Page 1

EX - 99.1 2 d199788dex991.htm EX - 99.1 intel . Intel Corporation 2200 Mission College Blvd. Santa Clara , CA 95054-1549 NEWS HIGHLIGHTS Intel Accelerates Process and Packaging Innovations Annual cadence of innovations drives leadership from silicon to system . News Release Exhibit 99.1 Roadmap of process and packaging innovations to power next wave of products through 2025 and beyond Two breakthrough process technologies : Ribbon FET , Intel's first new transistor architecture in more than a decade , and PowerVia , an industry - first for backside power delivery Continued leadership in advanced 3D packaging innovations with Foveros Omni and Foveros Direct New node naming to create consistent framework , more accurate view of process nodes for customers and the industry as Intel enters the angstrom era of semiconductors Strong momentum for Intel Foundry Services ( IFS ) with first customer announcements SANTA CLARA , Calif . , July 26 , 2021 - Intel Corporation today revealed one of the most detailed process and packaging technology roadmaps the company has ever provided , showcasing a series of foundational innovations that will power products through 2025 and beyond . In addition to announcing Ribbon FET , its first new transistor architecture in more than a decade , and PowerVia , an industry - first new backside power delivery method , the company highlighted its planned swift adoption of next - generation extreme ultraviolet lithography ( EUV ) , referred to as High Numerical Aperture ( High NA ) EUV . Intel is positioned to receive the first High NA EUV production tool in the industry . " Building on Intel's unquestioned leadership in advanced packaging , we are accelerating our innovation roadmap to ensure we are on a clear path to process performance leadership by 2025 , " Intel CEO Pat Gelsinger said during the global " Intel Accelerated " 1 webcast . " We are leveraging our unparalleled pipeline of innovation to deliver technology advances from the transistor up to the system level . Until the periodic table is exhausted , we will be relentless in our pursuit of Moore's Law and our path to innovate with the magic of silicon . " The industry has long recognized that traditional nanometer - based process node naming stopped matching the actual gate - length metric in 1997. Today , Intel introduced a new naming structure for its process nodes , creating a clear and consistent framework to give customers a more accurate view of process nodes across the industry . This clarity is more important than ever with the launch of Intel Foundry Services . " The innovations unveiled today will not only enable Intel's product roadmap ; they will also be critical for our foundry customers , " Gelsinger said . " The interest in IFS has been strong and I'm thrilled that today we announced our first two major customers . IFS is off to the races ! " 1 https://www.intel.com/content/www/us/en/newsroom/resources/press-kit-accelerated-event-2021.html - more -