Slides
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SynPower Co., Ltd. 2026 Semiconductor Industry Summit 2026.09.01
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Disclaimer This presentation and the related information have been prepared based on the information currently available to the Company, its operating conditions, and the prevailing market environment. The content is provided for investors’ reference only and does not constitute any guarantee of future operating results, financial performance, or stock price performance. 1 Certain statements contained in this presentation may constitute forward-looking statements, including but not limited to statements regarding future outlook, business direction, product development, and market trends. Such statements may be affected by market demand, industry competition, changes in laws and regulations, foreign exchange fluctuations, macroeconomic conditions, and other factors beyond the Company’s control. Actual results may differ from the Company’s expectations. The Company does not provide financial forecasts and will not comment on specific customers, order amounts, gross margins, or any information that has not been publicly disclosed. All financial and operating information shall be based on the information officially announced by the Company in accordance with applicable laws and regulations. No part of this presentation may be reproduced, quoted, distributed, or used for any other purpose without the prior written consent of the Company.
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2 Smart Manufacturing Integration Services Focusing on PCB, semiconductor substrate, and advanced packaging applications , SynPower integrates wet process, inspection, and machine vision equipment technologies to provide smart manufacturing solutions. Taoyuan Headquarters SynTop Technology Chipboard Technology Founded 2002 TWSE Listed 6658 Paid-in Capital* US$11.2M Group Employees 320+ Group Subsidiaries SynTop Horizontal wet process equipment Chipboard PCB surface treatment processing services SynPower at glace *Note: Equivalent to NT$364M at NT$32.454/US$1 as of Jul. 30, 2026.
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3 Operating Footprint & Service Network Bangkok, ThailandChennai, India Kunshan Dongguan Taoyuan CHINA INDIA THAILAND Kaohsiung North China Service Center East China Service Center Close to Demand, Local Support Service locations across Taiwan, China, Thailand, and India provide responsive, localized technical support tailored to customer needs. 4-Market Service Network More than half of our employees are dedicated to application engineering, field service, and customer technical support, strengthening equipment deployment, process integration, and after-sales service. 50%+ Engineering & Technical Workforce
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4 Core Products & Smart Manufacturing Solutions Machine Vision Applications Smart Production & Energy Efficiency Advanced Wet Process PCB Equipment • AOI / AVI Inspection Systems • Japanese Optical Inspection Equipment Integration • Multi-function Substrate Orientation Inspection System • Automated Line Width / Spacing Measurement System Semiconductor Equipment • Automated Optical Inspection System • Semiconductor Carrier Metrology System • Glass / Silicon Interposer AOI System • Keyence Automation Solutions • Packaging Automation Inspection Equipment PCB Equipment • Horizontal Wet Process Lines for Substrates • Thin ENEPIG Chemical Solutions and Processing Services • Online Chemical Analysis System • Glass Substrate Project Development with ITRI • Insoluble Anodes Semiconductor Equipment • Fully Automated Batch Cleaning System • Fully Automated Single-wafer Cleaning System • Chemical Supply System • Vapor Two-fluid Cleaning System Smart Production • Image AI Inspection • 2D Code Traceability System • AI Behavior Detection System • Facility Intelligence System • Data and Image AI Applications Energy Efficiency • Low-temperature Energy-saving Blower • Explosion-proof Energy-saving Plenum Fan • Chillers: Magnetic Bearing / Screw-type Central Air Conditioning • Centralized Energy-saving Control System
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5 映利科技 頎晶科技 Chipboard Technology | Advanced Surface Treatment Process Platform Building on PCB surface treatment expertise, we continue to expand into high-end substrates, new materials, and advanced process applications. Diverse Processes & Mass Production Capability Covers electroless nickel-gold, nickel-palladium-gold, chemical silver and other surface treatment processes, supported by flexible production line configurations and scalable mass production capabilities. Multi-Process Flexible Production Scalable Manufacturing Precision Inspection & Process Validation Equipped with dedicated X-ray coating thickness inspection, combined with chemical analysis and process validation to support high-reliability requirements. X-ray Coating Thickness Inspection Chemical Analysis Process Validation Application Expansion & Customization Capability Applications cover PCB, substrates, and glass substrates, with dedicated fixtures and process adaptation capabilities. Management Systems & Environmental Governance ISO 9001 and ISO 14001 management systems are continuously maintained, with experience in IATF 16949 implementation, supported by cleanroom inspection and environmental management capabilities. ISO 9001 ISO 14001 Class 10,000 Wastewater Treatment Precious Metal Recycling Future Growth Directions 01 High-End Substrates Increase the share of high-end substrate and high-reliability product applications. 02 Glass Substrates & New Materials Expand into glass substrates, new materials, and related surface treatment processes. 03 Independent Growth & Capital Market Development Enhance operating scale and earnings quality to build a solid foundation for long-term capital market development. PCB Substrates Glass Substrates Custom Fixtures
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01｜Horizontal Wet Process Equipment 6 Centered on horizontal wet process equipment, integrating equipment design, customized engineering, and smart manufacturing capabilities to continuously expand into high-end PCB, IC substrate, and semiconductor-related process applications. Covers various equipment for pre-/post-treatment, cleaning, etching, and other wet processes, with integrated equipment design, manufacturing, and process application capabilities. 02｜Customized Engineering & Equipment Upgrades Provides customized equipment modules and functions based on product and process requirements, with capabilities in legacy line modification, equipment upgrades, and process improvement. 03 | Process Monitoring & Smart Integration Integrates chemical analysis, process monitoring, and smart manufacturing technologies to enhance equipment management and overall process integration. Application Expansion SynTop Technology | Horizontal Wet Process Equipment Solutions
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7 SynPower × Brooks | Global Collaboration in Semiconductor Carrier Inspection Building on FOUP smart inspection and metrology technologies, the partnership expands semiconductor front-end equipment applications through joint specification development, technology licensing, and global commercialization. ⚫ Global semiconductor customer base ⚫ Sales and service network ⚫ Equipment deployment and after-sales support ⚫ Global market expansion capabilities 01｜Joint Specification Development Continuously optimize inspection items and automation processes based on fab requirements. 02｜Technology Licensing Partnership Establish a long-term technology partnership to support product deployment and market expansion. 03｜Strengthening Technology Barriers Build patent protection around related inspection technologies to enhance product differentiation and technical barriers. R&D and Technology Licensing BrooksSynPower Core Inspection Technologies ⚫ Optical / Vision Inspection ⚫ AI-Assisted Defect Review ⚫ Automation Equipment Integration ⚫ Wafer Carrier Metrology Global Sales Network Strategic Collaboration Benefits Deeper Semiconductor Market Penetration Extend SynPower’s PCB and substrate inspection capabilities into front-end semiconductor wafer carrier applications. International Customer Expansion Leverage Brooks’ global customer and service network to increase opportunities for overseas market adoption. Enhanced Technology Competitiveness Strengthen product differentiation and technical barriers through joint specification development and patent strategy.
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8 Glass Substrate AOI Inspection Solution Targeting Advanced Packaging Applications including Glass Core, TGV and RDL Advanced Packaging Applications 2D + 3DHigh-Precision Inspection Targeting inspection needs for Glass Core / TGV / RDL 0.25 μm/pixel high-resolution imaging capability Defect inspection and dimensional metrology Supports 2D / 3D automated optical inspection and metrology for glass substrates Target Applications Glass Substrate Surface defect inspection TGV Via geometry and defect inspection RDL Circuit pattern and defect inspection ⚫ Automated loading and unloading to improve production inspection efficiency ⚫ Stable image acquisition to enhance inspection accuracy ⚫ Large-area image stitching for full-substrate inspection ⚫ Multi-angle imaging to improve micro-defect detection capability Production-Ready Design Supports automated, double-sided and high- throughput inspection Alpha WFI-20
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9 Q&A Session
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Thank You for Your Attention 10