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November 8 , 2021 AMD AMD Unveils Workload - Tailored Innovations and Products at The Accelerated Data Center Premiere - AMD launches AMD Instinct ™ M1200 series accelerators , previews 3rd Gen AMD EPYC ™ processors with AMD 3D V - Cache , and provides new details on expanded set of next - generation EPYCTM processors powered by " Zen 4 " and " Zen 4c " CPU cores - Meta adopts EPYC ™ CPUs for its data center - SANTA CLARA , Calif . , Nov. 08 , 2021 ( GLOBE NEWSWIRE ) -- AMD ( NASDAQ : AMD ) held the virtual Accelerated Data Center Premiere , launching the new AMD Instinct ™ MI200 series accelerators , the world's fastest accelerator for high performance computing ( HPC ) and artificial intelligence ( Al ) workloads , and provided a preview of the innovative 3rd Gen AMD EPYC ™ processors with AMD 3D V - Cache . AMD also revealed new information about its next generation " Zen 4 " processor core and announced the new " Zen 4c " processor core , both of which will power future AMD server processors and are designed to extend the company's leadership products for the data center . " We are in a high - performance computing megacycle that is driving demand for more compute to power the services and devices that impact every aspect of our daily lives , " said Dr. Lisa Su , president and CEO , AMD . " We are building significant momentum in the data center with our leadership product portfolio , including Meta's adoption of AMD EPYC and the buildout of Frontier , the first U.S. exascale supercomputer which will be powered by EPYC and AMD Instinct processors . In addition , today we announced a breadth of new products that build on that momentum in next - generation EPYC processors with new innovations in design , leadership , 3D packaging technology , and 5 nm high - performance manufacturing to further extend our leadership for cloud , enterprise and HPC customers . " Meta Adopts EPYC CPUs [ 03:09 - 05:29 ] AMD announced Meta is the latest major hyperscale cloud company that has adopted AMD EPYC CPUs . AMD and Meta worked together to define an open , cloud - scale , single - socket server designed for performance and power efficiency , based on the 3rd Gen EPYC processor . Further details will be discussed at the Open Compute Global Summit later this week . Advanced Packaging Driving Data Center Performance [ 05:35 - 18:00 ] AMD previewed the use of innovative 3D chiplet packaging technology in the data center with the first server CPU using high - performance 3D die stacking . The 3rd Gen AMD EPYC processors with AMD 3D V - Cache , codenamed “ Milan - X , ” represents an innovative step forward in CPU design and packaging , and will offer a 50 % average performance uplift across targeted technical computing workloads .