profit Attributable To The Shareholders of The Company / Weighted -average Number of Ordinary Shares Outstanding Durin g The Period 2. EBITDA = Net Profit + Tax + Interests + Depreciation + Amortization 3. EBIT = Net Profit + Tax + interests 4. ROE = Net Profit / Average Shareholders Equity 5. ROA = (Net Profit + Interest*(1- Effective Tax Rate)) / Average Asset 6. Capex = Ending Acquisition of property, plant and equipment, and prepayments of equipment - Beginning Acquisition of property, plant and equipment, and prepayments of equipment
Page 19
© GlobalWafers Co., Ltd. All rights reserved. Income Statement (NT$ Mn) 2025 Q126 Q226 1H26 1H26 (simulated)1 Revenue 60,598 13,985 15,214 29,199 27,502 YoY Growth (%) -3.2% -3.6% 8.8%2 -7.6% - Gross Profit 14,624 2,914 3,140 6,054 8,918 Gross Profit Margin (%) 24.1% 20.8% 20.6%3 20.7%4 32.4% EBITDA 17,340 4,060 6,969 11,029 10,433 EBITDA Margin (%) 28.6% 29.0% 45.8% 37.8% 37.9% Operating Income 8,636 1,475 1,423 2,898 6,214 Operating Profit Margin (%) 14.3% 10.5% 9.4% 9.9% 22.6% Profit before Tax 9,516 2,347 4,5855 6,932 6,825 Profit before Tax Margin (%) 15.7% 16.8% 30.1% 23.7% 24.8% Net Profit 7,312 1,896 3,7795 5,675 5,384 Net Profit Margin (%) 12.1% 13.6% 24.8% 19.4% 19.6% EPS (NT$) 15.29 3.97 7.905 11.87 11.26 19 Note: 1. Simulated figures exclude impacts from major expansions in the U.S., Italy, and Japan, as well as mark-to-market changes on Siltronic shares 2. Quarter-over-quarter (QoQ) for 2Q26 revenue growth 3. Q226 Gross Profit Margin remained broadly stable QoQ despite revenue growth, mainly reflecting higher depreciation, compensation accruals and cost pressures from freight, and energy expenses. 4. 1H26 Gross Profit Margin declined YoY, mainly reflecting higher depreciation and other expansion-related costs. 5. Q226 Profit before Tax, Net Profit, and EPS increased QoQ, mainly from mark -to-market gains on Siltronic shares
Page 20
© GlobalWafers Co., Ltd. All rights reserved. Balance Sheet Note: 1. The balance of short-term loans comprises short-term borrowings, commercial paper payable, and the current portions of long -term borrowings, corporate bonds payable, and convertible bonds payable 2. The balance of long-term loans includes long-term borrowings, corporate bonds payable, and exchangeable bonds payable 3. Q226 Inventories increased QoQ, mainly due to inventory build -up in preparation for anticipated demand in H2. 4. Q226 Short-term and long-term loans increased QoQ, mainly reflecting global liquidity management and funding needs f or operations and expansion. (NT$ Mn) 2024 2025 Q126 Q226 Assets Cash and cash equivalents 38,929 19,484 24,128 23,776 Account receivable 10,265 10,113 10,138 10,548 Inventories 11,238 10,399 11,000 12,0153 Property, plant and equipment 119,074 107,241 108,861 107,864 Other assets 45,074 71,105 56,910 65,017 Total assets 224,581 218,343 211,037 219,220 Liabilities Short-term loan1 28,797 31,010 33,887 38,2824 Account payable 5,371 4,161 3,867 4,697 Long term loan2 37,678 43,244 29,221 33,1884 Other liabilities 61,706 46,632 50,683 46,333 Total liabilities 133,553 125,048 117,657 122,500 Shareholder equity 91,028 93,295 93,379 96,720 (NT$ Mn) Q226 Deposits in banks held for three months or more 4,768 Restricted Cash 18,019 Note 6,338 Cash-related other assets include: 20
Page 21
© GlobalWafers Co., Ltd. All rights reserved. 04 ESG 21
Page 22
© GlobalWafers Co., Ltd. All rights reserved. Sustainable Environment – SBTi 22 Science-Based Emissions Targets & Decarbonization Strategy ◼ GlobalWafers’ near- and long-term emissions reduction targets were validated by the SBTi in May 2026, advancing its journey toward net zero by 2050. The Company is accelerating decarbonization through operational improvements, renewable energy expansion, and supplier engagement to support lower-carbon and more traceable supply chains. Scope Near-term Target (2035) Long-term Target (2050) Scope 1 & 2 (2022 base year) 63% reduction 90% reduction Scope 3 (2024 base year) 37.5% reduction (Categories 1–3) 90% reduction (all categories) Net-zero emissions across the entire value chain by 2050 Process & Equipment Optimization Expand Renewable Energy Adoption Supplier Carbon Footprint Assessments SBTi Engagement with Key Suppliers
Page 23
© GlobalWafers Co., Ltd. All rights reserved. Sustainable Environment – GHG & Electricity ◼ Electricity Consumption: Total electricity consumption remained broadly stable at 1.15 million MWh in 2025, while electricity consumption intensity was maintained at 0.019, demonstrating the Company's continued focus on operational efficiency amid global business expansion. ◼ GHG Emissions: Scope 1 and Scope 2 GHG emissions totaled approximately 542 thousand tons CO₂e in 2025, with emissions intensity remaining stable at 0.009, reflecting ongoing progress in emissions management and the Company's long- term decarbonization strategy. GHG Emissions & Intensity2 (Scope 1&2), 2021-2025 23 887,199 1,172,109 1,125,082 1,178,518 Electricity Consumption & Intensity1, 2021-2025 335,151 320,703 298,847 319,771 293,356 852,048 851,406 826,235 858,747 858,042 0.019 0.017 0.016 0.019 0.019 0 0.01 0.02 0.03 0 300,000 600,000 900,000 1,200,000 2021 2022 2023 2024 2025 Taiwan Offshore Electricity Consumption Intensity (MWh) 19,168 23,940 22,150 21,612 24,437 581,555 521,309 516,902 524,348 517,469 0.010 0.008 0.008 0.009 0.009 0 0.01 0.02 0 100,000 200,000 300,000 400,000 500,000 600,000 700,000 2021 2022 2023 2024 2025 (ton CO2e) 1,151,399 Note: 1. Electricity Consumption Intensity = MWh / Consolidated revenues (NTD thousands). 2. GHG Emissions Intensity = ton CO 2e / Consolidated revenues (NTD thousands). Scope 1 CO2e Scope 2 CO2e GHG Emissions Intensity 541,906545,960539,052545,249 600,723
Page 24
© GlobalWafers Co., Ltd. All rights reserved. 3,883 2,484 2,654 2,288 0 1,000 2,000 3,000 4,000 5,000 2019 2023 2024 2025 Sustainable Environment – Water ◼ Water Consumption: Total water consumption decreased to 2,288 megaliters in 2025, down 13.8% year-on-year and approximately 41% compared with 2019, reflecting the Company’s continued efforts in water conservation and process efficiency. ◼ Water Recycling: Recycled water volume remained at a high level of 6,882 megaliters in 2025. Taiwan’s water recycling rate continued its upward trend in recent years, reaching 60.2% in 2025—the highest level in recent years—reflecting the Company’s continued efforts to enhance water reuse and advance circular economy practices. Water Consumption Quantity, 2019-2025 24 (megaliters) Water Recycle, 2019-2025 5,257 5,154 7,268 6,882 12.2% 16.8% 20.0% 19.2% 52.1% 45.2% 59.3% 60.2% 0% 20% 40% 60% 80% 100% 0 2,000 4,000 6,000 8,000 2019 2023 2024 2025 Recycled Water Quantity Offshore Water Recycling Rate Taiwan Water Recycling Rate (megaliters) …… ……
Page 25
© GlobalWafers Co., Ltd. All rights reserved. Sustainable Environment – Waste ◼ Waste Generation: Total waste generation remained broadly stable at approximately 29.9 thousand tons in 2025, while waste intensity was maintained below the 2021 level, reflecting the Company’s continued focus on waste reduction and operational efficiency. ◼ Waste Reuse: The waste reuse rate increased for the third consecutive year to 91.5% in 2025, the highest level in recent years, demonstrating continued progress in resource recycling, waste reuse, and the Company’s broader circular economy practices. Waste Reuse, 2021-2025 25 Waste Quantity & Waste Intensity1, 2021-2025 30,449 30,768 28,163 27,038 27,302 86.1% 81.2% 81.5% 90.5% 91.5% 0% 20% 40% 60% 80% 100% 0 10,000 20,000 30,000 40,000 2021 2022 2023 2024 2025 (ton) 35,365 37,887 34,566 29,872 29,828 0.579 0.539 0.489 0.477 0.492 0% 20% 40% 60% 80% 100% 0 10,000 20,000 30,000 40,000 2021 2022 2023 2024 2025 (ton) Note: 1. Waste Intensity = ton / Consolidated revenues (NTD thousands).
Page 26
© GlobalWafers Co., Ltd. All rights reserved. Biodiversity in Action: Protecting Marine and Urban Ecosystems ◼ GlobalWafers integrates biodiversity considerations into its environmental management and advances locally relevant actions across marine and urban ecosystems. These initiatives reflect the Company’s ongoing efforts to protect habitats, strengthen ecological resilience, and support long-term biodiversity conservation. 26 ◼ Through a three-year partnership with Ogyre, GlobalWafers’ Italian subsidiary supports local fishing communities in removing marine debris across Italy, Brazil, Indonesia, and Senegal. ◼ The initiative helps reduce pressure on marine habitats while supporting healthier and more resilient coastal ecosystems. Marine Ecosystem Protection Urban Biodiversity Initiatives 7,011 kg of marine and coastal waste recovered 3 Urban Green Spaces ◼ Since January 2026, GlobalWafers’ Italian subsidia ry SPA has supported the management of three urban green spaces through the municipality-led “Novara City in Green” initiative. ◼ The project helps create pollinator-friendly habitats , strengthening urban biodiversity and ecological resilience.
Page 27
© GlobalWafers Co., Ltd. All rights reserved. Top 100 domestic patent applicant (5th year) Achieved TIPS AA Certification (6th year) Hsinchu Science Park R&D Accomplishment Award ESG Highlights: Corporate Governance ◼ GlobalWafers continues to earn external recognition for its strong corporate governance practices. The Company ranked in the Top 5% of the TPEx Corporate Governance Evaluation for the 8th consecutive year and remained a constituent of the FTSE4Good Index Series for the 4th consecutive year. ◼ GlobalWafers also continues to strengthen its innovation and intellectual property capabilities. The Group held 2,737 active patents in 2025, covering 1st- to 3rd-generation semiconductor technologies, and ranked among Taiwan’s Top 100 domestic patent applicants for the 5th consecutive year, while achieving TIPS AA Certification for the 6th consecutive year. Active Patents (Group Total, 2021–2025) 27 Corporate Governance Achievements 1,130 1,262 1,403 1,621 1,808 576 737 907 937 929 0 500 1,000 1,500 2,000 2,500 3,000 2021 2022 2023 2024 2025 Granted Pending(items) 1,706 1,999 2,310 2,558 Top 5% in TPEx Governance (8th year) FTSE4Good Index Series (4th year) 2,737
Page 28
© GlobalWafers Co., Ltd. All rights reserved. Global Community Engagement in 2026 ◼ Across Asia, Europe, and the Americas, GlobalWafers supports local communities through charitable giving, employee volunteering, STEM education, and community outreach, creating positive social impact in the regions where it operates. Together, these initiatives strengthen community connections, support local needs, and contribute to more inclusive and resilient communities. 28 Community Initiatives in 2026 Across Our Global Footprint Europe Care & Giving ◼ Supported a children’s cancer foundation. ◼ Donated toys to children in need. Americas Inspiring Future Talent ◼ Supported Science, Technology, Engineering, and Mathematics (STEM) career development. ◼ Built a network connecting women professionals across industries. Asia Community in Action ◼ Volunteered at a children’s welfare center. ◼ Co-organized a blood donation drive.
Page 29
© GlobalWafers Co., Ltd. All rights reserved. 05 Q&A 29