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Aehr Test Confidential Setting the Test Standard for TomorrowSetting the Test Standard for TomorrowJanuary 2026Nasdaq: AEHR
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2 lWorldwide leader in wafer-level test and burn-in systems lUnique full-wafer test and burn-in systems and contactors lTechnology leader in massively parallel and high-power test and burn-in systems Aehr Test Systems Company OverviewSemiconductor Test & Burn-in for over 45 Years! High Power Multi-WaferTest & Burn-In System XP Single Wafer SteppingTest & Burn-In System CP High PowerTest & Burn-In System Medium PowerTest & Burn-In System
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3 Aehr Manufacturing Capacity lState-of-the-art manufacturing facility located in Fremont, CAl50,000+ sq. foot facilitylPower and Infrastructure to support up to 400 wafers (tester Blades) and WaferPaks for Wafer Level Burn-in and 20 Packaged-Part Burn-in Systems per monthlManufacturing capabilities and quality control procedures have passed rigorous Tier 1 customer qualification processes
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4 Aehr Fremont Production Floor
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5 Aehr Test Systems Market Drivers lArtificial Intelligence Processors and Processing Infrastructure driving explosive spend in data center processing, edge processors, communication infrastructure, and power conversion infrastructure which drives AI processors, memory, data storage, Silicon Photonics I/O, and power conversion semiconductors like Silicon Carbide & Gallium NitridelElectric Vehicle & Electrification of Transportation Infrastructure driving motor control, charging infrastructure, and power conversion using Silicon Carbide & Gallium Nitride semiconductors lElectrification of the World’s Power Infrastructure and Shift to Clean Energydriving efficient and economical electrical power conversion using Silicon Carbide & Gallium Nitride semiconductors lData Center Infrastructure and unstoppable growth in Data Storage driving Silicon Photonics, Flash Memory Solid State Data Storage, and new Photonics Assisted Hard Disk Drive StoragelWorldwide 5G Infrastructure build out using Silicon Photonics fiber optic transceivers and new Optical Network SwitcheslHeterogeneous Integration of semiconductors and 3D fabrication and stacking driving technology and cost roadmaps pushing known good die with test and burn-in of device in wafer form prior to packaging Need for cost-efficient wafer level, singulated die, and packaged part burn-in, stabilization, & testing is creating significant revenue opportunities for Aehr Test in the following key markets:
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6 Worldwide Customer Base (Partial Customer List) Aehr has been a leader in burn-in test solutions for over 45 years with thousands of systems shipped worldwide Aehr Test Headquarters,Fremont California
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7 AI Processor Wafer Level vs Package Burn-in FlowPackaged Part Burn-In Test Flow Wafer Level Burn-In Test Flow – High Quality Bare Die Aehr FOX-XP Wafer TestPackagingPkg Test 1Package Burn-InPkg Test 2SLT Wafer Burn-In Wafer TestPackagingPkg TestSLT Aehr Sonoma
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8 FOX - XP WaferPaks lHouses the wafer and distributes signals and power to the wafer itselflThe WaferPak contactor is capable of over 50,000 contacts in a single touchdown on up to 300mm waferslConsumable input into the test system driving recurring revenue from the installed base CONTACTOR Proprietary Wafer Level Enabling TechnologylAehr’s FOX-XP is capable of both functional burn-in and test solutions – leverages proprietary aligner and contactor technologylMulti-wafer technology enables customers to achieve an overall decrease in test equipment cost and fab footprint – while increasing die yield and throughput lIntegral piece of test cell as it loads the wafer in the WaferPak at immense levels of precisionlBy perfectly setting the wafer in a cartridge it ensures perfect contact lPerforms wafer alignment “offline” which eliminates the need for one wafer prober per wafer during long burn-in and test times FOX WaferPak Aligner ALIGNER FOX - XP Multi - Wafer Test SystemlMay be configured with up to 18 Blades, enabling 18 wafers to be tested in parallel – driving cost efficiency and throughputlHigh performance thermal chucks allow uniform temperature control of the waferslFootprint similar to single wafer automated test equipment – reducing lab test space MULTI - WAFER TESTER
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9 Aehr Wafer Level Test & Burn-in PatentslWaferPak temperature control methodslVacuum & pressure-based WaferPakslMaintaining probe contact over temperaturelElectrical components in WaferPaklIndividual DUT power supplieslPer Die Current ProtectionlRedundant power supplieslPortable WaferPaksl And more . . .
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10 FOX-XP Multi-Wafer Production Test & Burn-In Systeml9 / 18 wafer system high volume productionlFOX-P blades configurable with same resource options as FOX-NP and FOX-CP blades lDelivers up to 2,048 independent universal channels or 1,024 High current or high voltage channels per bladelDelivers and dissipates up to 3.5kW of power and up to 4,000 amps to and from the waferlUses FOX compatible WaferPakslUp to 50,000 pin “probe cards”lVery high compliance micro pogo pins and/or MEMS capabilitylTest & burn-in temperatures to 150ClOffline wafer alignment via Aehr proprietary WaferPak aligners FOX WaferPaks FOX-XP 18 Wafer Test & Burn-In System
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11 FOX-XP with 18 Blades
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12 FOX Fully Automated WaferPak AlignerlFully integrated with FOX-XP System lAvailable in stand-alone configurationlProvides customers fully hands-free operation up to lights out SECS/GEM factory automation and integrationlConfigurable for 300mm to 100mm wafers using industry standard load portslOptical wafer to WaferPak alignment up to 150C test/burn-in temperaturesFOX-XP with Integrated WaferPak Aligner (Configured for 300mm AI Processor Wafers)
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13 FOX-XP with Integrated WaferPak Aligners Floorplan 360 Wafer Capacity Footprint with full SECS/GEM E84 Automation
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14 FOX-NP NPI and Engineering Test & Burn-In SystemlDual wafer system for new product introduction, engineering and low volume productionlFOX-P blades configurable with same resource options as FOX-XP and FOX-CP blades up to 3.5 kW per bladelDelivers up to 2,048 independent universal channels or 1,024 high current or high voltage channels per bladelIntegrated standard 20C to 150C thermal control unitlSmall lab footprintlExcellent for program development, process monitoring, new product introduction, stress test, HALT, HTOL, and low volume production test and burn-inlUses FOX compatible WaferPakslUp to 50,000 pin “probe cards”lVery high compliance micro pogo pins and/or MEMS capabilitylOffline wafer alignment via Aehr proprietary WaferPak alignerslUses FOX compatible DiePakslSingulated die, modules, or packageslExceptional thermal density performance and uniformity via conductive thermal transfer to thermal plates FOX-NP Dual Wafer Test & Burn-In System FOX WaferPak & DiePak Contactors
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15 FOX WaferPak Contactor lExtremely simple contactor “Probe Card”lNo backside stiffener lNo interposer required lNo expensive tester interconnectslSimple per-pin repairabilitylEasy to manufacture in high volumelEnabling architecture for low cost of testlOne aligner shared across many wafer positionslSupports stepping across wafer for high die count wafersl“Rugged” design allows movement of aligned wafers lAllows wide test temperatures after alignment (single probe mark)lEnabling architecture for small footprintlAllows high density stacking (18 wafers in a single column)lFull functional tester and interface within a 3.4” pitchlConductive thermal chuck per position within 3.4” pitch FOX WaferPak Contactor Manual Insertion into FOX-XP
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16 !"#$%&'(F"*' Burn-in Testing – The Bathtub CurvelProduction Burn-in: semiconductor components are subjected to elevated voltages and temperatures for a duration of time (2 – 48 hours) to screen for reliability and early failure in production before shipping to customerslReliability Qualification Burn-in: semiconductor components subjected to elevated voltage and temperatures for 1000 hours to validate and meet industry standards for long term reliability via High Temperature Operating Life (HTOL) tests Decreasing Failure RateConstant Failure RateIncreasing Failure Rate Early “Infant Mortality” Failure Wear-Out Failures TimeHours, Days, or Months Months or YearsYears or Decades Production Screening / Burn-in Reliability Qualification / Burn-in } }
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17 AI Accelerator/Processor PPBI MomentumlHigh-power packaged part test & burn-in for production, reliability qualification, and life-time testslUp to 88 processors with independent test resources and high-power liquid cooling per devicelQualification and Production configurationslShipping in volume with multiple systems installed at most test houses todayHigh Power Test & Burn-in System
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18 AI Accelerator/Processor PPBI MomentumlAehr Sonoma platform has the largest installed base of ultra-high-power burn-in systems for High Temperature Operating Life (HTOL) used for AI processors at test houses around the world.lSuccessfully captured the production system capacity needs from one of the largest Hyperscalers in the world on the first AI Accelerator that they are doing production burn-in screening on. They have purchased a significant number of Sonoma systems, already installed in Asia at a leading test contract manufacturer, and are forecasting a very large number of systems for shipment in the next 6-9 months. lRecently won multiple new HTOL reliability burn-in deals for AI processors to be used at world leading test houses that have Aehr Sonoma systems and plan to order additional systems. lOne of these HTOL applications is already slated for production burn-in that will drive large numbers of systems in Asia at test houses and Aehr has the inside lane to capture this businessHigh Power Test & Burn-in System
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19 Sonoma with Automated Loader / Unloader
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20 AI Accelerator/Processor WLTBI MomentumlAehr worked with and successfully captured the first production orders from an AI Accelerator company to move their AI processor system level test and burn-in to wafer level on the Aehr FOX-XP system. Recently announced production capacity to drive incremental systems and WaferPaks and also move to fully automated 300mm wafer handlinglAnnounced paid-for production WLBI evaluation from a leading AI processor supplier which is currently in development with results expected during the next few months lTwo additional potential customers have approached Aehr to demonstrate WLBI on their AI accelerator processorslRecently announced partnership with ISE/ASE the worlds largest semiconductor Out-Sourced Assembly and Test House (OSAT) to comarket and proliferate WLBI for AI processors High Power Multi-WaferTest & Burn-In System(Shown with Integrated WaferPak Aligner) XP
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21 AI Accelerator Example of Multi-Chip Packaging lMultiple Compute Chipletsl8 12-Die HBM3 DRAM StackslSingle OAM SubstratelRoadmap for new Chiplet Architecture Accelerators each year from 2023 to 2026l8 MI325X Cluster: AMD Instinct™ MI325X Accelerator
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22 Optical I/O is Coming…l“TSMC silicon photonics tech first co-package optics (CPO) samples ready for NVIDIA, Broadcom in 2025” – Tweaktown, December 2024 lAyar Labs CEO: Optical Chiplets Coming to SOCs Soon – HPCwire, Oct 2024l“Intel’s 4 TB/s Integrated Optical I/O Chiplet Called ‘Important Milestone’” – inside HPC, June 2024 l“Optical communication is a key area that we think is very, very important for us to reach anything like zettascale type of computing capability.” “AMD is working with DARPA on packaging optics solutions into chips” – Dr. Lisa Su, CEO, AMD March 2023 (HPCwire)l“Performance metrics in applications like machine learning could ultimately pave the way for high-density integration and optical I/O to connect GPUs.” – Vivek Raghuraman, Director of R&D, Broadcom, March 2023l“In-package optical I/O technology to accelerate data movement and enable future AI” – Yole Group, April 2023
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23 Flash Memory WLTBI OpportunitylAehr has been engaged with multiple Flash memory companies related to our FOX wafer level test and burn-in systems for their high-volume productionlAehr recently completed the first phase showing full-wafer contact and test/burn-in of their 300mm NAND flash wafer used to evaluate the FOX-XP system with our proprietary WaferPak full wafer contactors for their new HBF flash devices in productionlThis application is for 100% test and burn-in of their High Bandwidth Flash memory devices to be used in mission critical applications such as AI LLM, inference, and for automotive and industrial robotics applicationslWe see the NAND Flash market as a key new market opportunity for our systems and WaferPaks, with long term potential to also move into DRAM wafer level test and burn-in Multi-WaferTest & Burn-In System(Shown with Integrated WaferPak Aligner) XP
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24 Relative Size of Targeted Semiconductor Device MarketsThese are relative annual revenues of these semiconductor devices. Historically, annual capital spend on test ranges from 2% to 5% of the device annual revenue. Package Part Production Win Wafer Level Production Win Wafer Level Production Target Estimated market sizes based on third party sources and Aehr estimates.Silicon PhotonicsSilicon Carbide(SiC)Gallium Nitride(GaN) Flash DRAMAI Processors Relative Revenue of Semiconductor Device Market2024 & 2030 2024 Silicon PhotonicsSilicon Carbide (SiC)Gallium Nitride (GaN)Flash DRAMAI Processors Relative Revenue of Semiconductor Device Market2024 & 2030 20242030
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25 Testing without CompromiseReliability, Stress, and DFT Testing without compromiselSolutions for packaged parts, modules, panels, or wafers allow testing at optimal process pointlConfirm which devices received desired test with per device measurements, monitoring, & feedbackl100% traceability with die location (wafer) or device ID read back (module) and electronic tracking ensures knowledge of “good” devices lThermal range, uniformity, and capacity permit reduced test times & confidence in target test conditionslVast system resources allow for minimal sharing (higher sample size, higher yields, fewer hostage failures)lEconomical solutions and customizations allow required testing to be performed at the lowest cost
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Aehr Test Confidential Setting the Test Standard for TomorrowSetting the Test Standard for TomorrowNovember 2025Nasdaq: AEHR